公开(公告)号：EP1722616A3

公开(公告)日：2008-06-18

申请号：EP06075980.0

申请日：2006-05-01

Applicant: Delphi Technologies, Inc.

Inventor： Snyder, Rick B. ,  Delheimer, Charles I.

IPC: H05K3/34

CPC classification number: H01L23/498 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/13 ,  H01L2224/131 ,  H01L2224/13583 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K1/092 ,  H05K3/244 ,  H05K3/246 ,  H05K3/3452 ,  H05K2201/0347 ,  H05K2201/2081 ,  H05K2203/0315 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

Abstract: A technique for defining a wettable solder joint area for an electronic assembly reduces and/or dispenses with the use of polymer solder masks. According to the technique, a substrate (112) is provided that includes at least one conductive trace (116). A nickel layer (118) is provided on the conductive trace (116) and gold is selectively applied on the nickel layer (118) in a desired pattern to form a gold layer (120). An exposed portion of the nickel layer (118) that does not include the gold in the desired pattern is then oxidized. Finally, a solder (122) is applied to the gold layer (120), with the oxidized nickel layer (118) providing a solder stop and defining a wettable solder joint area.

公开(公告)号：EP1558065A3

公开(公告)日：2007-11-14

申请号：EP05075085.0

申请日：2005-01-11

Applicant: Delphi Technologies, Inc.

Inventor： Chengalva, Mahesh K. ,  Chengalva, Suresh K. ,  Snyder, Rick B.

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K1/112 ,  H01L2224/16225 ,  H05K1/0271 ,  H05K3/4644 ,  H05K3/4688 ,  H05K2201/0133 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2201/10727 ,  Y02P70/611 ,  Y10T428/24273

Abstract: Surface mounting of components includes providing a substrate (10) that has a first surface and a second surface. A portion of the first surface is coupled to a conductive layer (20) that is patterned. A compliant layer (50) is introduced to the first surface of the substrate (10) and to the conductive layer (20). At least one aperture is formed in the compliant layer (50) which extends to the surface of the conductive layer (20). Conductive material is introduced into the aperture(s). Solder couples the surface mount component (90) to the compliant layer (50).

Abstract translation: 组件的表面安装包括提供具有第一表面和第二表面的基底（10）。 第一表面的一部分耦合到被图案化的导电层（20）。 柔性层（50）被引入衬底（10）的第一表面和导电层（20）。 在柔性层（50）中形成至少一个孔，其延伸到导电层（20）的表面。 将导电材料引入孔中。 焊接将表面安装部件（90）耦合到柔性层（50）。

公开(公告)号：EP1722616A2

公开(公告)日：2006-11-15

申请号：EP06075980.0

申请日：2006-05-01

Applicant: Delphi Technologies, Inc.

Inventor： Snyder, Rick B. ,  Delheimer, Charles I.

IPC: H05K3/34

CPC classification number: H01L23/498 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/13 ,  H01L2224/131 ,  H01L2224/13583 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K1/092 ,  H05K3/244 ,  H05K3/246 ,  H05K3/3452 ,  H05K2201/0347 ,  H05K2201/2081 ,  H05K2203/0315 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

Abstract: A technique for defining a wettable solder joint area for an electronic assembly reduces and/or dispenses with the use of polymer solder masks. According to the technique, a substrate (112) is provided that includes at least one conductive trace (116). A nickel layer (118) is provided on the conductive trace (116) and gold is selectively applied on the nickel layer (118) in a desired pattern to form a gold layer (120). An exposed portion of the nickel layer (118) that does not include the gold in the desired pattern is then oxidized. Finally, a solder (122) is applied to the gold layer (120), with the oxidized nickel layer (118) providing a solder stop and defining a wettable solder joint area.

Abstract translation: 用于限定电子组件的可润湿焊接区域的技术减少和/或省去了聚合物焊料掩模的使用。 根据该技术，提供了包括至少一个导电迹线（116）的基板（112）。 在导电迹线（116）上提供镍层（118），并且以期望的图案将金选择性地施加在镍层（118）上以形成金层（120）。 然后将不包含所需图案中的金的镍层（118）的暴露部分氧化。 最后，将焊料（122）施加到金层（120），氧化的镍层（118）提供焊料停止并限定可润湿的焊接区域。

公开(公告)号：EP1558065A2

公开(公告)日：2005-07-27

申请号：EP05075085.0

申请日：2005-01-11

Applicant: Delphi Technologies, Inc.

Inventor： Chengalva, Mahesh K. ,  Chengalva, Suresh K. ,  Snyder, Rick B.

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K1/112 ,  H01L2224/16225 ,  H05K1/0271 ,  H05K3/4644 ,  H05K3/4688 ,  H05K2201/0133 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2201/10727 ,  Y02P70/611 ,  Y10T428/24273

Abstract: Surface mounting of components includes providing a substrate (10) that has a first surface and a second surface. A portion of the first surface is coupled to a conductive layer (20) that is patterned. A compliant layer (50) is introduced to the first surface of the substrate (10) and to the conductive layer (20). At least one aperture is formed in the compliant layer (50) which extends to the surface of the conductive layer (20). Conductive material is introduced into the aperture(s). Solder couples the surface mount component (90) to the compliant layer (50).