公开(公告)号：WO2005124445A2

公开(公告)日：2005-12-29

申请号：PCT/US2005/018224

申请日：2005-05-24

Applicant: GENTEX CORPORATION ,  BAUER, Frederick, T. ,  TURNBULL, Robert, R. ,  GUARR, Thomas, F. ,  KLOEPPNER, Leroy, J. ,  EATON, David, L. ,  STRAY, Joel, A. ,  NELSON, Barry, K.

Inventor： TURNBULL, Robert, R. ,  GUARR, Thomas, F. ,  KLOEPPNER, Leroy, J. ,  EATON, David, L. ,  STRAY, Joel, A. ,  NELSON, Barry, K.

IPC: G02F1/15

CPC classification number: B60R1/12 ,  B60R1/088 ,  H05K1/0274 ,  H05K1/0306 ,  H05K3/321 ,  H05K2201/0108 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/2036 ,  H05K2201/2054

Abstract: According to the present invention, a rearview mirror comprises a first substrate having a front surface and a rear surface, a reflective coating disposed on a surface of the first substrate, and an electronic circuit component secured to the rear surface of the first sub;>trate. The mirror element may be an electrochromic mirror element comprising a transparent second substrate positioned in front of the first substrate. The electronic component secured to the rear surface may be a component of a drive circuit for the electrochromic mirror element. The rearview mirror element may further comprise electrically conductive tracings provided on the rear surface of the first substrate electrically coupled to the electrical component. The tracings may be used to electrically couple the drive circuit to the electrodes of the electrochromic mirror element. The tracings may be deposited on the rear surface using numerous methods including inkjet printing techniques.

Abstract translation: 根据本发明，后视镜包括具有前表面和后表面的第一基板，设置在第一基板的表面上的反射涂层和固定到第一子基板的后表面的电子电路部件; trate。 镜元件可以是电致变色镜元件，其包括位于第一衬底前面的透明第二衬底。 固定到后表面的电子部件可以是用于电致变色镜元件的驱动电路的部件。 后视镜元件还可以包括设置在电耦合到电气部件的第一基板的后表面上的导电跟踪。 跟踪可以用于将驱动电路电耦合到电致变色镜元件的电极。 可以使用包括喷墨印刷技术的许多方法将痕迹沉积在后表面上。

公开(公告)号：WO2004068921A3

公开(公告)日：2005-02-10

申请号：PCT/DE2004000111

申请日：2004-01-26

Applicant: BOSCH GMBH ROBERT ,  JAKOB GERT ,  ECKERT BERND ,  ZYWIETZ MARTIN ,  BEHNER ULRICH

Inventor： JAKOB GERT ,  ECKERT BERND ,  ZYWIETZ MARTIN ,  BEHNER ULRICH

IPC: H01G2/06 ,  H05K3/30

CPC classification number: H01G2/06 ,  H05K3/308 ,  H05K2201/10015 ,  H05K2201/1059 ,  H05K2201/10651

Abstract: The invention relates to an electronic component (1) comprising at least one connection line (20), one end of which is configured as a press-fit contact (10) for pressing into a contact opening (40).

Abstract translation: 用于压入的接触孔（40）的电子部件（1）与在一个端部作为压入式触头（10）形成的至少一个连接线（20）。

公开(公告)号：WO2005004176A1

公开(公告)日：2005-01-13

申请号：PCT/JP2004/009499

申请日：2004-06-29

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. ,  MORIKAWA, Hisashi ,  SAKAI, Shinichi

Inventor： MORIKAWA, Hisashi ,  SAKAI, Shinichi

IPC: H01F5/04

CPC classification number: H05B6/666 ,  H01F5/02 ,  H01F27/06 ,  H01F27/40 ,  H01F2027/065 ,  H05K1/18 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/1003 ,  H05K2201/10424 ,  H05K2201/10515 ,  H05K2201/10651 ,  H05K2201/10757

Abstract: A transformer unit 1 comprising a transformer composed of a bobbin 2 having wound therearound primary and secondary windings and a core inserted into the center of the bobbin and an electric component 3 held in the outer peripheral region of the bobbin 2 and/or transformer is placed on a printed circuit board 4, lead terminals 3a of the electric component 3 are soldered to the printed circuit board 4 with a solder 5, and the lead terminals 3a are sandwiched in a slit 2b formed in the bobbin 2 and are fixedly attached thereto. In this structure, a bent portion 3b for preventing the bobbin 2 from sliding, while sandwiching the lead terminal 3a, in the longitudinal direction of the lead terminal 3a is formed in the lead terminal 3a.

