公开(公告)号：EP0419804B1

公开(公告)日：1997-12-29

申请号：EP90114446

申请日：1990-07-27

Applicant: IBM

Inventor： ARBACH GARY V ,  O'TOOLE TERRENCE R ,  VIEHBECK ALFRED

IPC: C08G73/10 ,  C23C18/16 ,  C23C18/31 ,  C25D5/02 ,  C25D5/54 ,  C25D7/00 ,  H01L21/48 ,  H01L23/12 ,  H05K1/03 ,  H05K3/00 ,  H05K3/10 ,  H05K3/18 ,  H05K3/24

CPC classification number: H01L21/4846 ,  C23C18/1608 ,  C23C18/1641 ,  C23C18/2086 ,  C23C18/2093 ,  C23C18/30 ,  C23C18/32 ,  C23C18/38 ,  C23C18/42 ,  C25D5/022 ,  C25D5/54 ,  H05K1/0346 ,  H05K3/0023 ,  H05K3/0041 ,  H05K3/107 ,  H05K3/184 ,  H05K3/188 ,  H05K2201/0154 ,  Y10S205/926

公开(公告)号：DE69201076T2

公开(公告)日：1995-06-29

申请号：DE69201076

申请日：1992-03-16

Applicant: IBM

Inventor： FRANK ERNEST R ,  O'TOOLE TERRENCE R ,  VIEHBECK ALFRED

IPC: C08G73/10 ,  C09D5/44 ,  H01B3/30 ,  H01L23/29

公开(公告)号：CA2031594A1

公开(公告)日：1991-06-06

申请号：CA2031594

申请日：1990-12-05

Applicant: IBM

Inventor： BUCHWALTER STEPHEN L ,  GOLDBERG MARTIN J ,  IYENGAR REVATHI ,  MORRIS DANIEL P ,  O'TOOLE TERRENCE R ,  VIEHBECK ALFRED

IPC: G02F1/15 ,  C09K9/00 ,  C09K9/02 ,  G09F9/30 ,  G09G3/38 ,  H01B1/12 ,  C07D487/04 ,  C07D519/00 ,  C09B57/00 ,  G02F1/153

公开(公告)号：DE69012755D1

公开(公告)日：1994-10-27

申请号：DE69012755

申请日：1990-12-04

Applicant: IBM

Inventor： BUCHWALTER STEPHEN L ,  GOLDBERG MARTIN J ,  IYENGAR REVATHI ,  O'TOOLE TERRENCE R ,  VIEHBECK ALFRED

IPC: G02F1/15 ,  C09K9/00 ,  C09K9/02 ,  G09F9/30 ,  G09G3/38 ,  H01B1/12 ,  G02F1/17

公开(公告)号：CA2031594C

公开(公告)日：1998-04-28

申请号：CA2031594

申请日：1990-12-05

Applicant: IBM

Inventor： VIEHBECK ALFRED ,  IYENGAR REVATHI ,  O'TOOLE TERRENCE R ,  GOLDBERG MARTIN J ,  BUCHWALTER STEPHEN L

IPC: G02F1/15 ,  C09K9/00 ,  C09K9/02 ,  G09F9/30 ,  G09G3/38 ,  H01B1/12 ,  C07D487/04 ,  C07D519/00 ,  C09B57/00 ,  G02F1/153

Abstract: An electrochemical color change cell incorporating as a color changing agent intramolecular charge transfer salt or an intermolecular charge transfer salt. The intermolecular charge transfer salts and the intramolecular charge transfer salts have a plurality of oxidation states and a wide variation in color change. The intermolecular and intramolecular charge transfer salts preferably contain a violene moiety and a moiety having a carbonyl group conjugated to an aromatic moiety. The intramolecular charge transfer salts have a stable covalent radical-anion/radical-cation configuration. The intermolecular charge transfer salts have a stable ionic radical-anion/radical-cation configuration.

