公开(公告)号：US20250116001A1

公开(公告)日：2025-04-10

申请号：US18482560

申请日：2023-10-06

Applicant: Applied Materials, Inc.

Inventor： Allison Yau ,  Manoj Kumar Jana ,  Wen-Shan Lin ,  Zhiling Dun ,  Xinhai Han ,  Deenesh Padhi ,  Jian Li ,  Yuanchang Chen ,  Wenhao Zhang ,  Edward P. Hammond ,  Alexander V. Garachtchenko ,  Ganesh Balasubramanian ,  Juan Carlos Rocha-Alvarez ,  Sathya Ganta

IPC: C23C16/458 ,  C23C16/34 ,  C23C16/40 ,  H01J37/32

Abstract: A semiconductor processing chamber may include a pedestal configured to support a substrate during a plasma-enhanced chemical-vapor deposition (PECVD) process that forms a film on a surface of the substrate. The chamber may also include one or more internal meshes embedded in the pedestal. The one or more internal meshes may be configured to deliver radio-frequency (RF) power to a plasma in the semiconductor processing chamber during the PECVD process. An outer diameter of the one or more internal meshes may be less that a diameter of the substrate. The chamber may further include an RF source configured to deliver the RF power to the one more internal meshes. This configuration may reduce arcing within the processing chamber.

公开(公告)号：US12131934B2

公开(公告)日：2024-10-29

申请号：US17063334

申请日：2020-10-05

Applicant: Applied Materials, Inc.

Inventor： Katherine Woo ,  Paul L. Brillhart ,  Jian Li ,  Shinnosuke Kawaguchi ,  David W. Groechel ,  Dorothea Buechel-Rimmel ,  Juan Carlos Rocha-Alvarez ,  Paul E. Fisher ,  Chidambara A. Ramalingam ,  Joseph J. Farah

IPC: H01L21/67 ,  G01L9/08 ,  H01J37/32 ,  H01L21/68 ,  H04Q9/00 ,  H01L21/683

CPC classification number: H01L21/68 ,  G01L9/08 ,  H01J37/32724 ,  H04Q9/00 ,  H01J2237/20264 ,  H01L21/67103 ,  H01L21/6833 ,  H01L21/6838

Abstract: Exemplary semiconductor processing systems may include a chamber body including sidewalls and a base. The chamber body may define an interior volume. The systems may include a substrate support extending through the base of the chamber body. The substrate support may be configured to support a substrate within the interior volume. The systems may include a faceplate positioned within the interior volume of the chamber body. The faceplate may define a plurality of apertures through the faceplate. The systems may include a leveling apparatus seated on the substrate support. The leveling apparatus may include a plurality of piezoelectric pressure sensors.

公开(公告)号：US11901209B2

公开(公告)日：2024-02-13

申请号：US18172217

申请日：2023-02-21

Applicant: Applied Materials, Inc.

Inventor： Jian Li ,  Zheng J. Ye ,  Dmitry A. Dzilno ,  Juan Carlos Rocha-Alvarez

IPC: H01T23/00 ,  H01L21/683 ,  H01L21/67 ,  H01J37/32

CPC classification number: H01L21/6833 ,  H01J37/32724 ,  H01L21/67103 ,  H01J2237/2007 ,  H01J2237/332

Abstract: Exemplary support assemblies may include an electrostatic chuck body defining a substrate support surface. The substrate support assemblies may include a support stem coupled with the electrostatic chuck body. The substrate support assemblies may include a heater embedded within the electrostatic chuck body. The substrate support assemblies may include a first bipolar electrode embedded within the electrostatic chuck body between the heater and the substrate support surface. The first bipolar electrode may include at least two separated mesh sections, with each mesh section characterized by a circular sector shape. The substrate support assemblies may include a second bipolar electrode embedded within the electrostatic chuck body between the heater and the substrate support surface. The second bipolar electrode may include a continuous mesh extending through the at least two separated mesh sections of the first bipolar electrode.

公开(公告)号：US20230207372A1

公开(公告)日：2023-06-29

申请号：US18176187

申请日：2023-02-28

Applicant: Applied Materials, Inc.

Inventor： Jian Li ,  Juan Carlos Rocha-Alvarez ,  Dmitry A. Dzilno

IPC: H01L21/683 ,  H01J37/32 ,  H01L21/687

CPC classification number: H01L21/6833 ,  H01J37/32082 ,  H01L21/68714

Abstract: A chucking system reduces differences in chucking forces that are applied by two electrodes of an electrostatic chuck, to a substrate disposed atop the chuck. Initial chucking voltages are applied to each of two electrodes, and an initial current provided to at least a first electrode of the two electrodes is measured. A process is initiated that affects a DC voltage of the substrate, then a modified current provided to at least the first electrode is measured. A modified chucking voltage for a selected one of the two electrodes is determined that will reduce chucking force imbalance across the substrate based at least on the initial current and the modified current. The modified chucking voltage is then provided to the selected one of the two electrodes.

公开(公告)号：US11501993B2

公开(公告)日：2022-11-15

申请号：US16936042

申请日：2020-07-22

Applicant: Applied Materials, Inc.