Abstract translation: 变压器单元1包括一个变压器组成的变压器，该变压器由绕绕在其初级和次级绕组周围的线轴2和插入绕线筒中心的铁芯和保持在线轴2和/或变压器外围区域的电气部件3组成 在印刷电路板4上，电气部件3的引线端子3a用焊料5焊接到印刷电路板4，并且引线端子3a被夹在形成在线轴2中的狭缝2b中，并固定在其上。 在该结构中，在引线端子3a中形成有用于防止线轴2滑动的弯曲部3b，而在引线端子3a的纵向方向上夹着引线端子3a。

公开(公告)号：WO00033420A1

公开(公告)日：2000-06-08

申请号：PCT/US1999/028254

申请日：1999-11-30

IPC: H01R4/04 ,  H05K3/32 ,  H05K3/34 ,  H01R4/02

CPC classification number: H01R4/04 ,  H05K3/321 ,  H05K3/3426 ,  H05K2201/0373 ,  H05K2201/10636 ,  H05K2201/10651 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: Surface mount device packages with increased mounting strength and a method therefor. In one embodiment, an electronic device is made up of a device package and one or more electrically conductive terminals. For surface mounting, the device terminals are each provided with a mounting surface which is bonded using a conductive adhesive to a corresponding contact pad on a circuit board. The terminals are further provided with at least one groove across the mounting surface. When conductive adhesive is used to mount the device on a circuit board, this groove serves to form the conductive adhesive into a ridge or "dam" over the contact pad. This provides increased mounting strength which may eliminate the need for additional adhesive material to provide side reinforcement of the device, and thereby allow an increase in the packaging density of devices on the circuit board.

Abstract translation: 具有更高安装强度的表面贴装器件封装及其方法。 在一个实施例中，电子设备由设备封装和一个或多个导电端子组成。 对于表面安装，器件端子各自设置有使用导电粘合剂粘合到电路板上的相应接触焊盘的安装表面。 端子还设置有跨过安装表面的至少一个凹槽。 当使用导电粘合剂将装置安装在电路板上时，该槽用于将导电粘合剂形成在接触垫上的脊或“阻挡”。 这提供了增加的安装强度，这可以消除对额外的粘合剂材料的需要来提供装置的侧面加强，从而允许电路板上的装置的包装密度增加。

公开(公告)号：WO98041069A2

公开(公告)日：1998-09-17

申请号：PCT/DE1998/000760

申请日：1998-03-13

IPC: H05K1/11 ,  H05K3/34 ,  H05K3/00

CPC classification number: H05K3/3447 ,  H05K1/116 ,  H05K2201/0949 ,  H05K2201/10651

Abstract: The invention relates to a fitted and soldered printed circuit board (1) of a flat assembly on which an additional component (2) is subsequently added and soldered. The printed circuit board has two solder-free fixing holes (7, 8) to fix the ends of the leads (4, 5) of the additional component (2), between which two interspaced soldering pads (10, 11) are placed, enabling said additional component (2) to be fixed onto the printed circuit board (1) and to be electrically connected. The leads (4, 5) have an area (12) running parallel to the surface of the printed circuit board (3) and a second area (14) running perpendicular to said surface, which are inserted into both fixing holes (7, 8).

Abstract translation: 在印刷电路板组件的装配和焊接的电路板（1）已被随后施加的附加部件（2）和焊接。 它有两个用于固定连接导线的端部（4,5），辅助装置（2）供应焊固定孔（7,8），在它们之间其中两个间隔开的焊垫（10，11）设置有附加部件（2） 被固定在电路板（1）和电连接。 连接线（4，5）具有与电路板表面（3）平行的区域（12）和与其垂直（14），其被插入到固定孔中的一个（7,8）。

公开(公告)号：WO1997025843A1

公开(公告)日：1997-07-17

申请号：PCT/DE1996002484

申请日：1996-12-20

Applicant: SIEMENS AKTIENGESELLSCHAFT ,  LANGE, Gerhard ,  LEUSCHNER, Thomas

Inventor： SIEMENS AKTIENGESELLSCHAFT

IPC: H05K03/34

CPC classification number: H05K3/3426 ,  H01C1/14 ,  H01T4/06 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/613

Abstract: An electrical component provide with connection wires (24, 25) such as a gas-filled overvoltage diverter (40) has to be held in a stable horizontal position on a conducting plate (30) for soldering purposes. The free ends (26, 27, 29) of the connection wires (24, 25, 28) are so bent that they form feet to hold the component (40) in a stable horizontal position. In the case of a three-electrode diverter, the two face-side connection wires (24, 25) and the envelope-side connection wire (28) are so bent in parallel planes that the flattened feet form the corner points of a triangle (D).

