公开(公告)号：US20110163343A1

公开(公告)日：2011-07-07

申请号：US13052302

申请日：2011-03-21

Applicant: Gi-Cherl KIM ,  Se-Ki PARK ,  Ju-Young YOON ,  Byung-Choon YANG ,  Seok-Hyun NAM ,  Sang-Yu LEE

Inventor： Gi-Cherl KIM ,  Se-Ki PARK ,  Ju-Young YOON ,  Byung-Choon YANG ,  Seok-Hyun NAM ,  Sang-Yu LEE

IPC: H01L33/00

CPC classification number: H05K1/0203 ,  G02F1/133603 ,  G02F2001/133607 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/1815 ,  H01L2924/19041 ,  H05K3/445 ,  H05K2201/09481 ,  H05K2201/10106 ,  H05K2201/10553 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00011 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A two-dimensional light source includes a base substrate having holes, wires disposed on a lower surface of the base substrate, a light emitting diode (LED) chip disposed on an upper surface of the base substrate, plugs that connect two electrodes of the LED chip to the wires through the holes, a buffer layer covering the LED chip, and an optical layer that is disposed on the buffer layer and has an optical pattern formed at a portion of the optical layer corresponding to the LED chip.

Abstract translation: 二维光源包括具有孔的基底基板，设置在基底基板的下表面上的布线，设置在基底基板的上表面上的发光二极管（LED）芯片，连接LED的两个电极的插头 通过孔穿过导线，覆盖LED芯片的缓冲层，以及设置在缓冲层上并具有形成在对应于LED芯片的光学层的一部分的光学图案的光学层。

公开(公告)号：US20110013380A1

公开(公告)日：2011-01-20

申请号：US12893373

申请日：2010-09-29

Applicant: Chuan-Ho Cheng ,  Chih-Kang Wu ,  Kuo-Cheng Huang ,  Shih-Che Fu

Inventor： Chuan-Ho Cheng ,  Chih-Kang Wu ,  Kuo-Cheng Huang ,  Shih-Che Fu

IPC: G09F13/04

CPC classification number: H05K3/301 ,  G02F1/133604 ,  G02F1/133608 ,  H01R12/718 ,  H01R33/0818 ,  H05K2201/10113 ,  H05K2201/10295 ,  H05K2201/10553

Abstract: A backlight structure comprises a frame, a circuit board, and a connector. The frame has an opening. The circuit board is located below the frame and has a through hole, wherein the through hole aligns with the opening. The connector passes through the opening and the through hole, protrudes from a surface of the frame, and is electrically connected to the circuit board.

Abstract translation: 背光结构包括框架，电路板和连接器。 框架有一个开口。 电路板位于框架下方并具有通孔，其中通孔与开口对准。 连接器穿过开口并且通孔从框架的表面突出并且电连接到电路板。

公开(公告)号：US07824072B2

公开(公告)日：2010-11-02

申请号：US11971237

申请日：2008-01-09

Applicant: Chuan-Ho Cheng ,  Chih-Kang Wu ,  Kuo-Cheng Huang ,  Shih-Che Fu

Inventor： Chuan-Ho Cheng ,  Chih-Kang Wu ,  Kuo-Cheng Huang ,  Shih-Che Fu

IPC: H01R27/02 ,  H01R33/02 ,  H02B1/044

CPC classification number: H05K3/301 ,  G02F1/133604 ,  G02F1/133608 ,  H01R12/718 ,  H01R33/0818 ,  H05K2201/10113 ,  H05K2201/10295 ,  H05K2201/10553

Abstract: A backlight structure comprises a frame, a circuit board, and a connector. The frame has an opening. The circuit board is located below the frame and has a through hole, wherein the through hole aligns with the opening. The connector passes through the opening and the through hole, protrudes from a surface of the frame, and is electrically connected to the circuit board.

