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    ACID-ETCH RESISTANT, PROTECTIVE COATINGS
    2.
    发明专利
    ACID-ETCH RESISTANT, PROTECTIVE COATINGS 未知

    公开(公告)号：SG175217A1

    公开(公告)日：2011-11-28

    申请号：SG2011074903

    申请日：2010-03-19

    Applicant: BREWER SCIENCE INC

    Inventor： TRICHUR RAMACHANDRAN K ,  TANG TINGJI ,  XU GU ,  ZHONG XING-FU ,  HONG WENBIN ,  FLAIM TONY D ,  YESS KIMBERLY

    Abstract: New compositions and methods of using those compositions as protective layers during the production of semiconductor and MEMS devices are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to form layers that protect a substrate during acid etching and other processing and handling. The protective layer can be photosensitive or non-photosensitive, and can be used with or without a primer layer beneath the protective layer. Preferred primer layers comprise a basic polymer in a solvent system.

    ACID-ETCH RESISTANT, PROTECTIVE COATINGS
    4.
    发明专利
    ACID-ETCH RESISTANT, PROTECTIVE COATINGS 未知

    公开(公告)号：SG2014012512A

    公开(公告)日：2014-06-27

    申请号：SG2014012512

    申请日：2010-03-19

    Applicant: BREWER SCIENCE INC

    Inventor： TANG TINGJI ,  XU GU ,  ZHONG XING-FU ,  HONG WENBIN ,  FLAIM TONY D ,  YESS KIMBERLY ,  TRICHUR RAMACHANDRAN K

    Abstract: New compositions and methods of using those compositions as protective layers during the production of semiconductor and MEMS devices are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to form layers that protect a substrate during acid etching and other processing and handling. The protective layer can be photosensitive or non-photosensitive, and can be used with or without a primer layer beneath the protective layer. Preferred primer layers comprise a basic polymer in a solvent system.

    5.
    发明专利
    未知

    公开(公告)号：AT541240T

    公开(公告)日：2012-01-15

    申请号：AT08730646

    申请日：2008-02-25

    Applicant: BREWER SCIENCE INC

    Inventor： ZHONG XING-FU ,  FLAIM TONY ,  MALHOTRA JYOTI

    IPC: G03F7/004

    Abstract: New photoresists for use during the production of semiconductor and MEMS devices are provided. The primer layer preferably comprises a silane dissolved or dispersed in a solvent system. The photoresist layer includes a first polymer prepared from a styrene and an acrylonitrile, and a second polymer comprising epoxy-containing monomers (and preferably phenolic-containing monomers). The photoresist layer comprises a photoacid generator, and is preferably negative-acting.

    SUPERPLANARIZING SPIN-ON CARBON MATERIALS
    6.
    发明专利
    SUPERPLANARIZING SPIN-ON CARBON MATERIALS 未知

    公开(公告)号：SG10201912718SA

    公开(公告)日：2020-02-27

    申请号：SG10201912718S

    申请日：2016-06-21

    Applicant: BREWER SCIENCE INC

    Inventor： ZHONG XING-FU ,  HUANG RUNHUI ,  ZHANG BOYU

    Abstract: Planarizing and spin-on-carbon (SOC) compositions that fill vias and/or trenches on a substrate while planarizing the surface in a single thin layer coating process are provided. The compositions can planarize wide ranges of substrates with vias or trenches of from about 20 nm to about 220 nm wide, and up to about 700 nm deep. These extraordinary properties come from the low molecular weight of the polymers used in the materials, thermally-labile protecting groups on the polymers, and a delayed crosslinking reaction.

    POLYIMIDES AS LASER RELEASE MATERIALS FOR 3-D IC APPLICATIONS
    7.
    发明专利
    POLYIMIDES AS LASER RELEASE MATERIALS FOR 3-D IC APPLICATIONS 未知

    公开(公告)号：SG11201700478YA

    公开(公告)日：2017-02-27

    申请号：SG11201700478Y

    申请日：2015-07-22

    Applicant: BREWER SCIENCE INC

    Inventor： LIU XIAO ,  BAI DONGSHUN ,  FLAIM TONY D ,  ZHONG XING-FU ,  WU QI

    IPC: H01L21/58

    Abstract: The invention broadly relates to release layer compositions that enable thin wafer handling during microelectronics manufacturing. Preferred release layers are formed from compositions comprising a polyamic acid or polyimide dissolved or dispersed in a solvent system, followed by curing and/or solvent removal at about 250° C. to about 350° C. for less than about 10 minutes, yielding a thin film. This process forms the release compositions into polyimide release layers that can be used in temporary bonding processes, and laser debonded after the desired processing has been carried out.

    MULTIPLE BONDING LAYERS FOR THIN-WAFER HANDLING
    10.
    发明专利
    MULTIPLE BONDING LAYERS FOR THIN-WAFER HANDLING 未知

    公开(公告)号：SG187739A1

    公开(公告)日：2013-03-28

    申请号：SG2013009121

    申请日：2011-08-05

    Applicant: BREWER SCIENCE INC

    Inventor： PULIGADDA RAMA ,  ZHONG XING-FU ,  FLAIM TONY D ,  MCCUTCHEON JEREMY

    Abstract: Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side.

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