Process for forming device comprising metallized magnetic substrates
    1.
    发明公开
    Process for forming device comprising metallized magnetic substrates 有权
    用于形成包括金属化磁性衬底的器件的方法

    公开(公告)号:EP0936639A3

    公开(公告)日:1999-09-29

    申请号:EP99300743.4

    申请日:1999-02-02

    Abstract: The invention provides an improved process for fabricating devices containing metallized magnetic ceramic material, such as inductors, transformers, and magnetic substrates. In particular, the unique vias utilized in the process of the invention allow fabrication of devices from multiple unfired ferrite layers with only a single via-coating step, thereby avoiding the need numerous punching steps. Moreover, there is no need for expanding the dimensions of the vias and thus no need for internal metallization. The invention therefore provides for green tape-type fabrication of devices such as inductors, transformers, and magnetic substrates in a manner faster, less complex, and more reliable than current methods. The invention also relates to use of an improved conductive material in such a process, the conductive material containing silver/palladium particles, ferrite particles, a cellulose-based or other organic binder, and a solvent. After firing of the substrate onto which the ink has been coated, and plating of copper thereon by a copper pyrophosphate bath, the plated copper exhibits a pull strength greater than about 4 kpsi, advantageously greater than about 5 kpsi. Use of a copper pyrophosphate bath also allow uniform plating within long, narrow vias.

    Abstract translation: 本发明提供了一种用于制造含有金属化磁性陶瓷材料的器件的改进方法,例如电感器,变压器和磁性基片。 具体地,本发明的工艺中使用的独特通孔允许仅用单个通孔涂覆步骤来制造来自多个未烧制铁氧体层的器件,从而避免需要多次冲压步骤。 而且,不需要扩大通孔的尺寸,因此不需要内部金属化。 因此,本发明以比现有方法更快,更简单和更可靠的方式提供了诸如电感器,变压器和磁性基板之类的器件的生带式制造。 本发明还涉及在这种方法中使用改进的导电材料,所述导电材料包含银/钯颗粒,铁氧体颗粒,纤维素基或其他有机粘合剂和溶剂。 在其上已经涂覆油墨的基底烧制之后,并且通过焦磷酸铜浴对其上的铜进行电镀之后,电镀的铜表现出大于约4kpsi的拉伸强度,有利地大于约5kpsi。 使用焦磷酸铜镀液还可以在长而狭窄的通孔内均匀镀覆。

    Process for fabricating silica article utilizing sol-gel extrusion
    2.
    发明公开
    Process for fabricating silica article utilizing sol-gel extrusion 有权
    Verfahren zum Herstellen einesKörpersaus Silica durch Extrusion eines溶胶 - 凝胶

    公开(公告)号:EP0905093A1

    公开(公告)日:1999-03-31

    申请号:EP98307231.5

    申请日:1998-09-08

    CPC classification number: C04B35/14 C03B19/12 C04B35/624

    Abstract: The invention is a sol-gel extrusion process which allows fabrication of both thick and thin wall tubes. For example, the process is capable of preparing silica overcladding tubes in a manner easier than sol-gel casting processes, and also capable of preparing relatively thin substrate tubes, which are difficult to cast. According to the invention, a silica dispersion containing a stabilizing agent is provided, a gelling agent is added to the dispersion to induce gellation, and the resultant gel is extruded into a silica body, in the substantial absence, i.e. less than 0.5%wt., of polymeric material from the gel. Substantially avoiding the inclusion of such polymeric material in overcladding and substrate tubes offers significant commercial advantages by reducing the time and energy required to remove organic materials from the tube bodies, by reducing environmental impact and by reducing the amount of impurities introduced in the tubes.

    Abstract translation: 本发明是一种溶胶 - 凝胶挤出方法,其允许制造厚壁和薄壁管。 例如,该方法能够以比溶胶 - 凝胶浇铸方法更容易的方式制备二氧化硅外包管,并且还能够制备难以铸造的相对薄的基材管。 根据本发明,提供了含有稳定剂的二氧化硅分散体,向分散体中加入胶凝剂以引发凝胶化,并将所得凝胶挤出成二氧化硅体,基本上不存在,即小于0.5重量%。 ,来自凝胶的聚合物材料。 通过减少从管体中除去有机材料所需的时间和能量,通过减少环境影响和减少引入管中的杂质量,基本上避免了这种聚合物材料在外包装和底物管中的包含。