Inventor： Jian Li ,  Juan Carlos Rocha-Alvarez ,  Zheng John Ye ,  Daemian Raj Benjamin Raj ,  Shailendra Srivastava ,  Xinhai Han ,  Deenesh Padhi ,  Kesong Hu ,  Chuan Ying Wang

IPC: H01L21/683 ,  H01L21/50 ,  H02N13/00 ,  H01L21/60

Abstract: Exemplary support assemblies may include an electrostatic chuck body defining a substrate support surface. The assemblies may include a support stem coupled with the electrostatic chuck body. The assemblies may include a heater embedded within the electrostatic chuck body. The assemblies may also include an electrode embedded within the electrostatic chuck body between the heater and the substrate support surface. The substrate support assemblies may be characterized by a leakage current through the electrostatic chuck body of less than or about 4 mA at a temperature of greater than or about 500° C. and a voltage of greater than or about 600 V.

公开(公告)号：US20220130704A1

公开(公告)日：2022-04-28

申请号：US17078542

申请日：2020-10-23

Applicant: Applied Materials, Inc.

Inventor： Jian Li ,  Dmitry A. Dzilno ,  Juan Carlos Rocha-Alvarez ,  Zheng J. Ye ,  Paul L. Brillhart

IPC: H01L21/683 ,  H01L21/687 ,  H01J37/32

Abstract: Exemplary support assemblies may include an electrostatic chuck body defining a support surface that defines a substrate seat. The assemblies may include a support stem coupled with the chuck body. The assemblies may include a heater embedded within the chuck body. The assemblies may include a first bipolar electrode embedded within the electrostatic chuck body between the heater and support surface. The assemblies may include a second bipolar electrode embedded within the chuck body between the heater and support surface. Peripheral edges of one or both of the first and second bipolar electrodes may extend beyond an outer periphery of the seat. The assemblies may include an RF power supply coupled with the first and second bipolar electrodes. The assemblies may include a first floating DC power supply coupled with the first bipolar electrode. The assemblies may include a second floating DC power supply coupled with the second bipolar electrode.

公开(公告)号：US20220122874A1

公开(公告)日：2022-04-21

申请号：US17076178

申请日：2020-10-21

Applicant: Applied Materials, Inc.

Inventor： Jian Li ,  Juan Carlos Rocha-Alvarez ,  Dmitry A. Dzilno

IPC: H01L21/683 ,  H01L21/687 ,  H01J37/32

Abstract: A method reduces differences in chucking forces that are applied by two electrodes of an electrostatic chuck, to a substrate disposed atop the chuck. The method includes providing initial chucking voltages to each of the two electrodes, and measuring an initial current provided to at least a first electrode of the two electrodes. The method further includes initiating a process that affects a DC voltage of the substrate, then measuring a modified current provided to at least the first electrode, and determining, based at least on the initial current and the modified current, a modified chucking voltage for a selected one of the two electrodes, that will reduce chucking force imbalance across the substrate. The method also includes providing the modified chucking voltage to the selected one of the two electrodes.

公开(公告)号：US20220122817A1

公开(公告)日：2022-04-21

申请号：US17071515

申请日：2020-10-15

Applicant: Applied Materials, Inc.

Inventor： Paul L. Brillhart ,  Jian Li ,  Katherine Woo ,  Matthew Miller ,  Shinnosuke Kawaguchi

IPC: H01J37/32 ,  C23C14/50 ,  C23C16/458

Abstract: Exemplary support assemblies may include an electrostatic chuck body defining a substrate support surface. The assemblies may include a support stem coupled with the electrostatic chuck body. The assemblies may include a heater embedded within the electrostatic chuck body. The assemblies may include an electrode embedded within the electrostatic chuck body between the heater and the substrate support surface. The assemblies may include a power transmission rod coupled with the electrode. The power transmission rod may include a material characterized by a coefficient of thermal expansion of less than or about 10×10−6/° C.

公开(公告)号：US20210287924A1

公开(公告)日：2021-09-16

申请号：US16820205

申请日：2020-03-16

Applicant: Applied Materials, Inc,

Inventor： Jian Li ,  Paul L. Brillhart ,  Juan Carlos Rocha-Alvarez ,  Abdul Aziz Khaja ,  Vinay K. Prabhakar ,  Kwangduk Douglas Lee ,  Chidambara A. Ramalingam ,  Venkata Sharat Chandra Parimi

IPC: H01L21/683 ,  H01L21/324 ,  H01L21/67 ,  H01J37/32 ,  C23C16/50 ,  C23C16/458 ,  C23C16/46

Abstract: Exemplary support assemblies may include an electrostatic chuck body defining a substrate support surface. The substrate support assemblies may include a support stem coupled with the electrostatic chuck body. The substrate support assemblies may include a heater embedded within the electrostatic chuck body. The substrate support assemblies may include an electrode embedded within the electrostatic chuck body between the heater and the substrate support surface. The substrate support assembly may include a ceramic material characterized by a grain size of less than or about 5 μm.

公开(公告)号：US20250118578A1

公开(公告)日：2025-04-10

申请号：US18484165

申请日：2023-10-10

Applicant: Applied Materials, Inc.

Inventor： Ajith Karonnan Ramapurath ,  Jian Li ,  Ganesh Balasubramanian ,  Juan Carlos Rocha-Alvarez

IPC: H01L21/67 ,  H01J37/32 ,  H01L21/66 ,  H01L21/683

Abstract: Exemplary substrate support assemblies may include a support plate that comprises a substrate support surface. The assemblies may include a support stem coupled with the support plate. A channel may be defined through at least a portion of a length of the support stem and extends through the substrate support surface. A temperature sensor assembly may be disposed within the channel. The temperature sensor assembly may include a light pipe disposed within the channel such that a top end of the light pipe extending through at least a portion of the support plate. The temperature sensor assembly may include a sensor that is coupled with a bottom end of the light pipe.