公开(公告)号：JP2010101900A

公开(公告)日：2010-05-06

申请号：JP2009278054

申请日：2009-12-07

Applicant: Analog Devices Inc ,  アナログ デバイシス, インコーポレイテッド

Inventor： KARPMAN MAURICE S ,  HABLUTZEL NICOLE ,  FARRELL PETER W ,  JUDY MICHAEL W ,  FELTON LAWRENCE E ,  LONG LEWIS

IPC: G01C19/56 ,  B81B7/00 ,  G01P9/04 ,  H01L23/04 ,  H01L23/06 ,  H01L23/50

CPC classification number: B81B7/0048 ,  H01L2224/32014 ,  H01L2924/1461 ,  H01L2924/16195 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a packaged microchip with a premolded-type package. SOLUTION: A MEMS (micro electro mechanical systems) inertial sensor 10 is secured within a premolded-type package 12 formed from a low moisture permeable molding material. Consequently, such a motion detector can be produced more economically than those using ceramic packages. To those ends, the package 12 has at least one wall 13 extending from a lead frame 24 to form a cavity, and an isolator 22 within the cavity. The MEMS inertial sensor 10 has a movable structure suspended above a substrate having a bottom surface. The substrate bottom surface is secured to the isolator top surface at a contact area. The contact area is less than the surface area of the bottom surface of the substrate. Accordingly, the isolator 22 forms a space between at least a portion of the bottom substrate surface and the package 12. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供具有预成型包装的封装微芯片。 解决方案：MEMS（微机电系统）惯性传感器10固定在由低透湿成型材料形成的预成型包装12内。 因此，与使用陶瓷封装的那些相比，这样的运动检测器可以比经济地生产。 在这些端部，包装12具有从引线框架24延伸以形成空腔的至少一个壁13和腔内的隔离件22。 MEMS惯性传感器10具有悬挂在具有底面的基板上方的可移动结构。 衬底底表面在接触区域处固定到隔离器顶表面。 接触面积小于基板底面的表面积。 因此，隔离器22在底部基板表面的至少一部分和封装12之间形成空间。（C）2010，JPO和INPIT

公开(公告)号：AU2002368046A1

公开(公告)日：2004-01-19

申请号：AU2002368046

申请日：2002-10-23

Applicant: ANALOG DEVICES INC

Inventor： COLLINS DAVID J ,  MARTIN JOHN R ,  WEBSTER WILLIAM A ,  FELTON LAWRENCE E ,  FARRELL PETER W ,  LUO JING

IPC: B81B7/00 ,  B81C1/00 ,  H01L23/10

公开(公告)号：AU2002368046A8

公开(公告)日：2004-01-19

申请号：AU2002368046

申请日：2002-10-23

Applicant: ANALOG DEVICES INC

Inventor： WEBSTER WILLIAM A ,  COLLINS DAVID J ,  MARTIN JOHN R ,  FARRELL PETER W ,  LUO JING ,  FELTON LAWRENCE E

IPC: B81B7/00 ,  B81C1/00 ,  H01L23/10

公开(公告)号：DE602005020148D1

公开(公告)日：2010-05-06

申请号：DE602005020148

申请日：2005-05-31

Applicant: ANALOG DEVICES INC

Inventor： MARTIN JOHN R ,  MENA MANOLO G ,  LACSAMANA ELMER S ,  DUFFY MICHAEL P ,  WEBSTER WILLIAM A ,  FELTON LAWRENCE E ,  KARPMAN MAURICE S

IPC: B81C1/00

Abstract: A method of producing a MEMS device removes the bottom side of a device wafer after its movable structure is formed. To that end, the method provides the device wafer, which has an initial bottom side. Next, the method forms the movable structure on the device wafer, and then removes substantially the entire initial bottom side of the device wafer. Removal of the entire initial bottom side effectively forms a final bottom side.