Abstract translation: 背光结构包括框架，电路板和连接器。 框架有一个开口。 电路板位于框架下方并具有通孔，其中通孔与开口对准。 连接器穿过开口并且通孔从框架的表面突出并且电连接到电路板。

公开(公告)号：US06990734B2

公开(公告)日：2006-01-31

申请号：US10263006

申请日：2002-10-02

Applicant: Jeffrey A. Underwood ,  John K. Arledge ,  Thomas J. Swirbel ,  Joaquin Barreto

Inventor： Jeffrey A. Underwood ,  John K. Arledge ,  Thomas J. Swirbel ,  Joaquin Barreto

IPC: H05K3/34

CPC classification number: H05K1/0218 ,  H01L2223/6622 ,  H05K1/0221 ,  H05K1/0222 ,  H05K1/113 ,  H05K3/4644 ,  H05K9/0039 ,  H05K2201/0715 ,  H05K2201/09036 ,  H05K2201/09509 ,  H05K2201/09809 ,  H05K2201/09972 ,  H05K2201/09981 ,  H05K2201/10553 ,  H05K2201/10969 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: Methods for forming a metal shield on a printed circuit board (10) include depositing a first layer of metal (41) on a substrate (22) of the printed circuit board (10), depositing a first layer of dielectric material (42) on the first layer of metal (41), printing one or more circuits (21, 21′) on the first dielectric layer (42), depositing a second layer of dielectric material (43) over the one or more printed circuits (21, 21′), forming a trench-like opening (44) in the two layers of dielectric material (42, 43) surrounding the one or more printed circuits (21, 21′) so that the metal of the first layer (41) is exposed by the trench-like opening (44), depositing a second layer of metal (27) on the second layer of dielectric material (43) such that the second layer of metal (27) plates the trench-like opening (44) and makes electrical contact with the first metal layer (41).

Abstract translation: 在印刷电路板（10）上形成金属屏蔽的方法包括在印刷电路板（10）的基板（22）上沉积第一金属层（41），将第一层介电材料（42）沉积在 所述第一金属层（41），在所述第一介电层（42）上印刷一个或多个电路（21,21'），在所述一个或多个印刷电路（21,21）上沉积第二介电材料层 '），在围绕所述一个或多个印刷电路（21,21'）的两层介电材料（42,43）中形成沟槽状开口（44），使得第一层（41）的金属暴露 通过所述沟槽状开口（44），在所述第二介电材料层（43）上沉积第二金属层（27），使得所述第二金属层（27）平坦化所述沟槽状开口（44）并使 与第一金属层（41）电接触。

公开(公告)号：US20030024719A1

公开(公告)日：2003-02-06

申请号：US10263006

申请日：2002-10-02

Applicant: Motorola, Inc.

Inventor： Jeffrey A. Underwood ,  John K. Arledge ,  Thomas J. Swirbel ,  Joaquin Barreto

IPC: H05K009/00

CPC classification number: H05K1/0218 ,  H01L2223/6622 ,  H05K1/0221 ,  H05K1/0222 ,  H05K1/113 ,  H05K3/4644 ,  H05K9/0039 ,  H05K2201/0715 ,  H05K2201/09036 ,  H05K2201/09509 ,  H05K2201/09809 ,  H05K2201/09972 ,  H05K2201/09981 ,  H05K2201/10553 ,  H05K2201/10969 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: Methods and apparatus for forming a metal shield on a printed circuit board (10) include a layer of dielectric material (23) one or more printed circuits (21) on the layer of dielectric material (23), a layer of metal (27) on the layer of dielectric material (23), a metal-clad trench or opening surrounding the printed circuit (44) and electrically connected to the layer of metal(27), a solder pad (24) on the layer of dielectric material (23), a microvia (25) through the solder pad (24) and the layer of dielectric material (23), and electrical components (11) soldered to the solder pads (24) and to the printed circuit (21).

