公开(公告)号：US08148828B2

公开(公告)日：2012-04-03

申请号：US12604680

申请日：2009-10-23

Applicant: Dong-Woo Shin ,  Seong-Chan Han ,  Sun-Kyu Hwang ,  Hyun-Jong Oh ,  Nam-Yong Oh

Inventor： Dong-Woo Shin ,  Seong-Chan Han ,  Sun-Kyu Hwang ,  Hyun-Jong Oh ,  Nam-Yong Oh

IPC: H01L23/48 ,  H01L23/34

CPC classification number: H01L23/24 ,  H01L25/105 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/1005 ,  H01L2225/1058 ,  H01L2924/00014 ,  H05K3/284 ,  H05K2201/10515 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/1316 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A semiconductor packaging device is provided. Semiconductor package groups, a side retainer wall, and a filling layer may be located on a base plate. The side retainer wall may be located around the semiconductor package groups. The filling layer may be located between the side retainer wall and the semiconductor package groups.

Abstract translation: 提供半导体封装装置。 半导体封装组，侧保持器壁和填充层可以位于基板上。 侧保持器壁可以位于半导体封装组周围。 填充层可以位于侧保持器壁和半导体封装组之间。

公开(公告)号：US20090310313A1

公开(公告)日：2009-12-17

申请号：US12457522

申请日：2009-06-15

Applicant: Seong-chan HAN ,  Dong-woo SHIN ,  Hyun-jong OH ,  Nam-yong OH

Inventor： Seong-chan HAN ,  Dong-woo SHIN ,  Hyun-jong OH ,  Nam-yong OH

IPC: H05K7/20 ,  H05K7/10

CPC classification number: H05K1/0271 ,  H01L2924/0002 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/0133 ,  H05K2201/10159 ,  H05K2201/10265 ,  H05K2201/10734 ,  H01L2924/00

Abstract: A semiconductor module including a module body and a shock absorbing member on an exposed surface of the module body is provided. The module body may include at least one semiconductor package on a substrate and the exposed surface of the module body may include exposed surfaces of the substrate and the at least one semiconductor package. In accordance with example embodiments, the module body may also include a heat transfer member on the at least one semiconductor package and an exposed surface of the module body may include an exposed surface of the heat transfer member.

Abstract translation: 提供了一种半导体模块，其包括在模块主体的暴露表面上的模块体和减震构件。 模块体可以包括在衬底上的至少一个半导体封装，并且模块体的暴露表面可以包括衬底和至少一个半导体封装的暴露表面。 根据示例实施例，模块主体还可以在至少一个半导体封装上包括传热构件，并且模块主体的暴露表面可以包括传热构件的暴露表面。

公开(公告)号：US20060283009A1

公开(公告)日：2006-12-21

申请号：US11452902

申请日：2006-06-15

Applicant: Dong-Woo Shin ,  Byong-Kun Bae ,  Nam-Yong Oh ,  Dong-Chun Lee ,  Seong-Chan Han ,  Sun-Kyu Hwang

Inventor： Dong-Woo Shin ,  Byong-Kun Bae ,  Nam-Yong Oh ,  Dong-Chun Lee ,  Seong-Chan Han ,  Sun-Kyu Hwang

IPC: B23P19/00

CPC classification number: H05K13/0417 ,  H05K13/0409 ,  H05K13/041 ,  Y10T29/49131 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191 ,  Y10T29/53261

Abstract: An electronic component mounting apparatus that includes a demagnetizer used to demagnetize a head nozzle, and a method for demagnetizing an electronic component apparatus. The method may include setting conditions, mounting electronic components, and demagnetizing a head nozzle of the electronic component mounting apparatus based on the conditions.

Abstract translation: 一种电子部件安装装置，包括用于使头部喷嘴退磁的去磁器，以及使电子部件装置退磁的方法。 该方法可以基于条件来设置条件，安装电子部件，以及使电子部件安装装置的头部喷嘴退磁。

公开(公告)号：US08070048B2

公开(公告)日：2011-12-06

申请号：US12881439

申请日：2010-09-14

Applicant: Nam-Yong Oh ,  Seong-Chan Han ,  Jae-Young Kim ,  Jae-Hoon Choi

Inventor： Nam-Yong Oh ,  Seong-Chan Han ,  Jae-Young Kim ,  Jae-Hoon Choi

IPC: B23K1/00

CPC classification number: B23K1/0016 ,  B23K3/0623 ,  H01L21/4853 ,  H01L23/13 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/98 ,  H01L2224/13017 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13186 ,  H01L2224/13562 ,  H01L2224/13564 ,  H01L2224/13566 ,  H01L2224/16058 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/8102 ,  H01L2224/81193 ,  H01L2224/81232 ,  H01L2224/81359 ,  H01L2224/81399 ,  H01L2224/8192 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H05K3/225 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2201/10734 ,  H05K2203/1163 ,  H05K2203/176 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/01083

Abstract: In a method of attaching a solder ball, a first material is coated on a solder ball. A second material is coated on a pad of a substrate where the solder ball is to be attached to exothermically react with the first material. The solder ball makes contact with the pad such that the first material and the second material exothermically react with each other to release heat to adhere the solder ball to the pad using the heat.