公开(公告)号：WO2004003965A3

公开(公告)日：2004-04-29

申请号：PCT/US0233811

申请日：2002-10-23

Applicant: ANALOG DEVICES INC

Inventor： FELTON LAWRENCE E ,  FARRELL PETER W ,  LUO JING ,  COLLINS DAVID J ,  MARTIN JOHN R ,  WEBSTER WILLIAM A

IPC: B81B7/00 ,  B81C1/00 ,  H01L23/10

CPC classification number: B81B7/0077 ,  B81C1/00896 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A MEMS capping method and apparatus uses a cap structure on which is formed a MEMS cavity, a cut capture cavity, and a cap wall. The cap wall is essentially the outer wall of the MEMS cavity and the inner wall of the cut capture cavity. The cap structure is bonded onto a MEMS structure such that the MEMS cavity covers protected MEMS components. The cap structure is trimmed by cutting through to the cut capture cavity from the top of the cap structure without cutting all the way through to the MEMS structure.

Abstract translation: MEMS封盖方法和装置使用其上形成有MEMS腔体，切割捕获腔体和盖壁的盖结构。 帽壁基本上是MEMS腔的外壁和切割捕获腔的内壁。 帽结构被结合到MEMS结构上，使得MEMS腔覆盖受保护的MEMS部件。 通过从帽结构的顶部切割到切割捕获空腔而不切割到MEMS结构，修剪帽结构。

公开(公告)号：WO02074686A3

公开(公告)日：2003-02-06

申请号：PCT/US0151501

申请日：2001-12-05

Applicant: ANALOG DEVICES INC

Inventor： SPOONER TIMOTHY R ,  COURAGE DAVID S ,  HARNEY KIERAN P ,  FELTON LAWRENCE E ,  LUO JING ,  WORKMAN BRAD ,  MARTIN JOHN R

IPC: B81B7/00 ,  B81C1/00 ,  H01L21/68

CPC classification number: H01L21/6836 ,  B81C1/00888 ,  B81C1/00896 ,  H01L2221/68327

Abstract: A wafer cap protects micro electromechanical system ("MEMS") structures during a dicing of a MEMS wafer to produce individual MEMS dies. A MEMS wafer is prepared having a plurality of MEMS structure sites thereon. Upon the MEMS wafer, the wafer cap is mounted to produce a laminated MEMS wafer. The wafer cap is recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer. The capped MEMS wafer can be diced into a plurality of MEMS dies without causing damage to or contaminating the MEMS die.

Abstract translation: 在MEMS晶片的切割期间，晶片盖保护微机电系统（“MEMS”）结构以产生单独的MEMS管芯。 制备具有多个MEMS结构位置的MEMS晶片。 在MEMS晶片上，安装晶片盖以产生层压的MEMS晶片。 晶片盖凹入与MEMS晶片上的MEMS结构位置的位置对应的区域中。 封装的MEMS晶片可以切割成多个MEMS管芯，而不会损坏或污染MEMS管芯。

公开(公告)号：WO2007022249A3

公开(公告)日：2007-05-18

申请号：PCT/US2006031958

申请日：2006-08-16

Applicant: ANALOG DEVICES INC ,  HARNEY KIERAN P ,  MARTIN JOHN R ,  FELTON LAWRENCE E

Inventor： HARNEY KIERAN P ,  MARTIN JOHN R ,  FELTON LAWRENCE E

IPC: B81B7/00

CPC classification number: B81B7/0064 ,  B81B2201/0257 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An apparatus has a leadframe based package base having a leadframe and a lid coupled with the package base. The lid and package base form a chamber for at least partially containing a microphone. The lid is electrically coupled with a given portion of the leadframe in the package base.

Abstract translation: 一种装置具有基于引线框架的封装基座，其具有引线框架和与封装基座耦合的盖子。 盖子和包装底座形成用于至少部分地容纳麦克风的腔室。 盖子与封装基座中的引线框架的给定部分电耦合。

公开(公告)号：WO2007022179A3

公开(公告)日：2007-05-18

申请号：PCT/US2006031825

申请日：2006-08-16

Applicant: ANALOG DEVICES INC ,  HARNEY KIERAN P ,  MARTIN JOHN R ,  FELTON LAWRENCE E

Inventor： HARNEY KIERAN P ,  MARTIN JOHN R ,  FELTON LAWRENCE E

IPC: B81B7/00

CPC classification number: B81B7/007 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: A package for a micro-electromechanical (MEMS) device is described. A premolded leadframe base has opposing top and bottom surfaces. Each surface is defined by a topology having at least one electrically conductive portion and at least one electrically non-conductive portion, and the topology of the top surface differs from the topology of the bottom surface.

