Abstract:
PURPOSE: A method for controlling a band gap of a semiconductor optical device having the structure of a quantum well is provided to prevent a quantum well substrate damaging by using a silicon nitride film as a dielectric cover layer and by controlling a flow ratio of ammonia gas. CONSTITUTION: A substrate having the structure of a quantum well is grown(S100). A dielectric cover layer is deposited on the substrate by a plasma chemical vapor deposition process(S200). A thermal processing is performed on the dielectric cover layer at a predetermined time(S300). The dielectric cover layer is removed(S400). A fluorescence spectrum is measured(S500).
Abstract:
본 발명은 얇은 반도체 시료가 깨지지 않도록 마운팅(mounting) 기술을 이용하여 반도체 광소자의 전,후 단면에 무반사 코딩을 하도록 하는 무반사 코팅을 위한 반도체 광소자 칩의 시료 홀더 장치에 관한 것이다. 따라서, 본 발명은 무반사 코팅시 시료 깨짐을 방지하기 위한 마운팅 기술을 이용하는 시료 홀더 장치에 있어서, 제 1스테인레스(10) 상에는 스페이서(20)와, 고정판(30)과, 제 2스테인레스(40)가 순차적으로 적층되되, 각 홀(50a)을 통하여 상기 제 2스테인레스(40)으로부터 상기 제 1스테인레스(10)까지 도달되도록 홀더결합수단(50)에 의해 체결되고, 각 홀(55a)을 통하여 상기 제 2스테인레스(40)으로부터 상기 고정판(30)까지 도달되도록 시료고정수단(55)에 의해 체결되며, 상기 고정판(30)과 상기 제 1스테인레스(10) 사이에 놓여지는 위치에 스페이서(20)와 수평으로 레이저바(60)가 연장되어 설치되도록 구성되어, 상기 제 2스테인레스(40)의 면적 크기를 상기 제 1스테인레스(10)의 면적 크기 보다 작게 설계함으로서 무반사 코팅시 레이저바(60)에 가해지는 힘의 세기� � 분산시키도록 하는 것을 특징으로 하는 무반사 코팅을 위한 반도체 광소자 칩의 시료 홀더 장치가 제시된다.
Abstract:
PURPOSE: A method for extending the gain bandwidth of a semiconductor optical amplifier is provided to obtain the semiconductor optical amplifier having a wide gain bandwidth by using a quantum dot as a gain region of the semiconductor optical amplifier. CONSTITUTION: An InP(Indium Phosphorus) buffer layer is grown at a predetermined thickness(S10). After the growing of the InP buffer layer, a predetermined gas is supplied(S20, S30, S40). An InAs(Indium arsenide) single well layer is grown on the InP buffer layer(S50). After the growing of the InAs layer, a predetermined gas is supplied(S60, S70, S80). An InP cap layer is grown on the InAs layer(S90).
Abstract:
It is an object to provide a method capable of easily correcting each mask patterns when manufacturing a mulilayer mask by converting an electronic microscope into a simply additional device in order to perform an electron beam lithography while maintaining original functions thereof. The method according to the present invention can easily compensate defects of a mask prior to manufacturing the mask by using functions of a microscope. The method performs an electron beam lithography to directly represent a pattern on a sample and manufacture the mask while maintaining original functions of the microscope.
Abstract:
PURPOSE: A method for measuring a sectional reflexibility of a field absorption type device is provided to measure easily an optical variable by using an optical current. CONSTITUTION: A lens type fiber(21) transfers a laser beam emitted from a variable wavelength laser(10). The laser beam passing through the lens type filter(21) is irradiated on a section of a device(15). A chopper(11) turns on or off the variable wavelength laser(10). An optical rotator(14) is formed at a position adjacent to a polarization controller(13) in order to control a path of the laser beam. An optical detector(16) is connected with the optical rotator(14) in order to measure a change of reflective intensity of a reflected beam. A lock-in amplifier(17) is connected with the chopper(11) in order to detect a modulated variable wavelength laser beam. A power supply(18) supplies power to each component. A voltage separator(18) separates a signal influence between the device(15) and the lock-in amplifier(17).