Abstract translation: 阿与连接线（24，25）设置有电气元件如一个充有气体的电涌放电器（40）意在成为Lötzwecke稳定在电路板（30）的水平位置来安排。 为了这个目的，连接线的自由端（26，27，29）（24,25，28）弯曲，以便形成脚为组分（40）的稳定的水平放置。 在一个Dreielektrodenableiter两个端排除导线（24，25）和壳侧设置连接线（28）在相互平行的平面，从而弯曲，使得扁平脚形成一个三角形（D）的角点。

公开(公告)号：KR101345353B1

公开(公告)日：2013-12-31

申请号：KR1020097000183

申请日：2007-06-05

Applicant: 코닌클리케 필립스 엔.브이.

Inventor： 바타차랴,라빈 ,  스니저,피터,제이. ,  반피에터슨,리에베스 ,  재인진거,에리히 ,  크랜스,마틴 ,  아즈바디,시마 ,  더글라스,알렉산더,유. ,  반드리엘,재클린 ,  해크,마티너스,제이.,제이.

IPC: H01R33/76 ,  H01L21/60 ,  H05K13/04

CPC classification number: H05K3/301 ,  H05K1/038 ,  H05K3/308 ,  H05K3/321 ,  H05K2201/029 ,  H05K2201/10106 ,  H05K2201/10325 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/10825 ,  H05K2201/10962 ,  H05K2201/209 ,  H05K2203/1446

Abstract: 전자 부품들을 기판 상에 배열하기 위한 서브마운트가 제공된다. 이 서브마운트는 헤드 부재 및 그 헤드 부재로부터 돌출하는 적어도 하나의 기판 맞물림 부재를 포함한다. 헤드 부재는 적어도 2개의, 서로로부터 분리된, 전기 도전성 부분들을 포함하고, 각각의 전기 도전성 부분은 전자 부품들을 그것에 접속하기 위해 적응된 부품 콘택트, 및 상기 전기 도전성 부분들을 상기 기판에 포함된 회로와 접촉시키기 위해 적응된, 상기 기판 측면 상에 배열된 기판 콘택트를 포함한다. 본 발명의 서브마운트는, 발광 다이오드와 같은 전자 부품들을 직물 기판 상에 직접 납땜할 필요 없이, 그러한 전자 부품들을 직물 기판에 부착하는 데 이용될 수 있다.
직물 기판, 전자 부품, 서브마운트

公开(公告)号：KR1020090033811A

公开(公告)日：2009-04-06

申请号：KR1020080096069

申请日：2008-09-30

Applicant: 가부시키가이샤 덴소

Inventor： 스기모또게이이찌 ,  나까가와미쯔루

IPC: H01L23/28

CPC classification number: H05K3/303 ,  G07C9/00944 ,  H01L2924/1815 ,  H05K1/182 ,  H05K3/284 ,  H05K2201/10037 ,  H05K2201/10568 ,  H05K2201/10651 ,  H05K2201/10689 ,  H05K2201/2036 ,  Y02P70/613 ,  Y10T29/49146

Abstract: An electronic circuit device and the manufacturing method thereof are provided to prevent the bulge part from being in the exposed surface of circuit board and to prevent the damage of the outer tube of the electronic key transceiver due to the extended portion. The electronic component(3) having one or more projection(33) is prepared. The first side surface of the circuit board(2) has the electronic component. At this time, the first side surface and point of the circuit board projection is point-contacted. Moreover, the gap is formed between the circuit board and electronic component. The circuit board is located within the mold cavity. The collaboration is charged with the resin material and then the circuit board is encapsulated.