Abstract translation: 描述了用于微机电（MEMS）装置的封装。 预制的引线框架底座具有相对的顶部和底部表面。 每个表面由具有至少一个导电部分和至少一个非导电部分的拓扑结构限定，并且顶表面的拓扑与底表面的拓扑不同。

公开(公告)号：WO2006084028A3

公开(公告)日：2007-01-04

申请号：PCT/US2006003673

申请日：2006-02-02

Applicant: ANALOG DEVICES INC ,  ALIE SUSAN A ,  WACHTMANN BRUCE K ,  FELTON LAWRENCE E ,  YUN CHANGHAN

Inventor： ALIE SUSAN A ,  WACHTMANN BRUCE K ,  FELTON LAWRENCE E ,  YUN CHANGHAN

IPC: B81B7/00 ,  H01L21/60 ,  H01L21/768 ,  H01L21/98 ,  H01L23/48

CPC classification number: B81C1/00301 ,  B81B7/0006 ,  B81B2203/0353 ,  B81B2207/093 ,  B81B2207/095 ,  B81C2203/019 ,  H01L21/76898 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05023 ,  H01L2224/05166 ,  H01L2224/05184 ,  H01L2224/05568 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13025 ,  H01L2224/8182 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/30105 ,  H01L2924/00014

Abstract: A conductive bond for through-wafer interconnect is produced by forming an electrode (108) through a first wafer from a component on a front side of the first wafer(102) to a back side of the first wafer(102), forming a first electrically conductive interface (110) in contact with an exposed portion of the electrode (108) on the back side of the first wafer (102), and conductively bonding the first electrically conductive interface (110) with a second electrically conductive interface (114) on a second wafer under pressure at a temperature below the thermal budget of the stacked wafer device. The process temperature is generally well below the melting points of the electrically conductive interfaces. In .some embodiments, the conductive bonding may be facilitated or enabled by performing the conductive bonding in a vacuum.

Abstract translation: 通过从第一晶片（102）的前侧的部件到第一晶片（102）的后侧形成通过第一晶片的电极（108），形成用于晶片间互连的导电接合，形成第一晶片 导电接口（110），与第一晶片（102）的背侧上的电极（108）的暴露部分接触，并且将第一导电接口（110）与第二导电接口（114）导电地接合， 在低于堆叠晶片装置的热预算的温度的压力下在第二晶片上。 工艺温度通常远低于导电界面的熔点。 在一些实施例中，可以通过在真空中执行导电接合来促进或实现导电接合。

公开(公告)号：WO2005026040A3

公开(公告)日：2005-07-07

申请号：PCT/US2004029133

申请日：2004-09-08

Applicant: ANALOG DEVICES INC ,  FELTON LAWRENCE E ,  HARNEY KIERAN P ,  ROBERTS CARL M

Inventor： FELTON LAWRENCE E ,  HARNEY KIERAN P ,  ROBERTS CARL M

IPC: B81B7/00 ,  G01P1/02 ,  G01P15/08

CPC classification number: B81B7/007 ,  B81B2201/0235 ,  G01P1/023 ,  G01P15/0802 ,  Y10T29/49007

Abstract: A sensor has a die (with a working portion), a cap coupled with the die to at least partially cover the working portion, and a conductive pathway extending through the cap to the working portion. The pathway provides an electrical interface to the working portion.

Abstract translation: 传感器具有模具（具有工作部分），与模具耦合以至少部分地覆盖工作部分的帽以及延伸穿过帽部到工作部分的导电通路。 该通道为工作部分提供电接口。