公开(公告)号：JP2010263205A

公开(公告)日：2010-11-18

申请号：JP2010096609

申请日：2010-04-20

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： KATOPIS GEORGE A ,  BUCHWALTER STEPHEN L ,  TSAPEPAS STELIOS G ,  KNICKERBOCKER JOHN U ,  PAUL S ANDRY ,  WEBB BUCKNELL C

IPC: H01L23/12 ,  H01L23/32

CPC classification number: H01L23/49827 ,  H01L24/16 ,  H01L24/17 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16146 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/00 ,  H01L2224/05552

Abstract: PROBLEM TO BE SOLVED: To provide an interposer substrate assembly such that an integrated circuit chip can be reworked, and to provide an electronic device assembly and a method of manufacturing them. SOLUTION: A substrate 310 is fabricated of a material having a first thermal expansivity; and an interposer 330 is fabricated of a material having a second thermal expansivity different from the first expansivity. There is a coefficient of thermal expansion mismatch between the substrate 310 and the interposer 330 or chip 320. The interposer 330 is coupled to the substrate 310 via a first plurality of electrical contacts 315 and an underfill adhesive 316 at least partially surrounding the electrical contacts 315 to bond the interposer 330 to the substrate 310, thereby reducing strain applied on the first electrical contacts 315. The integrated circuit chip 320 is coupled to the interposer 330 via a second plurality of electrical contacts 325 without use of an adhesive surrounding the second plurality of electrical contacts 325. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供一种插入器基板组件，使得可以对集成电路芯片进行返工，并提供电子器件组件及其制造方法。 解决方案：衬底310由具有第一热膨胀性的材料制成; 并且插入件330由具有不同于第一扩展性的第二热膨胀性的材料制成。 衬底310和插入器330或芯片320之间存在热膨胀失配系数。插入器330经由第一多个电触点315和底部填充粘合剂316耦合到衬底310，至少部分地围绕电触头315 以将内插器330接合到基板310，从而减小施加在第一电触点315上的应变。集成电路芯片320经由第二多个电触点325而耦合到插入器330，而不使用围绕第二多个 电触点325.版权所有（C）2011，JPO＆INPIT

公开(公告)号：DE68916523T2

公开(公告)日：1995-02-02

申请号：DE68916523

申请日：1989-11-17

Applicant: IBM

Inventor： VIEHBECK ALFRED ,  BUCHWALTER STEPHEN L ,  DONSON WILLIAM A ,  GLENNING JOHN J ,  GOLDBERG MARTIN J ,  GREBE KURT R ,  KOVAC CAROLINE A ,  MATTHEW LINDA C ,  PAWLOWSKI WALTER P ,  SCHADT MARK J ,  SCHEUERMANN MICHAEL R ,  TISDALE STEPHEN L

IPC: C23C18/20 ,  C08J5/12 ,  C08J7/00 ,  C23C18/16 ,  C23C18/28 ,  H05K3/38

公开(公告)号：CA2031594A1

公开(公告)日：1991-06-06

申请号：CA2031594

申请日：1990-12-05

Applicant: IBM

Inventor： BUCHWALTER STEPHEN L ,  GOLDBERG MARTIN J ,  IYENGAR REVATHI ,  MORRIS DANIEL P ,  O'TOOLE TERRENCE R ,  VIEHBECK ALFRED

IPC: G02F1/15 ,  C09K9/00 ,  C09K9/02 ,  G09F9/30 ,  G09G3/38 ,  H01B1/12 ,  C07D487/04 ,  C07D519/00 ,  C09B57/00 ,  G02F1/153

公开(公告)号：CA1335340C

公开(公告)日：1995-04-25

申请号：CA605524

申请日：1989-07-13

Applicant: IBM

Inventor： VIEHBECK ALFRED ,  BUCHWALTER STEPHEN L ,  DONSON WILLIAM A ,  GLENNING JOHN J ,  GOLDBERG MARTIN J ,  GREBE KURT R ,  KOVAC CAROLINE A ,  MATTHEW LINDA C ,  PAWLOWSKI WALTER P ,  SCHADT MARK J ,  SCHEUERMANN MICHAEL R ,  TISDALE STEPHEN L

IPC: C23C18/20 ,  C08J5/12 ,  C08J7/00 ,  C23C18/16 ,  C23C18/28 ,  H05K3/38 ,  B32B31/12 ,  C08J7/14 ,  C25D5/56

Abstract: Certain organic polymeric materials are capable of reversibly accepting or donating electrons from a reducing entity. The redox sites in the polymer accept electrons and, as a result, a change in the properties of the polymer occurs. This change is useful in modifying or etching the polymeric material. The material can be modified by incorporation of metallic seeds into the material at a controlled depth. The seeds are incorporated by interaction of cations of the metals with the redox sites in the polymer, which cause the reduction of the cations to form the neutral metallic seeds. Subsequent exposure of the polymeric material containing the seeds to an electroless bath causes further deposition of metal having the desirable characteristic of good adhesion to the polymeric material. Etching of the polymeric material can be carried out as a result of an increase in solubility of the polymer in aprotic solvents when its redox sites have accepted electrons. The increased solubility allows openings to be etched in certain areas of the polymeric material that have been reduced, leaving other areas unchanged.

