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公开(公告)号：US09462699B2
公开(公告)日：2016-10-04
申请号：US14304982
申请日：2014-06-16
Applicant: Wistron NeWeb Corp.
Inventor： Babak Radi , Yu-Fu Kuo
CPC classification number: H05K3/185 , H04M1/0277 , H05K1/0215 , H05K1/023 , H05K1/0284 , H05K1/0326 , H05K1/034 , H05K1/0346 , H05K1/165 , H05K3/0014 , H05K3/105 , H05K2201/0141 , H05K2201/0145 , H05K2201/015 , H05K2201/083 , H05K2201/09118 , H05K2201/10098 , Y10T29/49156
Abstract: A method of forming a metallic pattern on a polymer substrate is provided. A mixture layer is formed on a polymer substrate surface. The mixture layer includes an active carrier medium and nanoparticles dispersed in the active carrier medium. A laser process is performed to treat a portion of the mixture layer to form active seed residues on the surface of the polymer substrate. A cleaning process is performed to remove an untreated portion of the mixture layer to expose the surface of the polymer substrate, while the active seed residues are remained on the surface of the polymer substrate. Then, the active seed residues on the polymer substrate are subjected to an electroless plating process to form the metallic pattern over the active seed residues on the polymer substrate.
Abstract translation: 提供了一种在聚合物基板上形成金属图案的方法。 在聚合物基材表面上形成混合层。 混合物层包括活性载体介质和分散在活性载体介质中的纳米颗粒。 执行激光处理以处理混合物层的一部分以在聚合物基材的表面上形成活性种子残留物。 进行清洁处理以除去混合物层的未处理部分以暴露聚合物基材的表面，同时活性种子残留物保留在聚合物基材的表面上。 然后，对聚合物基底上的活性种子残留物进行化学镀处理，以在聚合物基底上的活性种子残基上形成金属图案。
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公开(公告)号：US20160072192A1
公开(公告)日：2016-03-10
申请号：US14816048
申请日：2015-08-02
Applicant: Wistron NeWeb Corp.
Inventor： Babak Radi , Yuan-Chin Hsu , Yu-Fu Kuo , Tzu-Min Wu , Tzu-Wen Chuang , Shih-Hong Chen
IPC: H01Q17/00
CPC classification number: H01Q17/004
Abstract: A metal pattern formed in the electromagnetic absorber structure is provided. By performing the laser treatment to form the active layer thereon, the metal pattern can be regionally formed on the electromagnetic absorber structure in the following electroless plating processes.
Abstract translation: 提供了形成在电磁吸收体结构中的金属图案。 通过进行激光处理以在其上形成有源层，在以下无电镀处理中，可以在电磁吸收体结构上区域地形成金属图案。
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公开(公告)号：US20150376809A1
公开(公告)日：2015-12-31
申请号：US14316809
申请日：2014-06-27
Applicant: Wistron NeWeb Corp.
Inventor： Babak Radi , Shih-Hong Chen , Yu-Fu Kuo , Tzu-Wen Chuang
CPC classification number: C25D5/02 , C25D5/56 , H05K3/105 , H05K3/24 , H05K2201/0257 , H05K2203/107
Abstract: A method of forming a metallic pattern on a polymer substrate is provided. A mixture layer is formed on a polymer substrate surface. The mixture layer includes an active carrier medium and nanoparticles dispersed in the active carrier medium. A laser process is performed to treat a portion of the mixture layer to form a conductive pattern on the surface of the polymer substrate. A cleaning process is performed to remove an untreated portion of the mixture layer to expose the surface of the polymer substrate, while the conductive pattern is remained on the surface of the polymer substrate. Then, the conductive pattern on the polymer substrate is subjected to an electroplating process to form the metallic pattern over the conductive pattern on the polymer substrate.
Abstract translation: 提供了一种在聚合物基板上形成金属图案的方法。 在聚合物基材表面上形成混合层。 混合物层包括活性载体介质和分散在活性载体介质中的纳米颗粒。 执行激光处理以处理混合物层的一部分以在聚合物基材的表面上形成导电图案。 执行清洁处理以除去混合物层的未处理部分以暴露聚合物基材的表面，同时导电图案保留在聚合物基材的表面上。 然后，对聚合物基板上的导电图案进行电镀处理，以在聚合物基板上的导电图案上形成金属图案。
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Patent Agency Ranking
4.发明授权公开(公告)号：US10087527B2
公开(公告)日：2018-10-02
申请号：US14265369
申请日：2014-04-30
Applicant: Wistron NeWeb Corp.
Inventor： Babak Radi , Shih-Hong Chen , Yu-Fu Kuo , Chun-Lin Chen , Jing-Wen Chen
IPC: H01L23/528 , C23C18/16 , C23C18/18 , H01L23/532 , H01L23/522 , H01L23/498 , G03F7/20 , H01L23/06 , B32B15/04 , B32B15/08 , B32B15/20 , B32B3/02 , B32B3/30 , H05K3/10 , H05K3/24 , H05K1/09 , H05K3/00
Abstract: The present disclosure is directed to a method of fabricating a substrate structure and a substrate structure fabricated by the same method. The method would include forming a first metal layer directly on a base, forming a first protective layer directly on the first metal layer, forming a second protective layer by using a compound comprising a thiol group directly on the first protective layer, patterning the second protective layer to form a pattern having an opening exposing the first protective layer, and forming a second metal layer within the opening of the second protective layer and directly on the first protective layer. The substrate structure would include a base, a first metal layer, a first protective layer, a second protective layer, and a second metal layer.
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公开(公告)号：US09997839B2
公开(公告)日：2018-06-12
申请号：US14816048
申请日：2015-08-02
Applicant: Wistron NeWeb Corp.