公开(公告)号：DE69031855D1

公开(公告)日：1998-02-05

申请号：DE69031855

申请日：1990-07-27

Applicant: IBM

Inventor： ARBACH GARY V ,  O'TOOLE TERRENCE R ,  VIEHBECK ALFRED

IPC: C23C18/16 ,  C23C18/31 ,  C25D5/02 ,  C25D5/54 ,  C08G73/10 ,  C25D7/00 ,  H01L21/48 ,  H01L23/12 ,  H05K1/03 ,  H05K3/00 ,  H05K3/10 ,  H05K3/18 ,  H05K3/24

Abstract: Structures and methods of fabrication thereof wherein the method selectively supplies electrons to a first electroactive material in the presence of a second electroactive material wherein the first and second electroactive materials have different redox potentials. The electrons are selectively supplied either by electrochemical means or by appropriately chosen reducing agents. A structure fabricated by these methods has a first electroactive body disposed on a second electroactive body wherein the first body has a pattern therein exposing at the base thereof the surface of the second electroactive material body. Electrons can be selectively supplied to the surface of the second electroactive material body which is exposed at the base of the pattern in the first electroactive material body. Upon exposing the structure to a seeding solution seed is selectively supplied to those regions to which electrons have been selectively supplied. Electrically conductive material can then be electrolessly deposited onto the seed material to form an electrically conductive pattern in the pattern in the first electroactive body. The electroactive material bodies are preferably polyimide materials. The structures can be used as the top metallization levels of an electronic device such as a semiconductor chip or a semiconductor chip packaging substrate.

公开(公告)号：DE69012755T2

公开(公告)日：1995-03-30

申请号：DE69012755

申请日：1990-12-04

Applicant: IBM

Inventor： BUCHWALTER STEPHEN L ,  GOLDBERG MARTIN J ,  IYENGAR REVATHI ,  O'TOOLE TERRENCE R ,  VIEHBECK ALFRED

IPC: G02F1/15 ,  C09K9/00 ,  C09K9/02 ,  G09F9/30 ,  G09G3/38 ,  H01B1/12 ,  G02F1/17

公开(公告)号：BR9007090A

公开(公告)日：1992-01-28

申请号：BR9007090

申请日：1990-12-04

Applicant: IBM

Inventor： BUCHWALTER STEPHEN L ,  GOLDBERG MARTIN J ,  IVENGAR REVATHI ,  MORRIS DANIEL P ,  O'TOOLE TERRENCE R ,  VIEHBECK ALFRED

IPC: G02F1/15 ,  C09K9/00 ,  C09K9/02 ,  G09F9/30 ,  G09G3/38 ,  H01B1/12 ,  G02F1/23

公开(公告)号：CA2089791C

公开(公告)日：1998-11-24

申请号：CA2089791

申请日：1993-02-18

Applicant: IBM

Inventor： BRADY MICHAEL J ,  MARINO JEFFREY R ,  FARRELL CURTIS E ,  KANG SUNG K ,  PURUSHOTHAMAN SAMPATH ,  MIKALSEN DONALD J ,  MOSKOWITZ PAUL A ,  O'SULLIVAN EUGENE J ,  O'TOOLE TERRENCE R ,  RIELEY SHELDON C ,  WALKER GEORGE F

IPC: H01L21/60 ,  C23C18/50 ,  C25D3/54 ,  H01L21/288 ,  H01L21/603 ,  H01L21/768 ,  H01L23/495 ,  H01L23/498 ,  H01L23/532

Abstract: Silicon and germanium containing materials are used as a surface of conductors i n electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these s urfaces. These materials are used as a surface coating for lead frames for packaging inte grated circuit chips. These materials can be decal transferred onto conductor surfaces or elect rolessly or electrolytically disposed thereon.

公开(公告)号：DE69201076D1

公开(公告)日：1995-02-16

申请号：DE69201076

申请日：1992-03-16

Applicant: IBM

Inventor： FRANK ERNEST R ,  O'TOOLE TERRENCE R ,  VIEHBECK ALFRED

IPC: C08G73/10 ,  C09D5/44 ,  H01B3/30 ,  H01L23/29