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    91.
    发明专利
    未知

    公开(公告)号：AT341822T

    公开(公告)日：2006-10-15

    申请号：AT01272461

    申请日：2001-11-26

    Applicant: INTEL CORP

    Inventor： MA QING ,  RAO VALLURI R ,  CHENG PENG

    IPC: H01G5/38 ,  B81B3/00 ,  H01G5/00 ,  H01G5/16 ,  H01L21/20

    Abstract: The present invention relates to a stepped micro electromechanical structure (MEMS) capacitor that is actuated by a plurality of MEMS switches. The MEMS switches may be within the stepped capacitor circuit, or they may be actuated by an independent circuit. The stepped capacitor may also be varied with intermediate steps of capacitance by providing at least one variable capacitor in the stepped MEMS capacitor structure.

    MICROELECTROMECHANICAL APPARATUS AND METHODS FOR SURFACE ACOUSTIC WAVE SWITCHING
    95.
    发明专利
    MICROELECTROMECHANICAL APPARATUS AND METHODS FOR SURFACE ACOUSTIC WAVE SWITCHING 未知

    公开(公告)号：AU2003256550A1

    公开(公告)日：2004-02-02

    申请号：AU2003256550

    申请日：2003-07-11

    Applicant: INTEL CORP A DELAWARE CORP A D

    Inventor： MA QING ,  SHIM DONG

    IPC: B81B3/00 ,  H03H9/02 ,  H03H9/05 ,  H03H9/25

    Abstract: Microelectromechanical system (MEMS) apparatus and methods for surface acoustic wave (SAW) switching are disclosed. The apparatus includes a piezoelectric substrate having spaced apart input and output SAW transducers. A MEMS switch is arranged between the input and output SAW transducers The MEMS switch has a deformable member in electromagnetic communication with one or more actuation electrodes formed on or above the substrate. The deformable member is deformable to mechanically contact the substrate to deflect or absorb a SAW generated by the input SAW transducer.

    PACKAGING MICROELECTROMECHANICAL STRUCTURES
    96.
    发明专利
    PACKAGING MICROELECTROMECHANICAL STRUCTURES 未知

    公开(公告)号：AU2003212969A1

    公开(公告)日：2003-10-13

    申请号：AU2003212969

    申请日：2003-02-07

    Applicant: INTEL CORP

    Inventor： WONG DANIEL ,  RAO VALLURI ,  HECK JOHN ,  MA QING ,  BERRY MICHELE

    IPC: B81B7/00 ,  H01L23/10

    Abstract: A MEMS device may be formed in a hermetic cavity by sealing a pair of semiconductor structures to one another, enclosing the MEMS device. The two structures may be coupled using surface mount techniques as one example, so that the temperatures utilized may be compatible with many MEMS applications. Electrical interconnection layers in one or the other of these structures may be utilized to allow electrical interconnections from the exterior world to the MEMS components within the cavity.

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    98.
    发明专利
    "SUBSTRATE FOR INTEGRATED CIRCUIT DEVICES INCLUDING MULTI-LAYER GLASS CORE AND METHODS OF MAKING THE SAME" 未知

    公开(公告)号：IN3251DEN2012A

    公开(公告)日：2015-10-23

    申请号：IN3251DEN2012

    申请日：2012-04-16

    Applicant: INTEL CORP

    Inventor： MA QING ,  HU CHUAN ,  MORROW PATRICK

    IPC: H01L23/485

    Abstract: Disclosed are embodiments of a substrate for an integrated circuit (IC) device. The substrate includes a core comprised of two or more discrete glass layers that have been bonded together. A separate bonding layer may be disposed between adjacent glass layers to couple these layers together. The substrate may also include build-up structures on opposing sides of the multi-layer glass core, or perhaps on one side of the core. Electrically conductive terminals may be formed on both sides of the substrate, and an IC die may be coupled with the terminals on one side of the substrate. The terminals on the opposing side may be coupled with a next-level component, such as a circuit board. One or more conductors extend through the multi-layer glass core, and one or more of the conductors may be electrically coupled with the build-up structures disposed over the core. Other embodiments are described and claimed.

    Architektur und Herstellung von induktiven Inertialsensoren in Verpackungsaufbauschichten
    99.
    发明专利
    Architektur und Herstellung von induktiven Inertialsensoren in Verpackungsaufbauschichten 未知

    公开(公告)号：DE112013000325T5

    公开(公告)日：2014-08-21

    申请号：DE112013000325

    申请日：2013-06-19

    Applicant: INTEL CORP

    Inventor： MA QING ,  LIN KEVIN L ,  SWAN JOHANNA M ,  TEH WENG HONG ,  RAO VALLURI R ,  EID FERAS

    IPC: G01C19/00 ,  B81C1/00 ,  G01C19/04 ,  G01P15/14

    Abstract: Diese Erfindung betrifft induktive Inertialsensoren, die einen Magnetantrieb und/oder eine Lesearchitektur verwenden. In Ausführungsformen verwenden translative Gyroskope eine leitfähige Spule zum Schwingen in einer ersten Dimension in Abhängigkeit von zeitveränderlichem Strom, der in Gegenwart eines Magnetfeldes durch die Spule geleitet wird. Lesespulen verzeichnen eine Induktivität, die in Abhängigkeit von einer Winkelgeschwindigkeit in einer zweiten Dimension variiert. In Ausführungsformen bringt die vibrierende Spule erste und zweite wechselseitige Induktivitäten in den Lesespulen dazu, in Abhängigkeit von der Winkelgeschwindigkeit voneinander abzuweichen. In Ausführungsformen variieren die Eigeninduktivitäten in Verbindung mit einem Paar mäanderförmiger Windungen in Abhängigkeit von einer Winkelgeschwindigkeit in einer zweiten Dimension. In Ausführungsformen werden Verpackungsaufbauschichten verwendet, um die induktiven Inertialsensoren herzustellen und integrierte Inertialermittlung auf Verpackungsebene zu ermöglichen, was in kleinen Formfaktor-Rechnerplattformen wie z. B. Mobilgeräten von Vorteil ist.

    Substrate for integrated circuit devices including multi-layer glass core and methods of making the same
    100.
    发明专利
    Substrate for integrated circuit devices including multi-layer glass core and methods of making the same 未知

    公开(公告)号：GB2488265B

    公开(公告)日：2014-04-30

    申请号：GB201208343

    申请日：2010-11-01

    Applicant: INTEL CORP

    Inventor： MA QING ,  HU CHUAN ,  MORROW PATRICK

    IPC: H01L23/485 ,  H05K3/46

    Abstract: Disclosed are embodiments of a substrate for an integrated circuit (IC) device. The substrate includes a core comprised of two or more discrete glass layers that have been bonded together. A separate bonding layer may be disposed between adjacent glass layers to couple these layers together. The substrate may also include build-up structures on opposing sides of the multi-layer glass core, or perhaps on one side of the core. Electrically conductive terminals may be formed on both sides of the substrate, and an IC die may be coupled with the terminals on one side of the substrate. The terminals on the opposing side may be coupled with a next-level component, such as a circuit board. One or more conductors extend through the multi-layer glass core, and one or more of the conductors may be electrically coupled with the build-up structures disposed over the core. Other embodiments are described and claimed.

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