RADIATION SENSITIVE RESIN COMPOSITION

    公开(公告)号:JPH10133369A

    公开(公告)日:1998-05-22

    申请号:JP34700797

    申请日:1997-12-01

    Applicant: JSR CORP

    Abstract: PROBLEM TO BE SOLVED: To provide the composition capable of suppressing the occurrence of scum, improved in developing property, high in sensitivity and excellent in heat resistance and residual film ratio by incorporating a specific alkali soluble resin and a specific 1,2-quinone diazide compound into the composition. SOLUTION: This radiation resin composition containing the alkali soluble resin having weight average molecular weight of 2000-20000 expressed in terms of polystyrene and the 1,2-quinone diazide compound expressed by formula is used. In the formula, P represents integers of 0 or 1, D represents hydroxide group or an organic group having 1,2-quinone diazide group and a part or the whole of D is the organic group having 1,2-quinone diazide group. Various blending agents such as a sensitizer, a surfactant, a dissolution accelerating agent can be added in the composition. A dye or a pigment can be added to the composition in order to visualize a latent image in a part irradiated with radiation and reduce the effect of halation at the time of irradiation of radiant ray, and an adhesive assistant can be added in order to improve adhesion.

    Radiation sensitive resin composition
    92.
    发明专利
    Radiation sensitive resin composition 审中-公开
    辐射敏感性树脂组合物

    公开(公告)号:JP2003005372A

    公开(公告)日:2003-01-08

    申请号:JP2001185662

    申请日:2001-06-19

    Abstract: PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition having high transparency particularly to ArF excimer laser light and excellent in basic solid state properties as a resist such as sensitivity, resolution and pattern shape.
    SOLUTION: The radiation sensitive resin composition contains (A) an acid dissociable group-containing resin which is made alkali-soluble by the action of an acid, such as a copolymer of an unsaturated ether typified by n-butyl vinyl ether or 3,4-dihydro-2H-pyran, maleic anhydride and 2-methyl-2-adamantyl (meth)acrylate and (B) a radiation sensitive acid generator typified by 2,5- hexylene-(1-n-butoxynapht-4-yl) sulfonium nonafluoro-n-butanesulfonate, 4-(2- norbornylmethoxy)naphthyltetrahydrothiophenium nonafluoro-n-butanesulfonate or 2,5-hexylene-(1-hydroxy-2,6-dimethylphen-4-yl)sulfonium nonafluoro-n- butanesulfonate.
    COPYRIGHT: (C)2003,JPO

    Abstract translation: 要解决的问题:提供具有高透明度的辐射敏感性树脂组合物,特别是ArF准分子激光,并且具有优异的基本固态特性,作为诸如灵敏度,分辨率和图案形状的抗蚀剂。 解决方案:辐射敏感性树脂组合物含有(A)含酸解离基团的树脂,其通过酸的作用而制成碱溶性,例如以正丁基乙烯基醚为代表的不饱和醚或3,4 - 二氢-2H-吡喃,马来酸酐和(甲基)丙烯酸2-甲基-2-金刚烷酯和(B)以2,5-亚己基 - (1-正丁氧基萘-4-基)锍为代表的辐射敏感酸产生剂 九氟正丁磺酸盐,4-(2-降冰片基甲氧基)萘基四氢噻吩六氟正丁磺酸盐或2,5-亚己基 - (1-羟基-2,6-二甲基苯-4-基)锍九氟正丁基磺酸盐。

    RADIATION SENSITIVE RESIN COMPOSITION

    公开(公告)号:JP2002229192A

    公开(公告)日:2002-08-14

    申请号:JP2001027408

    申请日:2001-02-02

    Applicant: JSR CORP

    Abstract: PROBLEM TO BE SOLVED: To provide a new radiation sensitive acid generating agent capable of giving positive and negative radiation sensitive resin compositions having high transparency particularly to far UV typified by ArF excimer laser light (193 nm wavelength) and excellent in sensitivity, resolution, pattern shape, etc., and to provide positive and negative radiation sensitive resin compositions containing the radiation sensitive acid generating agent. SOLUTION: The radiation sensitive acid generating agent is typified, e.g. by a compound having a sulfonium cation of formula (1), (2) or (3) and C4F9SO3- as a counter anion. The positive radiation sensitive resin composition contains the radiation sensitive acid generating agent and an acid dissociable group- containing resin. The negative radiation sensitive resin composition contains the radiation sensitive acid generating agent, an alkali-soluble resin and a crosslinker.

    RADIATION SENSITIVE RESIN COMPOSITION
    94.
    发明专利

    公开(公告)号:JP2002182393A

    公开(公告)日:2002-06-26

    申请号:JP2001303791

    申请日:2001-09-28

    Applicant: JSR CORP

    Abstract: PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition having high transparency to radiation, having excellent sensitivity, resolution, dry etching resistance, pattern shape, etc., and having small temperature dependence in heating after exposure. SOLUTION: The radiation sensitive resin composition contains (A) a resin comprising a copolymer of (meth)acrylic esters having an acid dissociable group- containing alicyclic structure represented by 5-t-butoxycarbonylnorbornyl (meth) acrylate and 8-t-butoxycarbonyltetracyclododecane (meth)acrylate and (meth) acrylic esters having a lactone-containing heterocyclic structure typified by compounds of formula (1) and (B) a radiation sensitive acid generating agent represented by 1-(3,5-dimethyl-4-hydroxyphenyl)tetrahydrothiophenium perfluoro-n- octanesulfonate, 1-(4-n-butoxy-1-naphthyl)tetrahydrothiophenium nonafluoro-n- butanesulfonate or the like.