    Process for forming device comprising metallized magnetic substrates
    5.
    发明公开
    Process for forming device comprising metallized magnetic substrates 审中-公开
    用于形成包括金属化磁性衬底的器件的方法

    公开(公告)号:EP1017068A2

    公开(公告)日:2000-07-05

    申请号:EP00107371.7

    申请日:1999-02-02

    Abstract: The invention provides an improved process for fabricating devices containing metallized magnetic ceramic material, such as inductors, transformers, and magnetic substrates. The invention relates to use of an improved conductive material in such a process, the conductive material containing silver/palladium particles, ferrite particles, a cellulose-based or other organic binder, and a solvent. After firing of the substrate onto which the ink has been coated, and plating of copper thereon by a copper pyrophosphate bath, the plated copper exhibits a pull strength greater than about 4 kpsi, advantageously greater than about 5 kpsi. Use of a copper pyrophosphate bath also allow uniform plating within long, narrow vias.

    Abstract translation: 本发明提供了一种用于制造含有金属化磁性陶瓷材料的器件的改进方法,例如电感器,变压器和磁性基片。 本发明涉及在这种方法中使用改进的导电材料,所述导电材料包含银/钯颗粒,铁氧体颗粒,纤维素基或其他有机粘合剂和溶剂。 在其上已经涂覆油墨的基底烧制之后,并且通过焦磷酸铜浴对其上的铜进行电镀之后,电镀的铜表现出大于约4kpsi的拉伸强度,有利地大于约5kpsi。 使用焦磷酸铜镀液还可以在长而狭窄的通孔内均匀镀覆。

    Process for forming device comprising metallized magnetic substrates
    6.
    发明公开
    Process for forming device comprising metallized magnetic substrates 有权
    一种用于制备阵列处理具有金属化磁性基体

    公开(公告)号:EP0936639A2

    公开(公告)日:1999-08-18

    申请号:EP99300743.4

    申请日:1999-02-02

    Abstract: The invention provides an improved process for fabricating devices containing metallized magnetic ceramic material, such as inductors, transformers, and magnetic substrates. In particular, the unique vias utilized in the process of the invention allow fabrication of devices from multiple unfired ferrite layers with only a single via-coating step, thereby avoiding the need numerous punching steps. Moreover, there is no need for expanding the dimensions of the vias and thus no need for internal metallization. The invention therefore provides for green tape-type fabrication of devices such as inductors, transformers, and magnetic substrates in a manner faster, less complex, and more reliable than current methods. The invention also relates to use of an improved conductive material in such a process, the conductive material containing silver/palladium particles, ferrite particles, a cellulose-based or other organic binder, and a solvent. After firing of the substrate onto which the ink has been coated, and plating of copper thereon by a copper pyrophosphate bath, the plated copper exhibits a pull strength greater than about 4 kpsi, advantageously greater than about 5 kpsi. Use of a copper pyrophosphate bath also allow uniform plating within long, narrow vias.

    Abstract translation: 本发明提供了对用于制造含金属化陶瓷磁性材料,彩色设备改进的方法:例如电感器,变压器,和磁性基片。 特别地,在本发明的方法中使用的独特的通孔允许来自多个未焙烧铁氧体层器件的制造仅具有单个经由涂步骤,从而避免需要大量的冲孔步骤。 更完了,没有必要扩大通孔的尺寸,从而无需内部金属化。 本发明因此提供用于设备的生带型制造:例如电感器,变压器,和磁性基片的方式更快,更复杂的,并且比现有方法更可靠。 因此本发明涉及在搜索过程中使用的改进的导电性材料,含有银/钯颗粒,铁氧体颗粒,纤维素系或其它有机粘合剂和溶剂的导电材料。 由焦磷酸铜浴中烧制在其上的墨水已经被涂覆在基底,并在其上的铜镀覆之后,将镀铜表现出拉拔强度超过约4千磅,有利地小于约5千磅更大更大。 焦磷酸铜浴中的使用,以便允许长而窄的通孔内均匀的镀覆。

    Process for forming device comprising metallized magnetic substrates
    8.
    发明公开
    Process for forming device comprising metallized magnetic substrates 审中-公开
    一种用于制备阵列处理具有金属化磁性基体

    公开(公告)号:EP1017068A3

    公开(公告)日:2000-07-12

    申请号:EP00107371.7

    申请日:1999-02-02

    Abstract: The invention provides an improved process for fabricating devices containing metallized magnetic ceramic material, such as inductors, transformers, and magnetic substrates. The invention relates to use of an improved conductive material in such a process, the conductive material containing silver/palladium particles, ferrite particles, a cellulose-based or other organic binder, and a solvent. After firing of the substrate onto which the ink has been coated, and plating of copper thereon by a copper pyrophosphate bath, the plated copper exhibits a pull strength greater than about 4 kpsi, advantageously greater than about 5 kpsi. Use of a copper pyrophosphate bath also allow uniform plating within long, narrow vias.