公开(公告)号：DE69012755T2

公开(公告)日：1995-03-30

申请号：DE69012755

申请日：1990-12-04

Applicant: IBM

Inventor： BUCHWALTER STEPHEN L ,  GOLDBERG MARTIN J ,  IYENGAR REVATHI ,  O'TOOLE TERRENCE R ,  VIEHBECK ALFRED

IPC: G02F1/15 ,  C09K9/00 ,  C09K9/02 ,  G09F9/30 ,  G09G3/38 ,  H01B1/12 ,  G02F1/17

公开(公告)号：BR9007090A

公开(公告)日：1992-01-28

申请号：BR9007090

申请日：1990-12-04

Applicant: IBM

Inventor： BUCHWALTER STEPHEN L ,  GOLDBERG MARTIN J ,  IVENGAR REVATHI ,  MORRIS DANIEL P ,  O'TOOLE TERRENCE R ,  VIEHBECK ALFRED

IPC: G02F1/15 ,  C09K9/00 ,  C09K9/02 ,  G09F9/30 ,  G09G3/38 ,  H01B1/12 ,  G02F1/23

公开(公告)号：CA2031594C

公开(公告)日：1998-04-28

申请号：CA2031594

申请日：1990-12-05

Applicant: IBM

Inventor： VIEHBECK ALFRED ,  IYENGAR REVATHI ,  O'TOOLE TERRENCE R ,  GOLDBERG MARTIN J ,  BUCHWALTER STEPHEN L

IPC: G02F1/15 ,  C09K9/00 ,  C09K9/02 ,  G09F9/30 ,  G09G3/38 ,  H01B1/12 ,  C07D487/04 ,  C07D519/00 ,  C09B57/00 ,  G02F1/153

Abstract: An electrochemical color change cell incorporating as a color changing agent intramolecular charge transfer salt or an intermolecular charge transfer salt. The intermolecular charge transfer salts and the intramolecular charge transfer salts have a plurality of oxidation states and a wide variation in color change. The intermolecular and intramolecular charge transfer salts preferably contain a violene moiety and a moiety having a carbonyl group conjugated to an aromatic moiety. The intramolecular charge transfer salts have a stable covalent radical-anion/radical-cation configuration. The intermolecular charge transfer salts have a stable ionic radical-anion/radical-cation configuration.

公开(公告)号：DE69218327D1

公开(公告)日：1997-04-24

申请号：DE69218327

申请日：1992-08-10

Applicant: IBM

Inventor： BUCHWALTER STEPHEN L ,  KOSBAR LAURA L ,  NEWMAN BERT H ,  POMPEO FRANK L

IPC: C08G59/02 ,  C07D303/24 ,  C08G59/00 ,  C08G59/18 ,  C08G59/22 ,  C08G59/24 ,  C08G59/42 ,  C08G59/50 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31 ,  C07D303/00 ,  H01L23/16

Abstract: Chips mounted into substrates are often encapsulated with a cured epoxy which is insoluble. The invention herein is the discovery that diepoxides with ketal linkages are soluble. This permits encapsulating chips, testing them for goodness and removing the chips for rework by dissolving the epoxy without destroying the chip or substrate.

公开(公告)号：DE69012755D1

公开(公告)日：1994-10-27

申请号：DE69012755

申请日：1990-12-04

Applicant: IBM

Inventor： BUCHWALTER STEPHEN L ,  GOLDBERG MARTIN J ,  IYENGAR REVATHI ,  O'TOOLE TERRENCE R ,  VIEHBECK ALFRED

IPC: G02F1/15 ,  C09K9/00 ,  C09K9/02 ,  G09F9/30 ,  G09G3/38 ,  H01B1/12 ,  G02F1/17

公开(公告)号：DE68916523D1

公开(公告)日：1994-08-04

申请号：DE68916523

申请日：1989-11-17

Applicant: IBM

Inventor： VIEHBECK ALFRED ,  BUCHWALTER STEPHEN L ,  DONSON WILLIAM A ,  GLENNING JOHN J ,  GOLDBERG MARTIN J ,  GREBE KURT R ,  KOVAC CAROLINE A ,  MATTHEW LINDA C ,  PAWLOWSKI WALTER P ,  SCHADT MARK J ,  SCHEUERMANN MICHAEL R ,  TISDALE STEPHEN L

IPC: C23C18/20 ,  C08J5/12 ,  C08J7/00 ,  C23C18/16 ,  C23C18/28 ,  H05K3/38