Abstract:
The present invention relates to an improved contact surface of pin hole (e.g, a ground pin hole, screw fastening hole, or the like), which is adopted on a substrate, the substrate is formed with at least a pin hole (e.g, a ground pin hole, screw fastening hole, or the like) hole and characterized in that: the periphery of the pin hole (e.g, a ground pin hole, screw fastening hole, or the like) is formed with plural soldering joints and plural penetrated holes, thereby allowing a pin (e.g., pin, ground pin, screw, or the like) and the substrate to be formed with an excellent contact surface for achieving a grounding effect.
Abstract:
According to an aspect of the present invention, there is provided a printed wiring board including: a substrate including a pair of edges and a fixing hole adjacent to the pair of edges and configured to receive a bolt; a land provided in a vicinity of the fixing hole and extending in a direction from the fixing hole toward a center of the substrate and along the pair of edges; and an insulating height adjuster provided between the fixing hole and the pair of edges and configured to have substantially the same height as the land.
Abstract:
An electronic apparatus includes, for example, a circuit board with an electronic component and a piezoelectric element, a reference potential pattern that gives a reference potential to at least one of the electronic component and the piezoelectric element, and a solder land connected to the reference potential pattern. On the circuit board, the electronic component is located on a downstream side in a transport direction of the circuit board during mounting of the piezoelectric element and the electronic component on the solder land, and the piezoelectric element is located on an upstream side in the transport direction.
Abstract:
A printed wiring board which can certainly prevent damage of conductive pattern caused by the terminal. The printed wiring board has a board, a conductive pattern, a through-hole and a non-conductive area. A lead wire of resistance mounted on the printed wiring board is inserted into the through-hole 4. The lead wire projects from a surface of the board, and is bent close to the surface. The non-conductive area is formed into a fan-shaped shape enlarging toward a tip of the lead wire from a center of the through-hole. Because the bent lead wire is arranged on the non-conductive area, the non-conductive area can prevent damage of the conductive pattern which is caused by touching the lead wire to the conductive pattern.
Abstract:
The present invention is to provide a printed wiring board which can certainly prevent damage of conductive pattern caused by the terminal. The printed wiring board has a board, a conductive pattern, a through-hole and a non-conductive area. A lead wire of resistance mounted on the printed wiring board is inserted into the through-hole 4. The lead wire projects from a surface of the board, and is bent close to the surface. The non-conductive area is formed into a fan-shaped shape enlarging toward a tip of the lead wire from a center of the through-hole. Since the bent lead wire is arranged on the non-conductive area, the non-conductive area can prevent damage of the conductive pattern which is caused by touching the lead wire to the conductive pattern.
Abstract:
A substrate for suspension 10 comprises a metallic substrate 1, an insulating layer 2 formed on the metallic substrate 1, having an opening for grounding terminal 3, and a grounding conductor 4 formed on the insulating layer 2. A grounding-terminal-forming material 5 is placed in the opening for grounding terminal 3 to form a grounding terminal 7 that connects the metallic substrate 1 and the grounding conductor 4. The grounding conductor 4 does not surround a portion 8 of the circumference of the opening for grounding terminal 3.
Abstract:
A fixing structure for a circuit board includes at least one board mounting hole in the circuit board, the board mounting hole having a guide hole and an insertion hole, and at least one board mounting member inserted through the board mounting hole, the board mounting member having a main body, a cover, and an insertion portion therebetween, wherein the insertion portion has a cross-sectional area smaller than either of the main body or the cover and is capable of fitting in the insertion hole of the board mounting hole.
Abstract:
The invention is an optical reader having a plurality of image sensors. Each image sensor of a plural image sensor optical reader can be disposed on an imaging module that can include a light source. In one embodiment, a frame of image data captured via actuation of an image sensor of a first imaging module and actuation of illumination of a second imaging module is subjected to decoding. The various modules of a multiple imaging module reader can be adapted to have different best focus positions so that a field depth of the reader is improved.
Abstract:
An apparatus and method for providing a vented blind via in pad of a printed circuit board (PCB). A vent in the blind via in pad to allow gases formed during reflow soldering to escape from the solder joint. In one embodiment, the vent extends from the outer edge of the pad to the blind via. In another embodiment, a method includes forming a blind via in pad having a vent.
Abstract:
An optical reader including an image sensor, imaging optics, a short range aiming assembly, and a long range aiming assembly. The short range aiming assembly may comprise a plurality of LEDs. The long range aiming assembly may comprise a laser diode assembly which projects an aiming pattern that is readily visible at reading distances of several feet. The optical reader can be configured so that long range aiming assembly is enabled or disabled depending upon a present operating condition.