Abstract translation: 在印刷电路板（10）上形成金属屏蔽的方法和装置包括介电材料层（23），介电材料层（23）上的一个或多个印刷电路（21），一层金属（27） 在电介质材料层（23）上，围绕印刷电路（44）并电连接到金属层（27）的金属包覆沟槽或开口，介电材料层（23）上的焊盘（24） ），通过焊盘（24）和电介质材料层（23）的微孔（25）以及焊接到焊盘（24）和印刷电路（21）的电气部件（11）。

公开(公告)号：US06501103B1

公开(公告)日：2002-12-31

申请号：US09983133

申请日：2001-10-23

Applicant: Tom Jory ,  Po-Hsien Lee ,  Chen-Lun Hsing Chen

Inventor： Tom Jory ,  Po-Hsien Lee ,  Chen-Lun Hsing Chen

IPC: H01L3300

CPC classification number: H01L33/647 ,  H01L2224/48091 ,  H05K1/021 ,  H05K1/182 ,  H05K3/0061 ,  H05K3/3442 ,  H05K3/3447 ,  H05K2201/10106 ,  H05K2201/10553 ,  H05K2201/1056 ,  H01L2924/00014

Abstract: A light emitting diode assembly with low thermal resistance comprises an LED, a circuit board and a heat-dissipating substrate. The LED has a die mounted on a heat-dissipating plate and pads connected to a printed circuit board. The LED is mounted on a circuit board and a heat-dissipating substrate, whereby the thermal resistance of the LED assembly can be advantageously reduced to enhance the performance of the LED assembly.

Abstract translation: 具有低热阻的发光二极管组件包括LED，电路板和散热衬底。 LED具有安装在散热板上的管芯和连接到印刷电路板的焊盘。 LED安装在电路板和散热基板上，由此可以有利地降低LED组件的热阻，从而提高LED组件的性能。

公开(公告)号：US20020104669A1

公开(公告)日：2002-08-08

申请号：US09775460

申请日：2001-02-05

Inventor： Jeffrey A. Underwood ,  John K. Arledge ,  Thomas J. Swirbel ,  Joaquin Barreto

IPC: H05K009/00

CPC classification number: H05K1/0218 ,  H01L2223/6622 ,  H05K1/0221 ,  H05K1/0222 ,  H05K1/113 ,  H05K3/4644 ,  H05K9/0039 ,  H05K2201/0715 ,  H05K2201/09036 ,  H05K2201/09509 ,  H05K2201/09809 ,  H05K2201/09972 ,  H05K2201/09981 ,  H05K2201/10553 ,  H05K2201/10969 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: Methods and apparatus for forming a metal shield on a printed circuit board (10) include a layer of dielectric material (23) one or more printed circuits (21) on the layer of dielectric material (23), a layer of metal (27) on the layer of dielectric material (23), a metal-clad trench or opening surrounding the printed circuit (44) and electrically connected to the layer of metal (27), a solder pad (24) on the layer of dielectric material (23), a microvia (25) through the solder pad (24) and the layer of dielectric material (23), and electrical components (11) soldered to the solder pads (24) and to the printed circuit (21).

Abstract translation: 在印刷电路板（10）上形成金属屏蔽的方法和装置包括介电材料层（23），介电材料层（23）上的一个或多个印刷电路（21），金属层（27） 在电介质材料层（23）上，围绕印刷电路（44）并电连接到金属层（27）的金属包覆沟槽或开口，介电材料层（23）上的焊盘（24） ），通过焊盘（24）和电介质材料层（23）的微孔（25）以及焊接到焊盘（24）和印刷电路（21）的电气部件（11）。

公开(公告)号：US5563773A

公开(公告)日：1996-10-08

申请号：US334104

申请日：1994-11-04

Applicant: Akio Katsumata

Inventor： Akio Katsumata

IPC: H01L23/36 ,  H01L23/31 ,  H01L23/538 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H01L23/34 ,  H05K7/20

CPC classification number: H01L23/3107 ,  H01L23/5383 ,  H05K1/0209 ,  H05K1/023 ,  H05K1/181 ,  H01L2224/48091 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/0201 ,  H05K2201/0715 ,  H05K2201/09781 ,  H05K2201/10515 ,  H05K2201/10545 ,  H05K2201/10553 ,  H05K2201/10689 ,  H05K2201/10969 ,  H05K3/303 ,  H05K3/3421 ,  Y02P70/611