Abstract:
PURPOSE: A method for controlling a band gap of a semiconductor optical device having the structure of a quantum well is provided to prevent a quantum well substrate damaging by using a silicon nitride film as a dielectric cover layer and by controlling a flow ratio of ammonia gas. CONSTITUTION: A substrate having the structure of a quantum well is grown(S100). A dielectric cover layer is deposited on the substrate by a plasma chemical vapor deposition process(S200). A thermal processing is performed on the dielectric cover layer at a predetermined time(S300). The dielectric cover layer is removed(S400). A fluorescence spectrum is measured(S500).
Abstract:
PURPOSE: A mounting technology of a semiconductor optical device for anti-reflection coating is provided to perform the mounting technology in a stable and identical condition by preventing a sample from damaging in the anti-reflection coating. CONSTITUTION: A spacer(20), a fixing plate(30) and the second stainless(40) is deposited on the first stainless(10) in turns. A holder coupling unit(50) couples from the second stainless(40) to the first stainless(10) via each hole. A sample fixing unit(55) couples from the second stainless(40) to the fixing plate(30) via each hole. A laser bar(60) is extended at a level with the spacer(20) between the fixing plate(30) and the first stainless(10). The area size of the second stainless(40) is less than that of the first stainless(10).
Abstract:
PURPOSE: A method for measuring a sectional reflexibility of a field absorption type device is provided to measure easily an optical variable by using an optical current. CONSTITUTION: A lens type fiber(21) transfers a laser beam emitted from a variable wavelength laser(10). The laser beam passing through the lens type filter(21) is irradiated on a section of a device(15). A chopper(11) turns on or off the variable wavelength laser(10). An optical rotator(14) is formed at a position adjacent to a polarization controller(13) in order to control a path of the laser beam. An optical detector(16) is connected with the optical rotator(14) in order to measure a change of reflective intensity of a reflected beam. A lock-in amplifier(17) is connected with the chopper(11) in order to detect a modulated variable wavelength laser beam. A power supply(18) supplies power to each component. A voltage separator(18) separates a signal influence between the device(15) and the lock-in amplifier(17).
Abstract:
본 발명은 스스로 뭉쳐서 형성된 양자점에서 나오는 광의 스펙트럼이 매우 넓은 것을 이용하여 반도체 광 증폭기의 이득 대역폭을 확장하는 방법에 관한 것이다. 더 상세하게는 InGaAs/InGaAsP/InP 양자우물 반도체 광증폭기의 이득 대역폭 확장방법에 있어서, 소정 두께의 InP 버퍼층을 성장시키는 과정과, 상기 InP 버퍼층 성장후 소정 가스를 공급하는 제1 가스 공급 과정과, 상기 InP 버퍼층 위로 InAs 단일 우물 구조층을 성장시키는 과정과, 상기 InAs 층 성장 후 소정 가스를 공급하여 격자 상수가 맞지 않는 상기 InAs 층이 서로 뭉쳐서 양자점을 형성하도록 하는 제2 가스 공급 과정과, 상기 InAs 층 위로 소정 두께의 InP 캡층을 성장시키는 과정으로 양자점을 생성하여 반도체 광 증폭기의 이득영역으로 양자점을 도입하고, 상기 InAs가 서로 뭉치면서 각 점들의 크기와 높이가 불균일하게 서로 독립적인 점을 형성하게 함을 특징으로 한다.
Abstract:
PURPOSE: A method for locally forming a different band gap in a quantum well by a dielectric-semiconductor composite cover layer is provided to regulate a degree of disorder of the quantum well. CONSTITUTION: The method begins with growing an InGaAs/InGaAsP quantum well substrate by a chemical beam epitaxy technique. Next, a dielectric thin layer made of such as SiO2 or SiNx is formed as a cover layer on the quantum well substrate by a plasma-enhanced chemical deposition technique. After a heat treatment step is carried out at a temperature of 600 - 800°C for 4 - 16 minutes, the dielectric thin layer is removed. In addition, InP, InGaAs or InGaAsP is used as a semiconductor cover layer.