公开(公告)号：US20210333707A1

公开(公告)日：2021-10-28

申请号：US17238541

申请日：2021-04-23

Applicant: Tokyo Electron Limited

Inventor： Takuya MIURA ,  Kouichirou TANAKA ,  Shogo TAKAHASHI ,  Yusuke MIYAKUBO ,  Kentaro YOSHIHARA

IPC: G03F7/00

Abstract: A nozzle unit for a liquid treatment apparatus that performs a liquid treatment on a substrate using a liquid, includes a first gas nozzle having a discharge flow path for allowing a first gas to flow through the discharge flow path and a first discharge port for discharging the first gas flowing through the discharge flow path toward a surface of the substrate, wherein the first discharge port is formed so as to extend in a first direction along the surface, and wherein a width of the discharge flow path in the first direction increases as the discharge flow path approaches the first discharge port, so that the first gas is discharged radially from the first discharge port.

公开(公告)号：US20240361687A1

公开(公告)日：2024-10-31

申请号：US18769841

申请日：2024-07-11

Applicant: Tokyo Electron Limited

Inventor： Takuya MIURA ,  Kouichirou TANAKA ,  Shogo TAKAHASHI ,  Yusuke MIYAKUBO ,  Kentaro YOSHIHARA

IPC: G03F7/00

CPC classification number: G03F7/0025

Abstract: A nozzle unit for a liquid treatment apparatus that performs a liquid treatment on a substrate using a liquid, includes a first gas nozzle having a discharge flow path for allowing a first gas to flow through the discharge flow path and a first discharge port for discharging the first gas flowing through the discharge flow path toward a surface of the substrate, wherein the first discharge port is formed so as to extend in a first direction along the surface, and wherein a width of the discharge flow path in the first direction increases as the discharge flow path approaches the first discharge port, so that the first gas is discharged radially from the first discharge port.

公开(公告)号：US20200290080A1

公开(公告)日：2020-09-17

申请号：US16768216

申请日：2018-12-07

Applicant: Tokyo Electron Limited

Inventor： Ryouichirou NAITOU ,  Masato HAYASHI ,  Hideo SHITE ,  Hiroyuki IDE ,  Yosuke KAMEDA ,  Seiya TOTSUKA ,  Atsumu MAITA ,  Takami SATOH ,  Hirofumi ARAKI ,  Kentaro YOSHIHARA

IPC: B05C19/06 ,  B05C11/10

Abstract: A solution supply apparatus for supplying a treatment solution to a treatment solution discharger configured to discharge the treatment solution to a treatment object, the solution supply apparatus includes: a supply pipe line connected to the treatment solution discharger; a filter provided on the supply pipe line and configured to filter the treatment solution to remove foreign substances; and a controller configured to perform a determination of a state of the treatment solution to be supplied to a primary side of the filter and, when the state of the treatment solution is determined to be bad, to output a control signal for restricting supply of the treatment solution to the primary side of the filter.

公开(公告)号：US20180361428A1

公开(公告)日：2018-12-20

申请号：US15997788

申请日：2018-06-05

Applicant: Tokyo Electron Limited

Inventor： Kentaro YOSHIHARA ,  Yuichi YOSHIDA ,  Naoki SHIBATA ,  Kousuke YOSHIHARA

IPC: B05D3/10 ,  B05D3/06 ,  B05D1/00 ,  B05C5/00

Abstract: A film forming method for forming a coating film by applying a coating solution onto a substrate having projections and recesses formed on a surface thereof by a predetermined pattern, includes: applying the coating solution onto the surface of the substrate to form a thick film having a depth of projections and recesses on a surface of the film of a predetermined value or less and having a film thickness larger than a target film thickness of the coating film; and removing the surface of the thick film to form the coating film having the target film thickness.