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公开(公告)号：US20250140584A1
公开(公告)日：2025-05-01
申请号：US19003174
申请日：2024-12-27
Applicant: SCREEN Semiconductor Solutions Co., Ltd.
Inventor： Hiroyuki Ogura , Tsuyoshi Mitsuhashi , Yoshiteru Fukutomi , Kenya Morinishi , Yasuo Kawamatsu , Hiromichi Nagashima
IPC: H01L21/67 , B05C9/12 , B05C9/14 , B05C13/00 , B05C13/02 , B05D3/04 , F24F3/167 , G03F7/00 , H01L21/677
Abstract: A substrate treating apparatus for treating substrates includes a plurality of substrate treatment lines arranged vertically for carrying out plural types of treatment on the substrates while transporting the substrates substantially horizontally, and a controller for changing processes of treatment carried out on the substrates for each of the substrate treatment lines. By changing the processes of treatment carried out for the substrates for each substrate treatment line, the processes of treatment carried out for the substrates can be changed for each substrate conveniently. Thus, a plurality of different processes of treatment corresponding to the number of substrate treatment lines can be carried out in parallel for the respective substrates.
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公开(公告)号：US20190221457A1
公开(公告)日：2019-07-18
申请号：US16366437
申请日：2019-03-27
Applicant: SCREEN Semiconductor Solutions Co., Ltd.
Inventor： Yoshiteru Fukutomi , Tsuyoshi Mitsuhashi , Hiroyuki Ogura , Kenya Morinishi , Yasuo Kawamatsu , Hiromichi Nagashima
CPC classification number: H01L21/67178 , B05B14/43 , B05B14/44 , B05C13/00 , B05C13/02 , B05D3/0486 , G03F7/26 , H01L21/67017 , H01L21/6715 , H01L21/67173 , H01L21/67184 , H01L21/67196 , H01L21/67201 , H01L21/67225 , H01L23/34 , H01L2924/0002 , Y10S414/135 , H01L2924/00
Abstract: A substrate treating method for treating substrates with a substrate treating apparatus having an indexer section, a treating section and an interface section includes performing resist film forming treatment in parallel on a plurality of stories provided in the treating section and performing developing treatment in parallel on a plurality of stories provided in the treating section.
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公开(公告)号：US09687874B2
公开(公告)日：2017-06-27
申请号：US14863375
申请日：2015-09-23
Applicant: Screen Semiconductor Solutions Co., Ltd.
Inventor： Hiroyuki Ogura , Tsuyoshi Mitsuhashi , Yoshiteru Fukutomi , Kenya Morinishi , Yasuo Kawamatsu , Hiromichi Nagashima
IPC: B05C11/00 , B05C13/00 , H01L21/306 , H01L21/677 , H01L21/67 , B05C9/12 , B05C11/08 , G03F7/16 , C23C14/56 , B05C13/02
CPC classification number: B05C13/00 , B05C9/12 , B05C11/08 , B05C13/02 , C23C14/568 , G03F7/16 , H01L21/67173 , H01L21/67178 , H01L21/67276 , H01L21/67703 , H01L21/67742 , H01L21/67745 , Y10S414/135
Abstract: A substrate treating apparatus includes a first treating block and a second treating block disposed adjacent to the first treating block. Each of the first treating block and the second treating block include a plurality of stories arranged vertically. Each of the plurality of stories includes treating units for treating substrates and a main transport mechanism for transporting the substrates to and from the treating units. The substrates are transportable between the stories of the first treating block and the stories of the second treating block at same heights as corresponding stories of the first treating block. The substrates are transportable between the stories of the first treating block and the stories of the second treating block at different heights from corresponding stories of the first treating block.
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公开(公告)号：US10290521B2
公开(公告)日：2019-05-14
申请号：US14952657
申请日：2015-11-25
Applicant: SCREEN Semiconductor Solutions Co., Ltd.
