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公开(公告)号：US09758364B2
公开(公告)日：2017-09-12
申请号：US15162027
申请日：2016-05-23
Applicant: Honeywell International Inc.
Inventor： Gordon A. Shaw , Daniel Baseman , Chris Finn , Jim G. Hunter
CPC classification number: B81B3/0021 , B81B2201/0292 , B81B2203/0118 , B81B2207/015 , B81B2207/07 , B81C1/0015 , B81C2201/013 , B81C2201/0197
Abstract: Microstructure plating systems and methods are described herein. One method includes depositing a plating-resistant material between a microstructure and a bonding layer, wherein the microstructure comprises a plating process base material and immersing the microstructure in a plating solution.
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Patent Agency Ranking
公开(公告)号：US20170001856A1
公开(公告)日：2017-01-05
申请号：US15162027
申请日：2016-05-23
Applicant: Honeywell International Inc.
Inventor： Gordon A. Shaw , Daniel Baseman , Chris Finn , Jim G. Hunter
CPC classification number: B81B3/0021 , B81B2201/0292 , B81B2203/0118 , B81B2207/015 , B81B2207/07 , B81C1/0015 , B81C2201/013 , B81C2201/0197
Abstract: Microstructure plating systems and methods are described herein. One method includes depositing a plating-resistant material between a microstructure and a bonding layer, wherein the microstructure comprises a plating process base material and immersing the microstructure in a plating solution.
Abstract translation: 本文描述了微结构电镀系统和方法。 一种方法包括在微结构和结合层之间沉积耐镀材料，其中微结构包括电镀工艺基材并将微结构浸入电镀液中。
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公开(公告)号：US09371222B2
公开(公告)日：2016-06-21
申请号：US13839923
申请日：2013-03-15
Applicant: Honeywell International Inc.
Inventor： Gordon A. Shaw , Daniel Baseman , Chris Finn , Jim G. Hunter
CPC classification number: B81B3/0021 , B81B2201/0292 , B81B2203/0118 , B81B2207/015 , B81B2207/07 , B81C1/0015 , B81C2201/013 , B81C2201/0197
Abstract: Microstructure plating systems and methods are described herein. One method includes depositing a plating-resistant material between a microstructure and a bonding layer, wherein the microstructure comprises a plating process base material and immersing the microstructure in a plating solution.
Abstract translation: 本文描述了微结构电镀系统和方法。 一种方法包括在微结构和结合层之间沉积耐镀材料，其中微结构包括电镀工艺基材并将微结构浸入电镀液中。
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4.发明授权Programmable electrical fuse with temperature gradient between anode and cathode 有权可编程电气保险丝，阳极和阴极之间具有温度梯度公开(公告)号：US08901702B1
公开(公告)日：2014-12-02
申请号：US13891280
申请日：2013-05-10
Applicant: Honeywell International Inc.
Inventor： Eric E. Vogt , Paul S. Fechner , Gordon A. Shaw
IPC: H01L29/00 , H01L21/768 , H01L23/525
CPC classification number: H01L23/5256 , H01L23/53271 , H01L2924/0002 , H01L2924/00
Abstract: In some examples, a programmable electrical fuse includes at least one structural feature that increases a thermal gradient between an anode and a cathode of the programmable electrical fuse. For example, a device may include a semiconductor substrate, an electrically insulating layer overlying the semiconductor substrate, and a programmable electrical fuse overlying a portion of the electrically insulating layer. The programmable electrical fuse may include a cathode, an anode, and a conductor link connecting the cathode and the anode. The electrically insulating layer may define a first thickness between the semiconductor substrate and the cathode and a second thickness between the semiconductor substrate and the anode, and the first thickness being less than the second thickness.
Abstract translation: 在一些示例中，可编程电熔丝包括增加可编程电熔丝的阳极和阴极之间的热梯度的至少一个结构特征。 例如，器件可以包括半导体衬底，覆盖半导体衬底的电绝缘层和覆盖电绝缘层的一部分的可编程电熔丝。 可编程电熔丝可以包括阴极，阳极和连接阴极和阳极的导体连接。 电绝缘层可以限定半导体衬底和阴极之间的第一厚度以及半导体衬底和阳极之间的第二厚度，并且第一厚度小于第二厚度。
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公开(公告)号：US20140260710A1
公开(公告)日：2014-09-18
申请号：US13839923
申请日：2013-03-15
Applicant: HONEYWELL INTERNATIONAL INC.
Inventor： Gordon A. Shaw , Daniel Baseman , Chris Finn , Jim G. Hunter
CPC classification number: B81B3/0021 , B81B2201/0292 , B81B2203/0118 , B81B2207/015 , B81B2207/07 , B81C1/0015 , B81C2201/013 , B81C2201/0197
Abstract: Microstructure plating systems and methods are described herein. One method includes depositing a plating-resistant material between a microstructure and a bonding layer, wherein the microstructure comprises a plating process base material and immersing the microstructure in a plating solution.
Abstract translation: 本文描述了微结构电镀系统和方法。 一种方法包括在微结构和结合层之间沉积耐镀材料，其中微结构包括电镀工艺基材并将微结构浸入电镀液中。
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6.发明申请PROGRAMMABLE ELECTRICAL FUSE WITH TEMPERATURE GRADIENT BETWEEN ANODE AND CATHODE 有权阳极和阴极之间温度梯度的可编程电气保险丝公开(公告)号：US20140332922A1
公开(公告)日：2014-11-13
申请号：US13891280
申请日：2013-05-10
Applicant: HONEYWELL INTERNATIONAL INC.
Inventor： Eric E. Vogt , Paul S. Fechner , Gordon A. Shaw
IPC: H01L23/525 , H01L21/768
CPC classification number: H01L23/5256 , H01L23/53271 , H01L2924/0002 , H01L2924/00
Abstract: In some examples, a programmable electrical fuse includes at least one structural feature that increases a thermal gradient between an anode and a cathode of the programmable electrical fuse. For example, a device may include a semiconductor substrate, an electrically insulating layer overlying the semiconductor substrate, and a programmable electrical fuse overlying a portion of the electrically insulating layer. The programmable electrical fuse may include a cathode, an anode, and a conductor link connecting the cathode and the anode. The electrically insulating layer may define a first thickness between the semiconductor substrate and the cathode and a second thickness between the semiconductor substrate and the anode, and the first thickness being less than the second thickness.
Abstract translation: 在一些示例中，可编程电熔丝包括增加可编程电熔丝的阳极和阴极之间的热梯度的至少一个结构特征。 例如，器件可以包括半导体衬底，覆盖半导体衬底的电绝缘层和覆盖电绝缘层的一部分的可编程电熔丝。 可编程电熔丝可以包括阴极，阳极和连接阴极和阳极的导体连接。 电绝缘层可以限定半导体衬底和阴极之间的第一厚度以及半导体衬底和阳极之间的第二厚度，并且第一厚度小于第二厚度。
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