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公开(公告)号：US09758364B2
公开(公告)日：2017-09-12
申请号：US15162027
申请日：2016-05-23
Applicant: Honeywell International Inc.
Inventor： Gordon A. Shaw , Daniel Baseman , Chris Finn , Jim G. Hunter
CPC classification number: B81B3/0021 , B81B2201/0292 , B81B2203/0118 , B81B2207/015 , B81B2207/07 , B81C1/0015 , B81C2201/013 , B81C2201/0197
Abstract: Microstructure plating systems and methods are described herein. One method includes depositing a plating-resistant material between a microstructure and a bonding layer, wherein the microstructure comprises a plating process base material and immersing the microstructure in a plating solution.
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公开(公告)号：US20140260710A1
公开(公告)日：2014-09-18
申请号：US13839923
申请日：2013-03-15
Applicant: HONEYWELL INTERNATIONAL INC.
Inventor： Gordon A. Shaw , Daniel Baseman , Chris Finn , Jim G. Hunter
CPC classification number: B81B3/0021 , B81B2201/0292 , B81B2203/0118 , B81B2207/015 , B81B2207/07 , B81C1/0015 , B81C2201/013 , B81C2201/0197
Abstract: Microstructure plating systems and methods are described herein. One method includes depositing a plating-resistant material between a microstructure and a bonding layer, wherein the microstructure comprises a plating process base material and immersing the microstructure in a plating solution.
Abstract translation: 本文描述了微结构电镀系统和方法。 一种方法包括在微结构和结合层之间沉积耐镀材料，其中微结构包括电镀工艺基材并将微结构浸入电镀液中。
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公开(公告)号：US20170001856A1
公开(公告)日：2017-01-05
申请号：US15162027
申请日：2016-05-23
Applicant: Honeywell International Inc.
Inventor： Gordon A. Shaw , Daniel Baseman , Chris Finn , Jim G. Hunter
CPC classification number: B81B3/0021 , B81B2201/0292 , B81B2203/0118 , B81B2207/015 , B81B2207/07 , B81C1/0015 , B81C2201/013 , B81C2201/0197
Abstract: Microstructure plating systems and methods are described herein. One method includes depositing a plating-resistant material between a microstructure and a bonding layer, wherein the microstructure comprises a plating process base material and immersing the microstructure in a plating solution.
Abstract translation: 本文描述了微结构电镀系统和方法。 一种方法包括在微结构和结合层之间沉积耐镀材料，其中微结构包括电镀工艺基材并将微结构浸入电镀液中。
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公开(公告)号：US09371222B2
公开(公告)日：2016-06-21
申请号：US13839923
申请日：2013-03-15
Applicant: Honeywell International Inc.
Inventor： Gordon A. Shaw , Daniel Baseman , Chris Finn , Jim G. Hunter
CPC classification number: B81B3/0021 , B81B2201/0292 , B81B2203/0118 , B81B2207/015 , B81B2207/07 , B81C1/0015 , B81C2201/013 , B81C2201/0197
Abstract: Microstructure plating systems and methods are described herein. One method includes depositing a plating-resistant material between a microstructure and a bonding layer, wherein the microstructure comprises a plating process base material and immersing the microstructure in a plating solution.
Abstract translation: 本文描述了微结构电镀系统和方法。 一种方法包括在微结构和结合层之间沉积耐镀材料，其中微结构包括电镀工艺基材并将微结构浸入电镀液中。
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