Inventor： Yoshiteru Fukutomi , Tsuyoshi Mitsuhashi , Hiroyuki Ogura , Kenya Morinishi , Yasuo Kawamatsu , Hiromichi Nagashima
Abstract: A substrate treating method for treating substrates with a substrate treating apparatus having an indexer section, a treating section and an interface section includes performing resist film forming treatment in parallel on a plurality of stories provided in the treating section and performing developing treatment in parallel on a plurality of stories provided in the treating section.
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公开(公告)号：US12217986B2
公开(公告)日：2025-02-04
申请号：US17145039
申请日：2021-01-08
Applicant: SCREEN Semiconductor Solutions Co., Ltd.
Inventor： Hiroyuki Ogura , Tsuyoshi Mitsuhashi , Yoshiteru Fukutomi , Kenya Morinishi , Yasuo Kawamatsu , Hiromichi Nagashima
IPC: H01L21/677 , B05C9/12 , B05C9/14 , B05C13/00 , G03F7/00 , H01L21/67 , B05C13/02 , B05D3/04 , F24F3/167
Abstract: A substrate treating apparatus for treating substrates includes a plurality of substrate treatment lines arranged vertically for carrying out plural types of treatment on the substrates while transporting the substrates substantially horizontally, and a controller for changing processes of treatment carried out on the substrates for each of the substrate treatment lines. By changing the processes of treatment carried out for the substrates for each substrate treatment line, the processes of treatment carried out for the substrates can be changed for each substrate conveniently. Thus, a plurality of different processes of treatment corresponding to the number of substrate treatment lines can be carried out in parallel for the respective substrates.
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Patent Agency Ranking
公开(公告)号：US20230042033A1
公开(公告)日：2023-02-09
申请号：US17969533
申请日：2022-10-19
Applicant: SCREEN Semiconductor Solutions Co., Ltd.
Inventor： Yoshiteru Fukutomi , Tsuyoshi Mitsuhashi , Hiroyuki Ogura , Kenya Morinishi , Yasuo Kawamatsu , Hiromichi Nagashima
Abstract: A substrate treating method for treating substrates with a substrate treating apparatus having an indexer section, a treating section and an interface section includes performing resist film forming treatment in parallel on a plurality of stories provided in the treating section and performing developing treatment in parallel on a plurality of stories provided in the treating section.
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公开(公告)号：US09703199B2
公开(公告)日：2017-07-11
申请号：US14149026
申请日：2014-01-07
Applicant: SCREEN SEMICONDUCTOR SOLUTIONS CO., LTD.
Inventor： Toru Asano , Yukio Toriyama , Takashi Taguchi , Tsuyoshi Mitsuhashi
CPC classification number: G03F7/30 , H01L21/67028 , H01L21/67034 , H01L21/67051 , H01L21/67178 , H01L21/67225
Abstract: A method of processing a substrate in a substrate processing apparatus that is arranged adjacent to an exposure device and includes first, second and third processing units, includes forming a photosensitive film on the substrate by said first processing unit before exposure processing by said exposure device and applying washing processing to the substrate by supplying a washing liquid to the substrate in said second processing unit after the formation of said photosensitive film and before the exposure processing. The method also includes applying drying processing to the substrate in said second processing unit after the washing processing by said second processing unit and before the exposure processing and applying development processing to the substrate by said third processing unit after the exposure processing. Applying the drying processing to the substrate includes the step of supplying an inert gas onto the substrate, to which the washing liquid is supplied.
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公开(公告)号：US20160079099A1
公开(公告)日：2016-03-17
申请号：US14952657
申请日：2015-11-25
Applicant: SCREEN Semiconductor Solutions Co., Ltd.
