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    2.
    发明专利
    未知

    公开(公告)号：DE69332196D1

    公开(公告)日：2002-09-19

    申请号：DE69332196

    申请日：1993-03-22

    Applicant: IBM

    Inventor： FERENCE THOMAS GEORGE ,  GRUBER PETER ALFRED ,  HERNANDEZ BERNARDO ,  PALMER MICHAEL JOHN ,  ZINGHER ARTHUR RICHARD

    IPC: B23K3/00 ,  B23K1/20 ,  B23K3/06 ,  B29C45/00 ,  H05K3/34 ,  H01L21/48 ,  H01L21/00

    Abstract: An apparatus and method are described for injection molding solder mounds onto electronic devices. The apparatus has a reservoir (46) for molten solder which is disposed over a cavity in an injection plate (34). The injection plate is disposed over a mold (32) having an array of cavities therein into which solder is injection molded. The mold is disposed over a workpiece (50), such as a semiconductor chip or a semiconductor chip packaging substrate. The cavities in the mold are aligned with electrical contact locations on the chip or substrate. The workpiece is heated and the molten solder is forced under gas pressure into the cavity (68) in the injection plate (34) disposed above the array of cavities in the mold. The molten solder is forced into the array of cavities in the mold. The injection plate (34) is advanced to slide over the mold to wipe away the excess solder above the mold at a plurality of wiping apertures in the injection plate. The injection plate is further advanced to a location having a nonsolder wettable surface at which location the injection plate is removed. The mold is then removed to leave solder mounds disposed on the workpiece. The workpiece can be a semiconductor chip, a semiconductor chip packaging substrate or a dummy substrate onto which the injected molded solder adheres such as a polymer layer to form a carrier substrate for a solder mound array which can be subsequently transferred to a substrate such as a semiconductor chip or a semiconductor chip packaging substrate. The apparatus and methods of the present invention can be integrated into an automated manufacturing system for depositing an array of solder mounds onto a substrates.

    MANUFACTURE OF LAMINATED ELECTRONIC SUBSTRATES INVOLVING ELECTRICAL INSPECTION
    3.
    发明专利
    MANUFACTURE OF LAMINATED ELECTRONIC SUBSTRATES INVOLVING ELECTRICAL INSPECTION 未知

    公开(公告)号：DE3276679D1

    公开(公告)日：1987-08-06

    申请号：DE3276679

    申请日：1982-04-27

    Applicant: IBM

    Inventor： ZINGHER ARTHUR RICHARD

    IPC: H05K3/46 ,  H01L21/00 ,  H01L21/66 ,  H05K1/02 ,  H05K1/03 ,  H05K13/08 ,  H01L21/48 ,  G01R31/28

    Abstract: A method of manufacturing substrates for LSI chips starts with the usual steps of punching holes in green sheets, screening patterning paste (adapted to form cermet conductors or the like after firing) onto the greensheets, and inspecting the greensheets optically. Subsets of green sheets are then stacked and compressed into sub-laminates. The sub-laminates are then functionally inspected electrical i.e. before firing the greensheets. Inspection is done by means of electromechanical contact, scanning electron microscope like techniques, or by other means (e.g. light or ions) of irradiating the conductors to energize them for electrical measurement. Secondary electrons can measure the specimen's potential locally or change its charge. This method can also be employed for the purpose of inspecting other multilayer structures (such as large multilayer printed circuits formed on a plastic base) prior to final assembly of the conductors and the various substrates into a laminated support for electrical circuits.

    4.
    发明专利
    未知

    公开(公告)号：DE69332196T2

    公开(公告)日：2003-05-15

    申请号：DE69332196

    申请日：1993-03-22

    Applicant: IBM

    Inventor： FERENCE THOMAS GEORGE ,  GRUBER PETER ALFRED ,  HERNANDEZ BERNARDO ,  PALMER MICHAEL JOHN ,  ZINGHER ARTHUR RICHARD

    IPC: B23K3/00 ,  B23K1/20 ,  B23K3/06 ,  B29C45/00 ,  H05K3/34 ,  H01L21/48 ,  H01L21/00

    Abstract: An apparatus and method are described for injection molding solder mounds onto electronic devices. The apparatus has a reservoir (46) for molten solder which is disposed over a cavity in an injection plate (34). The injection plate is disposed over a mold (32) having an array of cavities therein into which solder is injection molded. The mold is disposed over a workpiece (50), such as a semiconductor chip or a semiconductor chip packaging substrate. The cavities in the mold are aligned with electrical contact locations on the chip or substrate. The workpiece is heated and the molten solder is forced under gas pressure into the cavity (68) in the injection plate (34) disposed above the array of cavities in the mold. The molten solder is forced into the array of cavities in the mold. The injection plate (34) is advanced to slide over the mold to wipe away the excess solder above the mold at a plurality of wiping apertures in the injection plate. The injection plate is further advanced to a location having a nonsolder wettable surface at which location the injection plate is removed. The mold is then removed to leave solder mounds disposed on the workpiece. The workpiece can be a semiconductor chip, a semiconductor chip packaging substrate or a dummy substrate onto which the injected molded solder adheres such as a polymer layer to form a carrier substrate for a solder mound array which can be subsequently transferred to a substrate such as a semiconductor chip or a semiconductor chip packaging substrate. The apparatus and methods of the present invention can be integrated into an automated manufacturing system for depositing an array of solder mounds onto a substrates.

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