公开(公告)号：EP1791406A1

公开(公告)日：2007-05-30

申请号：EP06077047.6

申请日：2006-11-17

Applicant: Delphi Technologies, Inc.

Inventor： Chan, Su Liang ,  Nah, Chih Kai ,  Pan, Binghua ,  Schofield, Robert A. ,  Cheok, Cheng Gek ,  Chengalva, Mahesh K.

IPC: H05K3/30

CPC classification number: H05K3/303 ,  H05K1/0266 ,  H05K3/3452 ,  H05K2201/09909 ,  H05K2201/09936 ,  H05K2201/10727 ,  H05K2201/2036 ,  Y02P70/613

Abstract: A composite standoff is formed on a circuit board during the processing of the circuit board while an array of electrical circuit traces including contact pads are formed, portions of the electrical circuit traces are covered by a solder mask, and legend ink is applied to the circuit board for locating electronic components on the circuit board without any need for an additional step.

Abstract translation: 在电路板的处理期间在电路板上形成复合间隔，同时形成包括接触焊盘的电路迹线阵列，电路迹线的一部分被焊接掩模覆盖，并且将传说墨施加到电路 用于在电路板上定位电子元件，而无需额外的步骤。

公开(公告)号：EP1558065A3

公开(公告)日：2007-11-14

申请号：EP05075085.0

申请日：2005-01-11

Applicant: Delphi Technologies, Inc.

Inventor： Chengalva, Mahesh K. ,  Chengalva, Suresh K. ,  Snyder, Rick B.

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K1/112 ,  H01L2224/16225 ,  H05K1/0271 ,  H05K3/4644 ,  H05K3/4688 ,  H05K2201/0133 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2201/10727 ,  Y02P70/611 ,  Y10T428/24273

Abstract: Surface mounting of components includes providing a substrate (10) that has a first surface and a second surface. A portion of the first surface is coupled to a conductive layer (20) that is patterned. A compliant layer (50) is introduced to the first surface of the substrate (10) and to the conductive layer (20). At least one aperture is formed in the compliant layer (50) which extends to the surface of the conductive layer (20). Conductive material is introduced into the aperture(s). Solder couples the surface mount component (90) to the compliant layer (50).

Abstract translation: 组件的表面安装包括提供具有第一表面和第二表面的基底（10）。 第一表面的一部分耦合到被图案化的导电层（20）。 柔性层（50）被引入衬底（10）的第一表面和导电层（20）。 在柔性层（50）中形成至少一个孔，其延伸到导电层（20）的表面。 将导电材料引入孔中。 焊接将表面安装部件（90）耦合到柔性层（50）。

公开(公告)号：EP1558065A2

公开(公告)日：2005-07-27

申请号：EP05075085.0

申请日：2005-01-11

Applicant: Delphi Technologies, Inc.

Inventor： Chengalva, Mahesh K. ,  Chengalva, Suresh K. ,  Snyder, Rick B.

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K1/112 ,  H01L2224/16225 ,  H05K1/0271 ,  H05K3/4644 ,  H05K3/4688 ,  H05K2201/0133 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2201/10727 ,  Y02P70/611 ,  Y10T428/24273

Abstract: Surface mounting of components includes providing a substrate (10) that has a first surface and a second surface. A portion of the first surface is coupled to a conductive layer (20) that is patterned. A compliant layer (50) is introduced to the first surface of the substrate (10) and to the conductive layer (20). At least one aperture is formed in the compliant layer (50) which extends to the surface of the conductive layer (20). Conductive material is introduced into the aperture(s). Solder couples the surface mount component (90) to the compliant layer (50).