    Abstract translation: 本发明提供了对用于制造含金属化陶瓷磁性材料,彩色设备改进的方法:例如电感器,变压器,和磁性基片。 本发明涉及在搜索过程中使用的改进的导电性材料,含有银/钯颗粒,铁氧体颗粒,纤维素系或其它有机粘合剂和溶剂的导电材料。 由焦磷酸铜浴中烧制在其上的墨水已经被涂覆在基底,并在其上的铜镀覆之后,将镀铜表现出拉拔强度超过约4千磅,有利地小于约5千磅更大更大。 焦磷酸铜浴中的使用,以便允许长而窄的通孔内均匀的镀覆。

    Temperature compensated optical fiber refractive index grating
    9.
    发明公开
    Temperature compensated optical fiber refractive index grating 失效
    温度补偿光纤折射率光栅

    公开(公告)号:EP0828169A3

    公开(公告)日:1998-04-15

    申请号:EP97306798.6

    申请日:1997-09-02

    CPC classification number: G02B6/0218 G02B6/4238 G02B6/4239

    Abstract: Conventional optical gratings are relatively temperature sensitive. This sensitivity is generally undesirable but can be reduced or eliminated by attaching the grating to a support member (11) having a negative coefficient of thermal expansion. Exemplarily the member comprises Zr-tungstate and/or Hf-tungstate. The thermal expansion can be tailored by admixture of positive expansion coefficient material (e.g., Al 2 O 3 , SiO 2 ) to the negative expansion coefficient material (e.g., ZrW 2 O 8 ), or by a variety of other techniques.

    Abstract translation: 常规光栅相对温度敏感。 这种灵敏度通常是不希望的,但可以通过将光栅附着到具有负热膨胀系数的支撑构件(11)来减小或消除。 示例性地,该构件包含Zr钨酸盐和/或Hf钨酸盐。 热膨胀可以通过将正膨胀系数材料(例如,Al 2 O 3,SiO 2)与负膨胀系数材料(例如ZrW 2 O 8)混合或通过各种其他技术来调整。

    Process for fabricating sol-gel article involving low-shrinkage formulation
    10.
    发明公开
    Process for fabricating sol-gel article involving low-shrinkage formulation 有权
    一种用于从具有低收缩率的制剂制备的溶胶 - 凝胶制品的方法

    公开(公告)号:EP1215180A1

    公开(公告)日:2002-06-19

    申请号:EP01305477.0

    申请日:2001-06-25

    CPC classification number: C03B19/12 C03C1/006

    Abstract: A silica sol-gel fabrication process is provided which allows improved control of the shrinkage that takes place during the drying of a gel body. In particular, the invention makes it possible to attain extremely low shrinkage through the completion of the drying stage, e.g., below 1% linear shrinkage, in relatively large sol-gel bodies of (dry weight) 1 kg or more, typically 10 kg or more, or even 40 kg or more, compared to the much higher shrinkages typically encountered. Specifically, use of a particular polymeric additive makes it possible for a gel body to experience linear shrinkage at least 55% less than an identical process without the polymeric additive.

    Abstract translation: 本发明提供一种二氧化硅的溶胶 - 凝胶的制造工艺,其允许改进的收缩的控制发生的凝胶体的干燥过程中发生一样。 特别地,本发明使得有可能通过干燥阶段完成达到极低的收缩率,例如,低于1%的线性收缩率(干重)相对较大的溶胶 - 凝胶体1 kg或更高,通常为10千克或 更多,或甚至40公斤以上,相比于典型地遇到的高得多的收缩。 具体而言,使用特定的聚合物添加剂的使得能够对凝胶体经历线性收缩比在相同的工艺少至少55%,而不聚合物添加剂。

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