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公开(公告)号:WO2021161295A1
公开(公告)日:2021-08-19
申请号:PCT/IB2021/052932
申请日:2021-04-08
Applicant: DEIANA, Roberto
Inventor: DEIANA, Roberto
IPC: B60K35/00 , G06F3/041 , H03K17/96 , H05K3/02 , G06F2203/04103 , G06F3/046 , H03K17/9505 , H03K2017/9507 , H05K1/0274 , H05K1/03 , H05K2201/0108 , H05K3/027 , H05K3/28
Abstract: A method for manufacturing touch controls (100) provided with surface symbols (105) backlit by light guide (109) is disclosed. Said touch controls (100) are used to detect the interaction between a finger (102) and the magnetic field (103) generated by conductive traces (104). In particular, a process is disclosed for making said conductive traces (104) and said light guide (109), so that they are free from dispersive phenomena and adapted to the typical aesthetic requirements for this type of products, namely an embossed surface finish or a smooth surface finish. The process comprises a combination between a layer of conductive coating (108) and a layer of insulating coating (107), said layers being applied to the inner surface, i.e., opposite the physical interaction area, of a transparent plastic support (101), said inner surface, generally the lower surface, being therefore in raw plastic material or already treated with decorative coatings.
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公开(公告)号:WO2021234146A2
公开(公告)日:2021-11-25
申请号:PCT/EP2021/063652
申请日:2021-05-21
Applicant: SCIO HOLDING GMBH
IPC: H05K3/30 , H05K3/28 , H05K3/40 , B60R13/00 , F21V8/00 , G09F13/04 , H05K1/11 , H05K1/18 , H01R4/18 , H01R12/58 , B60R13/005 , H05K1/0203 , H05K1/0265 , H05K2201/0108 , H05K2201/09227 , H05K2201/09236 , H05K2201/09736 , H05K2201/10022 , H05K2201/10106 , H05K2201/10303 , H05K2201/2054 , H05K2203/1476 , H05K3/0058 , H05K3/1216 , H05K3/284 , H05K3/305 , H05K3/4015
Abstract: Die Erfindung betrifft ein Verfahren zur Herstellung eines Bauteils (1), welches eine Leiterplatte (2) und eine Mehrzahl darauf angeordneter elektrischer Komponenten (3) umfasst. Erfindungsgemäß werden die elektrischen Komponenten (3) auf der aus Kunststoff ausgebildeten Leiterplatte (2) mittels eines Fixierklebstoffs (9) vorfixiert und danach mit einem UV-Klebstoff (8) vollständig vergossen.
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公开(公告)号:WO2021151429A2
公开(公告)日:2021-08-05
申请号:PCT/DE2021/100069
申请日:2021-01-25
Applicant: ELMOS SEMICONDUCTOR SE , TURCK DUOTEC GMBH , QUANTUM TECHNOLOGIES UG (HAFTUNGSBESCHRÄNKT)
Inventor: BURCHARD, Bernd , MEIJER, Jan , RÖNISCH, Arthur , STAACKE, Robert
IPC: G01R33/032 , G01R33/26 , H05K1/09 , C03C8/14 , F21V8/00 , G01N24/006 , G06N10/00 , G06N20/00 , G06N3/02 , G06N7/005 , H05K1/0274 , H05K2201/0108 , H05K2201/10151
Abstract: Die Erfindung betrifft ein Skalar-Magnetometer mit einem Sensorelement (NVD), einem Schaltungsträger (GPCB), einer Pumpstrahlungsquelle (PLED), einem Strahlungsempfänger (PD) und Auswertemitteln (ADC, IF). Die Pumpstrahlungsquelle (PLED) sendet Pumpstrahlung (LB) aus. Das Sensorelement (NVD) umfasst als paramagnetische Zentren bevorzugt ein oder mehrere NV-Zentren in Diamant. Dieses paramagnetische Zentrum des Sensorelements (NVD) emittiert bei Bestrahlung mit Pumpstrahlung (LB) eine Fluoreszenzstrahlung (FL), wobei die Intensität der Fluoreszenzstrahlung (FL) des paramagnetischen Zentrums von der magnetischen Flussdichte B am Ort des paramagnetischen Zentrums abhängt. Der Strahlungsempfänger (PD) wandelt das Intensitätssignal der Fluoreszenzstrahlung (FL) in ein Empfängerausgangssignal (SO) um. Die Auswertemittel (ADC, IF) sind dazu geeignet und bestimmt, den Wert des Empfängerausgangssignals (SO) als Messwert zu erfassen und/oder abzuspeichern und/oder weiterzugeben. Dabei ist bevorzugt das Material des Schaltungsträgers (GPCB) für die Pumpstrahlung (LB) im Strahlungspfad zwischen Pumpstrahlungsquelle (PLED) und Sensorelement (NVD) transparent und für die Fluoreszenzstrahlung (FL) im Strahlungspfad zwischen Sensorelement (NVD) und Strahlungsempfänger (PD) transparent. Die Komponenten Sensorelement (NVD), Pumpstrahlungsquelle (PLED), Strahlungsempfänger (PD) und Auswertemittel (ADC, IF) sind bevorzugt an dem Schaltungsträger (GPCB) mechanisch befestigt.
