Abstract:
A method for forming a pressure sensor includes forming a base of a sapphire material, the base including a cavity formed therein; forming a sapphire membrane on top of the base and over the cavity; forming a lower electrode on top of the membrane; forming a piezoelectric material layer on an upper surface of the lower electrode, the piezoelectric material layer being formed of aluminum nitride (AIN); and forming at least one upper electrode on an upper surface of the piezoelectric material layer.
Abstract:
A method for forming a pressure sensor includes forming a base of a sapphire material, the base including a cavity formed therein; forming a sapphire membrane on top of the base and over the cavity; forming a lower electrode on top of the membrane; forming a piezoelectric material layer on an upper surface of the lower electrode, the piezoelectric material layer being formed of aluminum nitride (AIN); and forming at least one upper electrode on an upper surface of the piezoelectric material layer.
Abstract:
A capacitive pressure sensor includes a substrate wafer and a diaphragm wafer. The substrate wafer defines a substrate recess with a first recess. The diaphragm wafer defines a diaphragm recess with a second recess. The diaphragm wafer is bonded to the substrate wafer such that the substrate and diaphragm recesses form a height differentiated pressure chamber.
Abstract:
A pressure sensor assembly includes a pressure sensor having a pressure sensing transducer connected to a plurality of electrode pins via a plurality of electrode pads disposed on the transducer, an inner casing configured to hold the pressure sensing transducer including a plurality of inner casing electrode pin channels having the electrode pins disposed therein. The pressure sensor further includes an outer casing holding the inner casing therein having a capsule header with a plurality of capsule header electrode pin channels defined therein which can include a ceramic seal disposed therein such that the capsule header electrode pin channels engage the electrode pins in an insulating sealed relationship. The outer casing further includes an isolator plate including an isolator plate fluid port defined therein and a pressure isolator disposed on the isolator plate and configured to deflect in response to a change in ambient pressure. The pressure sensor includes a pressure transmitting fluid disposed in the fluid volume.
Abstract:
A pressure sensor assembly includes a pressure sensor having a pressure sensing transducer connected to a plurality of electrode pins via a plurality of electrode pads disposed on the transducer, an inner casing configured to hold the pressure sensing transducer including a plurality of inner casing electrode pin channels having the electrode pins disposed therein. The pressure sensor further includes an outer casing holding the inner casing therein having a capsule header with a plurality of capsule header electrode pin channels defined therein which can include a ceramic seal disposed therein such that the capsule header electrode pin channels engage the electrode pins in an insulating sealed relationship. The outer casing further includes an isolator plate including an isolator plate fluid port defined therein and a pressure isolator disposed on the isolator plate and configured to deflect in response to a change in ambient pressure. The pressure sensor includes a pressure transmitting fluid disposed in the fluid volume.
Abstract:
A capacitive pressure sensor includes a substrate wafer and a diaphragm wafer. The substrate wafer defines a substrate recess with a first recess. The diaphragm wafer defines a diaphragm recess with a second recess. The diaphragm wafer is bonded to the substrate wafer such that the substrate and diaphragm recesses form a height differentiated pressure chamber.