Inventor： Babak Radi , Yuan-Chin Hsu , Yu-Fu Kuo , Tzu-Min Wu , Tzu-Wen Chuang , Shih-Hong Chen
IPC: H01Q17/00
CPC classification number: H01Q17/004
Abstract: A metal pattern formed in the electromagnetic absorber structure is provided. By performing the laser treatment to form the active layer thereon, the metal pattern can be regionally formed on the electromagnetic absorber structure in the following electroless plating processes.
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6.发明申请METHOD OF FABRICATING SUBSTRATE STRUCTURE AND SUBSTRATE STRUCTURE FABRICATED BY THE SAME METHOD 审中-公开制造基板结构的方法和由该方法制成的基板结构公开(公告)号：US20150315708A1
公开(公告)日：2015-11-05
申请号：US14265369
申请日：2014-04-30
Applicant: Wistron NeWeb Corp.
Inventor： Babak Radi , Shih-Hong Chen , Yu-Fu Kuo , Chun-Lin Chen , Jing-Wen Chen
CPC classification number: C23C18/1605 , B32B3/02 , B32B3/30 , B32B15/043 , B32B15/08 , B32B15/20 , B32B2255/06 , B32B2255/205 , B32B2255/24 , B32B2457/00 , C23C18/182 , G03F7/202 , H01L23/06 , H01L23/49838 , H01L23/5223 , H01L23/5227 , H01L23/5228 , H01L23/528 , H01L23/53204 , H01L23/53228 , H01L23/53233 , H01L23/53242 , H01L2924/00 , H01L2924/0002 , H05K1/09 , H05K3/0026 , H05K3/107 , H05K3/243 , H05K2201/0338 , H05K2203/072 , Y10T428/12361 , Y10T428/24331
Abstract: The present disclosure is directed to a method of fabricating a substrate structure and a substrate structure fabricated by the same method. The method would include forming a first metal layer directly on a base, forming a first protective layer directly on the first metal layer, forming a second protective layer by using a compound comprising a thiol group directly on the first protective layer, patterning the second protective layer to form a pattern having an opening exposing the first protective layer, and forming a second metal layer within the opening of the second protective layer and directly on the first protective layer. The substrate structure would include a base, a first metal layer, a first protective layer, a second protective layer, and a second metal layer.
Abstract translation: 本公开涉及一种制造基板结构的方法和通过相同方法制造的基板结构。 该方法将包括直接在基底上形成第一金属层，在第一金属层上直接形成第一保护层，通过在第一保护层上直接使用包含硫醇基的化合物形成第二保护层， 以形成具有露出第一保护层的开口的图案，以及在第二保护层的开口内形成第二金属层，并且直接在第一保护层上。 衬底结构将包括基底，第一金属层，第一保护层，第二保护层和第二金属层。
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公开(公告)号：US09657404B2
公开(公告)日：2017-05-23
申请号：US14316809
申请日：2014-06-27
Applicant: Wistron NeWeb Corp.
Inventor： Babak Radi , Shih-Hong Chen , Yu-Fu Kuo , Tzu-Wen Chuang
CPC classification number: C25D5/02 , C25D5/56 , H05K3/105 , H05K3/24 , H05K2201/0257 , H05K2203/107
Abstract: A method of forming a metallic pattern on a polymer substrate is provided. A mixture layer is formed on a polymer substrate surface. The mixture layer includes an active carrier medium and nanoparticles dispersed in the active carrier medium. A laser process is performed to treat a portion of the mixture layer to form a conductive pattern on the surface of the polymer substrate. A cleaning process is performed to remove an untreated portion of the mixture layer to expose the surface of the polymer substrate, while the conductive pattern is remained on the surface of the polymer substrate. Then, the conductive pattern on the polymer substrate is subjected to an electroplating process to form the metallic pattern over the conductive pattern on the polymer substrate.
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公开(公告)号：US20150366072A1
公开(公告)日：2015-12-17
申请号：US14304982
申请日：2014-06-16
Applicant: Wistron NeWeb Corp.
Inventor： Babak Radi , Yu-Fu Kuo
CPC classification number: H05K3/185 , H04M1/0277 , H05K1/0215 , H05K1/023 , H05K1/0284 , H05K1/0326 , H05K1/034 , H05K1/0346 , H05K1/165 , H05K3/0014 , H05K3/105 , H05K2201/0141 , H05K2201/0145 , H05K2201/015 , H05K2201/083 , H05K2201/09118 , H05K2201/10098 , Y10T29/49156
Abstract: A method of forming a metallic pattern on a polymer substrate is provided. A mixture layer is formed on a polymer substrate surface. The mixture layer includes an active carrier medium and nanoparticles dispersed in the active carrier medium. A laser process is performed to treat a portion of the mixture layer to form active seed residues on the surface of the polymer substrate. A cleaning process is performed to remove an untreated portion of the mixture layer to expose the surface of the polymer substrate, while the active seed residues are remained on the surface of the polymer substrate. Then, the active seed residues on the polymer substrate are subjected to an electroless plating process to form the metallic pattern over the active seed residues on the polymer substrate.
Abstract translation: 提供了一种在聚合物基板上形成金属图案的方法。 在聚合物基材表面上形成混合层。 混合物层包括活性载体介质和分散在活性载体介质中的纳米颗粒。 执行激光处理以处理混合物层的一部分以在聚合物基材的表面上形成活性种子残留物。 进行清洁处理以除去混合物层的未处理部分以暴露聚合物基材的表面，同时活性种子残留物保留在聚合物基材的表面上。 然后，对聚合物基底上的活性种子残留物进行化学镀处理，以在聚合物基底上的活性种子残基上形成金属图案。
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