    RADIATION SENSITIVE RESIN COMPOSITION

    公开(公告)号:JP2002072484A

    公开(公告)日:2002-03-12

    申请号:JP2001108824

    申请日:2001-04-06

    Applicant: JSR CORP IBM

    Abstract: PROBLEM TO BE SOLVED: To provide a new radiation sensitive resin composition having high transparency to radiation, having excellent basic properties as a resist, e.g. sensitivity, resolution and pattern shape, not causing development defects in microfabrication and capable of producing semiconductor devices in a high yield. SOLUTION: The radiation sensitive resin composition contains (A) an acid dissociable group-containing resin having a structure of formula (1) (where R1 is H, a monovalent acid dissociable group, an alkyl having no acid dissociable group or an alkylcarbonyl having no acid dissociable group; X1 is a 1-4C linear or branched fluoroalkyl; and R2 is H, a linear or branched alkyl or a linear or branched fluoroalkyl) and (B) a radiation sensitive acid generating agent.

    RADIATION SENSITIVE RESIN COMPOSITION

    公开(公告)号:JP2002023371A

    公开(公告)日:2002-01-23

    申请号:JP2000204223

    申请日:2000-07-05

    Applicant: JSR CORP

    Abstract: PROBLEM TO BE SOLVED: To provide a new radiation sensitive resin composition having high transparency to radiation, excellent in basic physical properties as a resist such as sensitivity, resolution and pattern shape, not causing development defects in microfabrication and capable of producing a semiconductor device in a high yield. SOLUTION: The radiation sensitive resin composition contains (A) a resin having at least one heterocyclic structure of formula (1) (where R1 is H, a 1-6C linear, branched or cyclic alkyl, a 1-6C linear, branched or cyclic alkoxy or a 2-7C linear, branched or cyclic alkoxycarbonyl) in a side chain and (B) a radiation sensitive acid generating agent.

    POSITIVE TYPE RADIATION SENSITIVE RESIN COMPOSITION

    公开(公告)号:JP2001330959A

    公开(公告)日:2001-11-30

    申请号:JP2000151175

    申请日:2000-05-23

    Applicant: JSR CORP

    Abstract: PROBLEM TO BE SOLVED: To provide a positive type radiation sensitive resin composition having high transparency to radiation, excellent in resolution, sensitivity, pattern shape, etc., causing no development defect in microfabrication and capable of producing a semiconductor device in a high yield. SOLUTION: The positive type radiation sensitive resin composition contains (A) an alkali-insoluble or slightly alkali-soluble acid dissociable group-containing resin having a structure of formula (1) [where R1 is H, a 1-5C linear or branched alkyl or a 1-5C linear or branched alkoxyl] and/or a structure of formula (2) [where Z is a 4-20C trivalent alicyclic hydrocarbon group or its substituted derivative and X is a single bond or a 1-5C divalent organic group] and convertible to an alkali-soluble resin when the acid dissociable group is dissociated and (B) a radiation sensitive acid generating agent.

    RADIATION SENSITIVE RESIN COMPOSITION

    公开(公告)号:JP2001188347A

    公开(公告)日:2001-07-10

    申请号:JP2000137757

    申请日:2000-05-10

    Applicant: JSR CORP

    Abstract: PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition excellent in shelf stability, having high transparency to radiation and excellent also in basic physical properties as a resist such as dry etching resistance, sensitivity, resolution and pattern shape. SOLUTION: The radiation sensitive resin composition contains (A) an acid- dissociable group-containing resin having repeating units derived from a (meth) acrylic acid derivative having an alicyclic skeleton containing an oxygen- or nitrogen-containing polar group typified by 3-hydroxy-1-adamantyl (meth)acrylate or 3-(8'-cyanotetracyclo[4.4.0.12,5.17,10]dodecyl (meth)acrulate and repeating units derived from another (meth)acrylic acid derivative having an alicyclic skeleton typified by 2-methyl-2-adamantyl (meth)acrylate and convertible to an alkali- soluble resin when the acid-dissociable group is dissociated and (B) a radiation sensitive acid generating agent.

    RADIATION SENSITIVE RESIN COMPOSITION

    公开(公告)号:JP2001147535A

    公开(公告)日:2001-05-29

    申请号:JP32973999

    申请日:1999-11-19

    Applicant: JSR CORP

    Abstract: PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition excellent in dry etching resistance, sensitivity, resolution, etc., as a chemical amplification type resist, capable of avoiding a change of the line width of a resist pattern due to a change of the time elapsed from exposure to post-exposure heating and having superior process stability. SOLUTION: The radiation sensitive resin composition contains (A) an alkali- insoluble or slightly alkali-soluble acid dissociable group-containing resin which is made alkali-soluble when the acid dissociable group is dissociated and (B) a radiation sensitive acid generating agent. The component A is typified by a copolymer of a norbornene derivative typified by 8- hydroxytetracyclo[4.4.0.12,5.17,10]dodec-3-ene, itaconic anhydride and a (meth) acrylic acid derivative typified by a compound of formula 1.

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