公开(公告)号：US20210074606A1

公开(公告)日：2021-03-11

申请号：US16952080

申请日：2020-11-19

Applicant: Unimicron Technology Corp.

Inventor： Pei-Wei Wang ,  Ching Sheng Chen ,  Ra-Min Tain ,  Ming-Hao Wu ,  Hsuan-Wei Chen

IPC: H01L23/373 ,  H01L23/498 ,  H01L21/48

Abstract: A package structure including a circuit board and a heat generating element is provided. The circuit board includes a plurality of circuit layers and a composite material layer. A thermal conductivity of the composite material layer is between 450 W/mK and 700 W/mK. The heat generating element is disposed on the circuit board and electrically connected to the circuit layers. Heat generated by the heat generating element is transmitted to an external environment through the composite material layer.

公开(公告)号：US20240282687A1

公开(公告)日：2024-08-22

申请号：US18650005

申请日：2024-04-29

Applicant: Unimicron Technology Corp.

Inventor： Chih-Chiang Lu ,  Hsin-Ning Liu ,  Jun-Rui Huang ,  Pei-Wei Wang ,  Ching Sheng Chen ,  Shih-Lian Cheng

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H05K1/02 ,  H05K3/00 ,  H05K3/42 ,  H05K3/46

CPC classification number: H01L23/49827 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H05K1/0222 ,  H05K3/0094 ,  H05K3/429 ,  H05K3/4614 ,  H05K3/4623 ,  H01L24/16 ,  H01L2224/16227 ,  H05K2201/09509 ,  H05K2201/0959

Abstract: A manufacturing method of the circuit board includes the following steps. A metal layer, a first substrate, a second substrate, and a third substrate are laminated. Multiple blind holes and a through hole are formed. A conductive material layer is formed, which covers the metal layer, the conductive layer of the third substrate, and an inner wall of the through hole, and fills the blind holes to define multiple conductive holes. The conductive material layer, the metal layer, and the conductive layer are patterned to form a first external circuit layer located on the first substrate and electrically connected to the conductive pillars, and a second external circuit layer located on the insulating layer and electrically connected to the conductive holes, and define a conductive through hole structure connecting the first external circuit layer and the second external circuit layer and located in the through hole.

公开(公告)号：US12057381B2

公开(公告)日：2024-08-06

申请号：US17498757

申请日：2021-10-12

Applicant: Unimicron Technology Corp.

Inventor： Chih-Chiang Lu ,  Hsin-Ning Liu ,  Jun-Rui Huang ,  Pei-Wei Wang ,  Ching Sheng Chen ,  Shih-Lian Cheng

IPC: H01L23/498 ,  H01L21/48 ,  H05K1/02 ,  H05K3/00 ,  H05K3/42 ,  H05K3/46 ,  H01L23/00

CPC classification number: H01L23/49827 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H05K1/0222 ,  H05K3/0094 ,  H05K3/429 ,  H05K3/4614 ,  H05K3/4623 ,  H01L24/16 ,  H01L2224/16227 ,  H05K2201/09509 ,  H05K2201/0959

Abstract: A circuit board includes a first external circuit layer, a first substrate, a second substrate, a third substrate, and a conductive through hole structure. The first substrate includes conductive pillars electrically connecting the first external circuit layer and the second substrate. The second substrate has an opening and includes a first dielectric layer. The opening penetrates the second substrate, and the first dielectric layer fills the opening. The third substrate includes an insulating layer, a second external circuit layer, and conductive holes. A conductive material layer of the conductive through hole structure covers an inner wall of a through hole and electrically connects the first and the second external circuit layers to define a signal path. The first external circuit layer, the conductive pillars, the second substrate, the conductive holes and the second external circuit layer are electrically connected to define a ground path surrounding the signal path.

公开(公告)号：US11545412B2

公开(公告)日：2023-01-03

申请号：US16952080

申请日：2020-11-19

Applicant: Unimicron Technology Corp.

Inventor： Pei-Wei Wang ,  Ching Sheng Chen ,  Ra-Min Tain ,  Ming-Hao Wu ,  Hsuan-Wei Chen

IPC: H01L21/48 ,  H01L23/373 ,  H01L23/498

Abstract: A package structure including a circuit board and a heat generating element is provided. The circuit board includes a plurality of circuit layers and a composite material layer. A thermal conductivity of the composite material layer is between 450 W/mK and 700 W/mK. The heat generating element is disposed on the circuit board and electrically connected to the circuit layers. Heat generated by the heat generating element is transmitted to an external environment through the composite material layer.

公开(公告)号：US20220230949A1

公开(公告)日：2022-07-21

申请号：US17498757

申请日：2021-10-12

Applicant: Unimicron Technology Corp.

Inventor： Chih-Chiang Lu ,  Hsin-Ning Liu ,  Jun-Rui Huang ,  Pei-Wei Wang ,  Ching Sheng Chen ,  Shih-Lian Cheng

IPC: H01L23/498 ,  H01L21/48 ,  H05K1/02 ,  H05K3/46 ,  H05K3/42 ,  H05K3/00

Abstract: A circuit board includes a first external circuit layer, a first substrate, a second substrate, a third substrate, and a conductive through hole structure. The first substrate includes conductive pillars electrically connecting the first external circuit layer and the second substrate. The second substrate has an opening and includes a first dielectric layer. The opening penetrates the second substrate, and the first dielectric layer fills the opening. The third substrate includes an insulating layer, a second external circuit layer, and conductive holes. A conductive material layer of the conductive through hole structure covers an inner wall of a through hole and electrically connects the first and the second external circuit layers to define a signal path. The first external circuit layer, the conductive pillars, the second substrate, the conductive holes and the second external circuit layer are electrically connected to define a ground path surrounding the signal path.