Abstract translation: 提供一种电子电路装置及其制造方法，以防止凸起部分在电路板的暴露表面中，并且防止由于延伸部分而导致的电子钥匙收发器的外管的损坏。 准备具有一个或多个突起（33）的电子部件（3）。 电路板（2）的第一侧表面具有电子部件。 此时，电路板突起的第一侧表面和点是点接触的。 此外，在电路板和电子部件之间形成间隙。 电路板位于模腔内。 合作充电树脂材料，然后电路板封装。

公开(公告)号：KR1020080059319A

公开(公告)日：2008-06-26

申请号：KR1020087012183

申请日：2006-10-13

Applicant: 코닌클리케 필립스 엔.브이.

Inventor： 도너스,모리스,아.,하.

IPC: H05K3/30

CPC classification number: H05K3/301 ,  H05K3/3442 ,  H05K2201/10106 ,  H05K2201/10325 ,  H05K2201/10484 ,  H05K2201/10636 ,  H05K2201/10651 ,  Y02P70/611 ,  Y10T29/4913

Abstract: A supporting component (1) adapted for being mounted on a substrate (11) and for serving as a support for a surface mounted device (15) comprises a body (2) having a first surface (3) adapted for being mounted on the substrate (11), and a second surface (4) being adapted for supporting the surface mounted device (15). The second surface (4) is inclined in relation to the first surface (3). The supporting component (1) further comprises a first supporting component conductor (6) adapted for forming an electrical contact between a first substrate conductor (12) of the substrate (11) and a first electrode (16) of the surface mounted device (15). In a method of mounting a surface mounted device (15) in an inclined manner on a substrate (11) the supporting component (1) is mounted on the substrate (11) with the surface mounted device (15) on top of it.

Abstract translation: 适于安装在基板（11）上并用作表面安装装置（15）的支撑件的支撑部件（1）包括具有适于安装在基板上的第一表面（3）的主体（2） （11），以及适于支撑所述表面安装装置（15）的第二表面（4）。 第二表面（4）相对于第一表面（3）倾斜。 支撑部件（1）还包括适于在基板（11）的第一基板导体（12）和表面安装装置（15）的第一电极（16）之间形成电接触的第一支撑部件导体（6） ）。 在将表面安装的装置（15）以倾斜的方式安装在基板（11）上的方法中，支撑部件（1）安装在基板（11）上，表面安装装置（15）位于其上。

公开(公告)号：KR100757703B1

公开(公告)日：2007-09-13

申请号：KR20070022883

申请日：2007-03-08

Applicant: YOUNGEUN ELECTRONICS CO LTD

Inventor： CHO HYUN GUI

IPC: H01R12/71

CPC classification number: H01R13/112 ,  H01R12/58 ,  H01R13/68 ,  H01R31/08 ,  H05K1/119 ,  H05K3/308 ,  H05K3/326 ,  H05K3/42 ,  H05K2201/09063 ,  H05K2201/1059 ,  H05K2201/10651 ,  H05K2201/10818

Abstract: A plate-type connector clamp, an embedded PCB(Printed Circuit Board) thereof, and a manufacturing method thereof are provided to reduce producing unit cost, shorten a producing period, and reduce the weight of a completed PCB by forming the connector clamp on a substrate surface of the PCB and manufacturing the PCB and component elements in a shape that a structure protruded from the substrate surface of the PCB is removed. A clamp hole(511) is bored and formed as a leg shape of a component or an element to insert a leg of the component or the element. Pressuring pieces(512) are formed at both sides of the clamp hole(511), and are pressurized and contacted in a central direction where the inserted leg of the component or the element is located to transmit signals. An auxiliary hole(513) is formed at an external side of the pressurizing pieces(512) to perform the pressuring operation of the pressurizing pieces(512) smoothly. A connector lead(514) is connected to composition parts including the pressurizing pieces(512), and is extended to a contact part for providing a necessary signal.

Abstract translation: 提供板式连接器夹具，其嵌入式PCB（印刷电路板）及其制造方法，以通过在连接器夹具上形成连接器夹具来降低生产单元成本，缩短生产周期并减小完成的PCB的重量 PCB的衬底表面，并且将PCB和组件元件制造成从PCB的衬底表面突出的结构被去除的形状。 夹紧孔（511）钻孔并形成为部件或元件的腿部形状以插入部件或元件的腿部。 压紧件（512）形成在夹紧孔（511）的两侧，并且在组件或元件的插入的腿部所位于的中心方向被加压并接触以传递信号。 在加压件（512）的外侧形成辅助孔（513），以平滑地进行加压件（512）的加压操作。 连接器引线（514）连接到包括加压片（512）的组成部分，并且延伸到用于提供必要信号的接触部分。