Inventor： Yoshiteru Fukutomi , Tsuyoshi Mitsuhashi , Hiroyuki Ogura , Kenya Morinishi , Yasuo Kawamatsu , Hiromichi Nagashima
CPC classification number: H01L21/67178 , B05B14/43 , B05B14/44 , B05C13/00 , B05C13/02 , B05D3/0486 , G03F7/26 , H01L21/67017 , H01L21/6715 , H01L21/67173 , H01L21/67184 , H01L21/67196 , H01L21/67201 , H01L21/67225 , H01L23/34 , H01L2924/0002 , Y10S414/135 , H01L2924/00
Abstract: A substrate treating method for treating substrates with a substrate treating apparatus having an indexer section, a treating section and an interface section includes performing resist film forming treatment in parallel on a plurality of stories provided in the treating section and performing developing treatment in parallel on a plurality of stories provided in the treating section.
Abstract translation: 用具有分度器部分，处理部分和界面部分的基板处理装置处理基板的基板处理方法包括在设置在处理部分中的多个故事层并行地进行抗蚀剂膜形成处理，并且在 在治疗部分设置多个故事。
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9.发明申请MULTI-STORY SUBSTRATE TREATING APPARATUS WITH FLEXIBLE TRANSPORT MECHANISMS AND VERTICALLY DIVIDED TREATING UNITS 审中-公开具有灵活运输机制和垂直分流处理单元的多层底板处理装置公开(公告)号：US20160008841A1
公开(公告)日：2016-01-14
申请号：US14863375
申请日：2015-09-23
Applicant: Screen Semiconductor Solutions Co., Ltd.
Inventor： Hiroyuki Ogura , Tsuyoshi Mitsuhashi , Yoshiteru Fukutomi , Kenya Morinishi , Yasuo Kawamatsu , Hiromichi Nagashima
CPC classification number: B05C13/00 , B05C9/12 , B05C11/08 , B05C13/02 , C23C14/568 , G03F7/16 , H01L21/67173 , H01L21/67178 , H01L21/67276 , H01L21/67703 , H01L21/67742 , H01L21/67745 , Y10S414/135
Abstract: A substrate treating apparatus includes a first treating block and a second treating block disposed adjacent to the first treating block. Each of the first treating block and the second treating block include a plurality of stories arranged vertically. Each of the plurality of stories includes treating units for treating substrates and a main transport mechanism for transporting the substrates to and from the treating units. The substrates are transportable between the stories of the first treating block and the stories of the second treating block at same heights as corresponding stories of the first treating block. The substrates are transportable between the stories of the first treating block and the stories of the second treating block at different heights from corresponding stories of the first treating block.
Abstract translation: 基板处理装置包括第一处理块和邻近第一处理块设置的第二处理块。 第一处理块和第二处理块中的每一个包括垂直布置的多个故事。 多个故事中的每一个包括用于处理基板的处理单元和用于将基板输送到处理单元和从处理单元传送基板的主输送机构。 基底可以在第一处理块的故事和第二处理块的故事之间以与第一处理块的相应故事相同的高度传送。 基板可以在第一处理块的故事和第二处理块的故事之间在与第一处理块的相应故事不同的高度处运输。
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公开(公告)号：US20210134626A1
公开(公告)日：2021-05-06
申请号：US17145039
申请日：2021-01-08
Applicant: SCREEN Semiconductor Solutions Co., Ltd.
Inventor： Hiroyuki Ogura , Tsuyoshi Mitsuhashi , Yoshiteru Fukutomi , Kenya Morinishi , Yasuo Kawamatsu , Hiromichi Nagashima
Abstract: A substrate treating apparatus for treating substrates includes a plurality of substrate treatment lines arranged vertically for carrying out plural types of treatment on the substrates while transporting the substrates substantially horizontally, and a controller for changing processes of treatment carried out on the substrates for each of the substrate treatment lines. By changing the processes of treatment carried out for the substrates for each substrate treatment line, the processes of treatment carried out for the substrates can be changed for each substrate conveniently. Thus, a plurality of different processes of treatment corresponding to the number of substrate treatment lines can be carried out in parallel for the respective substrates.
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