Abstract: A memory IC having an SOJ type package is mounted on a metal wiring layer on the surface of the outer layer of a multilevel interconnection board. Protecting portions are formed on the package of the memory IC. The protecting portions contact the surface of the metal wiring layer when the memory IC is mounted on the multilevel level interconnection board. The shape of the projecting portions can be of various types, e.g., circular cylinders or prisms. Heat generated within the memory IC is transmitted to the metal wiring layer through the projecting portions. A first insulating layer has first and second surfaces. Wiring layers are formed on each of the first and second surfaces of the first insulating layer, and first and second semiconductor chips are connected to those wiring layers. First and second resin layers cover the whole surface of the outermost wiring layers and the first and second semiconductor chips.

Abstract translation: 具有SOJ型封装的存储器IC安装在多层互连板的外层表面上的金属布线层上。 保护部分形成在存储器IC的封装上。 当存储器IC安装在多层次互连板上时，保护部分接​​触金属布线层的表面。 突出部分的形状可以是各种类型，例如圆柱体或棱镜。 在存储器IC内产生的热量通过突出部分传输到金属布线层。 第一绝缘层具有第一和第二表面。 在第一绝缘层的第一表面和第二表面的每一个上形成布线层，并且第一和第二半导体芯片连接到那些布线层。 第一和第二树脂层覆盖最外面布线层和第一和第二半导体芯片的整个表面。

公开(公告)号：US5149216A

公开(公告)日：1992-09-22

申请号：US694358

申请日：1991-05-01

Applicant: Jiro Tanuma ,  Shinichi Katakura

Inventor： Jiro Tanuma ,  Shinichi Katakura

IPC: B41J19/20 ,  B41J29/02 ,  H05K1/02

CPC classification number: B41J29/02 ,  B41J19/20 ,  H05K1/0203 ,  H05K2201/10166 ,  H05K2201/10409 ,  H05K2201/10553

Abstract: A printing head drive circuit of a printer is mounted on the side of a carriage having a printing head attached thereto for a allowing said carriage to act as a heat sink. Hereby, no particular cooling means (heat sink, cooling fan and the like) is required for printing head drive elements. In addition, a controller and heat generating parts can be completely separated. Thus, it can be anticipated to reduce the number of parts and the cost required for assembling the whole structure as well as to improve reliability of the printing head drive circuit.

Abstract translation: 打印机的打印头驱动电路安装在具有附接到其上的打印头的滑架的侧面上，以允许所述滑架用作散热器。 因此，打印头驱动元件不需要特定的冷却装置（散热器，冷却风扇等）。 此外，控制器和发热部件可以完全分离。 因此，可以预期减少组装的数量和组装整个结构所需的成本以及提高打印头驱动电路的可靠性。

公开(公告)号：US4675784A

公开(公告)日：1987-06-23

申请号：US770874

申请日：1985-08-12

Applicant: Rolf Dahlberg ,  Tomas Dahlberg

Inventor： Rolf Dahlberg ,  Tomas Dahlberg

IPC: H05K1/02 ,  H05K1/05 ,  H05K3/00 ,  H05K3/28 ,  H05K3/38 ,  H05K7/20

CPC classification number: H05K1/0203 ,  H05K3/0061 ,  H05K1/053 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10303 ,  H05K2201/10553 ,  H05K2201/10689 ,  H05K2203/0315 ,  H05K3/28 ,  H05K3/386

Abstract: A printed circuit board having a supporting base element (1) of anodized aluminum. A glue film (4) is interposed between the supporting base element and a laminate layer (7) which has circuits (6a, 6b), the glue film sealing any pores in the anodic film of the supporting base element.

Abstract translation: PCT No.PCT / SE84 / 00415 Sec。 371日期1985年8月12日 102（e）日期1985年8月12日PCT提交1984年12月5日PCT公布。 出版物WO85 / 02750 日期：1985年6月20日。一种印刷电路板，其具有阳极氧化铝的支撑基体元件（1）。 在支撑基体元件和具有电路（6a，6b）的层压层（7）之间插入胶膜（4），胶膜密封支撑基体元件的阳极膜中的任何孔。