Abstract:
According to the present invention, a rearview mirror comprises a first substrate having a front surface and a rear surface, a reflective coating disposed on a surface of the first substrate, and an electronic circuit component secured to the rear surface of the first sub;>trate. The mirror element may be an electrochromic mirror element comprising a transparent second substrate positioned in front of the first substrate. The electronic component secured to the rear surface may be a component of a drive circuit for the electrochromic mirror element. The rearview mirror element may further comprise electrically conductive tracings provided on the rear surface of the first substrate electrically coupled to the electrical component. The tracings may be used to electrically couple the drive circuit to the electrodes of the electrochromic mirror element. The tracings may be deposited on the rear surface using numerous methods including inkjet printing techniques.
Abstract:
The invention relates to an electronic component (1) comprising at least one connection line (20), one end of which is configured as a press-fit contact (10) for pressing into a contact opening (40).
Abstract:
A transformer unit 1 comprising a transformer composed of a bobbin 2 having wound therearound primary and secondary windings and a core inserted into the center of the bobbin and an electric component 3 held in the outer peripheral region of the bobbin 2 and/or transformer is placed on a printed circuit board 4, lead terminals 3a of the electric component 3 are soldered to the printed circuit board 4 with a solder 5, and the lead terminals 3a are sandwiched in a slit 2b formed in the bobbin 2 and are fixedly attached thereto. In this structure, a bent portion 3b for preventing the bobbin 2 from sliding, while sandwiching the lead terminal 3a, in the longitudinal direction of the lead terminal 3a is formed in the lead terminal 3a.
Abstract:
Surface mount device packages with increased mounting strength and a method therefor. In one embodiment, an electronic device is made up of a device package and one or more electrically conductive terminals. For surface mounting, the device terminals are each provided with a mounting surface which is bonded using a conductive adhesive to a corresponding contact pad on a circuit board. The terminals are further provided with at least one groove across the mounting surface. When conductive adhesive is used to mount the device on a circuit board, this groove serves to form the conductive adhesive into a ridge or "dam" over the contact pad. This provides increased mounting strength which may eliminate the need for additional adhesive material to provide side reinforcement of the device, and thereby allow an increase in the packaging density of devices on the circuit board.
Abstract:
The invention relates to a fitted and soldered printed circuit board (1) of a flat assembly on which an additional component (2) is subsequently added and soldered. The printed circuit board has two solder-free fixing holes (7, 8) to fix the ends of the leads (4, 5) of the additional component (2), between which two interspaced soldering pads (10, 11) are placed, enabling said additional component (2) to be fixed onto the printed circuit board (1) and to be electrically connected. The leads (4, 5) have an area (12) running parallel to the surface of the printed circuit board (3) and a second area (14) running perpendicular to said surface, which are inserted into both fixing holes (7, 8).
Abstract:
An electrical component provide with connection wires (24, 25) such as a gas-filled overvoltage diverter (40) has to be held in a stable horizontal position on a conducting plate (30) for soldering purposes. The free ends (26, 27, 29) of the connection wires (24, 25, 28) are so bent that they form feet to hold the component (40) in a stable horizontal position. In the case of a three-electrode diverter, the two face-side connection wires (24, 25) and the envelope-side connection wire (28) are so bent in parallel planes that the flattened feet form the corner points of a triangle (D).
Abstract:
전자 부품들을 기판 상에 배열하기 위한 서브마운트가 제공된다. 이 서브마운트는 헤드 부재 및 그 헤드 부재로부터 돌출하는 적어도 하나의 기판 맞물림 부재를 포함한다. 헤드 부재는 적어도 2개의, 서로로부터 분리된, 전기 도전성 부분들을 포함하고, 각각의 전기 도전성 부분은 전자 부품들을 그것에 접속하기 위해 적응된 부품 콘택트, 및 상기 전기 도전성 부분들을 상기 기판에 포함된 회로와 접촉시키기 위해 적응된, 상기 기판 측면 상에 배열된 기판 콘택트를 포함한다. 본 발명의 서브마운트는, 발광 다이오드와 같은 전자 부품들을 직물 기판 상에 직접 납땜할 필요 없이, 그러한 전자 부품들을 직물 기판에 부착하는 데 이용될 수 있다. 직물 기판, 전자 부품, 서브마운트
Abstract:
An electronic circuit device and the manufacturing method thereof are provided to prevent the bulge part from being in the exposed surface of circuit board and to prevent the damage of the outer tube of the electronic key transceiver due to the extended portion. The electronic component(3) having one or more projection(33) is prepared. The first side surface of the circuit board(2) has the electronic component. At this time, the first side surface and point of the circuit board projection is point-contacted. Moreover, the gap is formed between the circuit board and electronic component. The circuit board is located within the mold cavity. The collaboration is charged with the resin material and then the circuit board is encapsulated.
Abstract:
A supporting component (1) adapted for being mounted on a substrate (11) and for serving as a support for a surface mounted device (15) comprises a body (2) having a first surface (3) adapted for being mounted on the substrate (11), and a second surface (4) being adapted for supporting the surface mounted device (15). The second surface (4) is inclined in relation to the first surface (3). The supporting component (1) further comprises a first supporting component conductor (6) adapted for forming an electrical contact between a first substrate conductor (12) of the substrate (11) and a first electrode (16) of the surface mounted device (15). In a method of mounting a surface mounted device (15) in an inclined manner on a substrate (11) the supporting component (1) is mounted on the substrate (11) with the surface mounted device (15) on top of it.
Abstract:
A plate-type connector clamp, an embedded PCB(Printed Circuit Board) thereof, and a manufacturing method thereof are provided to reduce producing unit cost, shorten a producing period, and reduce the weight of a completed PCB by forming the connector clamp on a substrate surface of the PCB and manufacturing the PCB and component elements in a shape that a structure protruded from the substrate surface of the PCB is removed. A clamp hole(511) is bored and formed as a leg shape of a component or an element to insert a leg of the component or the element. Pressuring pieces(512) are formed at both sides of the clamp hole(511), and are pressurized and contacted in a central direction where the inserted leg of the component or the element is located to transmit signals. An auxiliary hole(513) is formed at an external side of the pressurizing pieces(512) to perform the pressuring operation of the pressurizing pieces(512) smoothly. A connector lead(514) is connected to composition parts including the pressurizing pieces(512), and is extended to a contact part for providing a necessary signal.