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公开(公告)号:WO2022220688A2
公开(公告)日:2022-10-20
申请号:PCT/NL2022/050492
申请日:2022-08-29
Inventor: HARKEMA, Stephan , TEUNISSEN, Jean-Pierre , RENTROP, Cornelis Hermanus Arnoldus , DE KOK, Margaretha Maria
IPC: H05K3/22 , H05K3/28 , H05K1/0284 , H05K1/0393 , H05K1/119 , H05K2201/0108 , H05K2201/0112 , H05K2201/09063 , H05K2201/09936 , H05K2201/10106 , H05K2201/10113 , H05K2201/10128 , H05K2201/2072 , H05K2203/074 , H05K2203/0746 , H05K2203/0763 , H05K2203/0783 , H05K2203/1316 , H05K2203/1322 , H05K2203/1327 , H05K2203/176 , H05K2203/178 , H05K3/0014 , H05K3/284
Abstract: An electronic device (100) is designed to be more easily recycled at its end of life while maintaining usability during its lifetime. The electronic device comprises a first substrate (11), an encapsulation layer (19), and a set of electronics (15) disposed there between. One or more delamination layers (12,18) cover at least one side, preferably both sides, of the set of electronics (15) to separate the set of electronics (15) from at least one, preferably both, of the first substrate (11) and the encapsulation layer (19). The set of electronics (15), covered by the one or more delamination layers (12,18), is encapsulated between the encapsulation layer (19) and the first substrate (11). At least one of the delamination layers (12,18) comprises a set of passages (12p,18p) filled with material of the encapsulation layer (19) forming a set of interconnections (19p) between the encapsulation layer (19) and the first substrate (11).
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公开(公告)号:WO2021130408A1
公开(公告)日:2021-07-01
申请号:PCT/FI2020/050850
申请日:2020-12-18
Applicant: TACTOTEK OY
Inventor: RAUTIO, Tapio , SIMULA, Tomi , PIRKONEN, Minna , TORVINEN, Jarkko , JUNKKARI, Tuukka , ASIKKALA, Janne , SINIVAARA, Hasse
IPC: H05K1/02 , H05K3/00 , H05K3/28 , H05K1/0277 , H05K1/0281 , H05K1/189 , H05K2201/0108 , H05K2201/0129 , H05K2201/091 , H05K2201/09118 , H05K2201/09781 , H05K2201/09909 , H05K2201/2009 , H05K2201/2027 , H05K2203/1327 , H05K3/0014 , H05K3/284
Abstract: Integrated functional multilayer structure (100), comprising asubstrate film (102) formed or formable so as to exhibit aselected shape (103); and a number of functional, preferably5including optical, mechanical, optoelectrical, electrical and/orspecifically, electronic, elements (110, 112, 114, 210), such asconductors (112), insulators (114), components (110, 210)and/or integrated circuits (110, 210), provided upon thesubstrate film in the proximity of the shape (103); wherein the0substrate film (102) has further been provided with a structuraltuning element (116, 316, 416, 616, 716, 816, 916, 1016),optionally comprising an elongated (316, 416), circumferential(616, 716) or other selected shape, said structural tuning elementbeing configured to locally control induced deformation,5optionally including stretching, bending, compression and/orshearing, of the substrate film within said proximity of the shape.Related method of manufacture is presented.Fig. 10
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公开(公告)号:WO2021122781A1
公开(公告)日:2021-06-24
申请号:PCT/EP2020/086471
申请日:2020-12-16
Applicant: VALEO VISION
Inventor: ZOJCESKI, Zdravko , VAL, Alexandre , DAROUSSIN, Samuel
IPC: H01L25/075 , H01L33/56 , H01L33/62 , H05K1/18 , H05K3/28 , H01L25/0753 , H05K1/0274 , H05K1/095 , H05K1/184 , H05K2201/0108 , H05K2201/10106 , H05K3/284
Abstract: L'invention concerne un ensemble lumineux (100) pour un dispositif d'éclairage et/ou de signalisation d'un véhicule automobile, comprenant une 5 pluralité de sources lumineuses élémentaires (1a, … 1i, … 1n) agencées sur un support (200). Dans l'ensemble lumineux (100) selon l'invention, chaque source lumineuse élémentaire (1a, … 1i, … 1n) est une diode électroluminescente reliée électriquement, d'une part, à une première couche conductrice (30) du support (200) et, d'autre part, à une deuxième couche 10 conductrice (31) du support (200), la première couche conductrice (30) et la deuxième couche conductrice (31) étant agencées de part et d'autre d'une épaisseur (20) du support (200). Dans l'ensemble lumineux (100) selon l'invention, chaque diode électroluminescente (1a, … 1i, … 1n) est placée dans un orifice d'accueil (5a, … 5i, … 5n) agencé dans le support (200), l'orifice 15 d'accueil (5a, … 5i, … 5n) s'étendant, respectivement, à travers la première couche conductrice (30) et à travers une épaisseur (20) du support (200) jusqu'à la deuxième couche conductrice (31), chaque diode électroluminescente (1a, … 1i, … 1n) étant partiellement encapsulée dans un matériau de recouvrement (80, 80') optiquement transparent et électriquement conducteur.
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