Abstract translation: 在焊球附着的方法中，将第一材料涂覆在焊球上。 将第二材料涂覆在要焊接焊锡球的基板的焊盘上以与第一材料放热反应。 焊球与焊盘接触，使得第一材料和第二材料彼此放热反应以释放热量，以使用热将焊球粘附到焊盘。

公开(公告)号：US20090014503A1

公开(公告)日：2009-01-15

申请号：US12217862

申请日：2008-07-09

Applicant: Jae-Hoon Choi ,  Seong-Chan Han ,  Se-Hyung Ryu ,  Nam-Yong Oh

Inventor： Jae-Hoon Choi ,  Seong-Chan Han ,  Se-Hyung Ryu ,  Nam-Yong Oh

IPC: B23K1/005 ,  B23K3/04 ,  B23K1/00

CPC classification number: B23K1/008 ,  B23K2101/40

Abstract: There are provided reflow apparatuses and a methods therefor. In some embodiments, a reflow apparatus includes a first heating unit capable of heating a solder on a substrate up to just below before a melting point of the solder at ambient pressure such that the solder on the substrate is melted and electronic components mounted on the substrate are then soldered to the substrate; and a second heating unit connected to the first heating unit, the second heating unit capable of heating the solder on the substrate heated in the first heating unit through at least a portion of a solder melting temperature range in a vacuum state.

Abstract translation: 提供回流装置及其方法。 在一些实施例中，回流装置包括第一加热单元，其能够在环境压力下在焊料的熔点之前将衬底上的焊料加热到刚刚下面，使得衬底上的焊料熔化并将电子部件安装在衬底上 然后被焊接到基材上; 以及连接到第一加热单元的第二加热单元，所述第二加热单元能够通过在真空状态下的焊料熔化温度范围的至少一部分来加热在第一加热单元中加热的基板上的焊料。

公开(公告)号：US08053889B2

公开(公告)日：2011-11-08

申请号：US12457522

申请日：2009-06-15

Applicant: Seong-chan Han ,  Dong-woo Shin ,  Hyun-jong Oh ,  Nam-yong Oh

Inventor： Seong-chan Han ,  Dong-woo Shin ,  Hyun-jong Oh ,  Nam-yong Oh

IPC: H01L23/34 ,  H05K7/10

CPC classification number: H05K1/0271 ,  H01L2924/0002 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/0133 ,  H05K2201/10159 ,  H05K2201/10265 ,  H05K2201/10734 ,  H01L2924/00

Abstract: A semiconductor module including a module body and a shock absorbing member on an exposed surface of the module body is provided. The module body may include at least one semiconductor package on a substrate and the exposed surface of the module body may include exposed surfaces of the substrate and the at least one semiconductor package. In accordance with example embodiments, the module body may also include a heat transfer member on the at least one semiconductor package and an exposed surface of the module body may include an exposed surface of the heat transfer member.

Abstract translation: 提供了一种半导体模块，其包括在模块主体的暴露表面上的模块体和减震构件。 模块体可以包括在衬底上的至少一个半导体封装，并且模块体的暴露表面可以包括衬底和至少一个半导体封装的暴露表面。 根据示例实施例，模块主体还可以在至少一个半导体封装上包括传热构件，并且模块主体的暴露表面可以包括传热构件的暴露表面。

公开(公告)号：US20110068151A1

公开(公告)日：2011-03-24

申请号：US12881439

申请日：2010-09-14

Applicant: Nam-Yong OH ,  Seong-Chan Han ,  Jae-Young Kim ,  Jae-Hoon Choi

Inventor： Nam-Yong OH ,  Seong-Chan Han ,  Jae-Young Kim ,  Jae-Hoon Choi

IPC: B23K31/02 ,  B23K1/018

CPC classification number: B23K1/0016 ,  B23K3/0623 ,  H01L21/4853 ,  H01L23/13 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/98 ,  H01L2224/13017 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13186 ,  H01L2224/13562 ,  H01L2224/13564 ,  H01L2224/13566 ,  H01L2224/16058 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/8102 ,  H01L2224/81193 ,  H01L2224/81232 ,  H01L2224/81359 ,  H01L2224/81399 ,  H01L2224/8192 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H05K3/225 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2201/10734 ,  H05K2203/1163 ,  H05K2203/176 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/01083

Abstract: In a method of attaching a solder ball, a first material is coated on a solder ball. A second material is coated on a pad of a substrate where the solder ball is to be attached to exothermically react with the first material. The solder ball makes contact with the pad such that the first material and the second material exothermically react with each other to release heat to adhere the solder ball to the pad using the heat.

Abstract translation: 在焊球附着的方法中，将第一材料涂覆在焊球上。 将第二材料涂覆在要焊接焊锡球的基板的焊盘上以与第一材料放热反应。 焊球与焊盘接触，使得第一材料和第二材料彼此放热反应以释放热量，以使用热将焊球粘附到焊盘。