公开(公告)号：US20060089019A1

公开(公告)日：2006-04-27

申请号：US11244163

申请日：2005-10-06

Applicant: Tomohiro Mitani

Inventor： Tomohiro Mitani

IPC: H05K1/00

CPC classification number: G01C19/5628 ,  H05K3/308 ,  H05K2201/10151 ,  H05K2201/10757 ,  H05K2201/10848

Abstract: An angular velocity sensor includes a tuning fork unit; a base block provided with a terminal for outputting an output signal from the tuning fork unit to the exterior; a cover for housing the tuning fork unit in a space defined by combination with the base block; a circuit board for fixing the terminal on the base block, the circuit board being provided with a processing circuit for processing the output signal from the tuning fork unit; and a casing for housing the base block, the cover, and the circuit board therein, wherein the terminal on the base block is fixed to the circuit board, with a clearance being defined by the base block and the circuit board, the terminal on the base block in the clearance has a flexure portion, and the flexure portion absorbs a vibration of a high frequency applied from the exterior.

Abstract translation: 角速度传感器包括音叉单元; 基部块，设置有用于将来自音叉单元的输出信号输出到外部的端子; 用于将音叉单元容纳在与基座组合定义的空间中的盖子; 用于将所述端子固定在所述基座上的电路板，所述电路板设置有用于处理来自音叉单元的输出信号的处理电路; 以及用于将基座，盖和电路板容纳在其中的壳体，其中基座上的端子固定到电路板，间隙由基座和电路板限定，端子在 间隙中的基块具有挠曲部分，并且挠曲部分吸收从外部施加的高频振动。

公开(公告)号：US06728068B1

公开(公告)日：2004-04-27

申请号：US09382891

申请日：1999-08-25

Applicant: Adam K. Himes ,  Michael S. Bowers ,  Paul E. Kupinski

Inventor： Adam K. Himes ,  Michael S. Bowers ,  Paul E. Kupinski

IPC: G11B517

CPC classification number: H05K3/4092 ,  G11B5/4813 ,  H05K2201/0397 ,  H05K2201/10848

Abstract: A flexible circuit for use in a head gimbal assembly having low stiffness and high robustness. The flexible interconnect circuit has interconnecting leads which connect the flexible interconnect circuit to a transduction head. To ensure the transducing head is able to follow the surface of the disc and properly read from and write to the disc, the interconnect leads are constructed with a varying width. The leads are widened at the points where breakage usually occurs and are narrowed at a middle portion to ensure the leads maintain the desired flexibility.

Abstract translation: 用于具有低刚度和高鲁棒性的头部万向节组件中的柔性电路。 柔性互连电路具有将柔性互连电路连接到换能头的互连引线。 为了确保换能头能够跟随盘的表面并且正确地读取和写入盘，互连引线被构造成具有变化的宽度。 引线在通常发生断裂的点处变宽，并在中间部分变窄，以确保引线保持期望的柔性。

公开(公告)号：US20020075664A1

公开(公告)日：2002-06-20

申请号：US09740115

申请日：2000-12-19

Inventor： Russell Wayne Perkins ,  Mark Alan Yoder ,  Christopher Day States ,  Theodore Paul Corbin

IPC: H05K009/00

CPC classification number: H05K9/0028 ,  H05K1/0201 ,  H05K3/3447 ,  H05K2201/062 ,  H05K2201/10371 ,  H05K2201/1084 ,  H05K2201/10848 ,  Y10S174/34

Abstract: An apparatus and method for shielding electrical components mounted on a printed circuit board (PCB) from electromagnetic and radio frequency interference by reducing the dissipation of heat away from solder joints. In an embodiment of the invention a radio frequency (RF) shield for a printed circuit board comprises a shield for RF shielding a portion of the PCB having electronic components mounted thereon. The shield has a first portion and a second portion, wherein the first portion has a reduced cross sectional area, for reducing heat conduction between the first and the second portion when the first portion of the shield is inserted into a first plurality of holes in the PCB, for soldering the first portion of the shield to a copper foil of the PCB.

Abstract translation: 一种用于通过减少远离焊点的散热来屏蔽安装在印刷电路板（PCB）上的电气部件免受电磁和射频干扰的装置和方法。 在本发明的实施例中，用于印刷电路板的射频（RF）屏蔽包括用于RF屏蔽用于屏蔽其上安装有电子部件的PCB的一部分的屏蔽。 屏蔽件具有第一部分和第二部分，其中第一部分具有减小的横截面面积，用于当屏蔽件的第一部分插入到第一部分和第二部分中的第一多个孔中时，用于减小第一部分和第二部分之间的热传导 PCB，用于将屏蔽的第一部分焊接到PCB的铜箔。

公开(公告)号：US5792985A

公开(公告)日：1998-08-11

申请号：US700942

申请日：1996-08-21

Applicant: Hisashi Watanabe ,  Shoji Takeda ,  Hideki Notake

Inventor： Hisashi Watanabe ,  Shoji Takeda ,  Hideki Notake

IPC: H01H13/52 ,  H01H1/58 ,  H01H11/00 ,  H05K3/30 ,  H01L23/02

CPC classification number: H05K3/308 ,  H01H1/5805 ,  H05K2201/10053 ,  H05K2201/10651 ,  H05K2201/1081 ,  H05K2201/10848 ,  H05K2203/1446 ,  H05K3/306

Abstract: A terminal for an electronic component having a connecting section with a rectangular shaped cross sectional for connection to the casing of the electronic component, and a taping section also with a rectangular shaped cross sectional for attachment to a tape carrying a plurality of such terminals. In between the connecting section and the taping section are a lower rod section and an upper rod section. The lower rod section facilitates the separation of the taping section from the tape. The upper section facilitates the separation of the connecting section from the remaining portion of the terminal.

Abstract translation: 一种用于电子部件的端子，具有用于连接到电子部件的壳体的具有矩形横截面的连接部分，以及具有矩形横截面的带状部分，用于附接到承载多个这种端子的带子。 在连接部和带部之间是下杆部和上杆部。 下杆部分便于将带部分与带分开。 上部便于连接部分与终端的其余部分的分离。

公开(公告)号：US5422516A

公开(公告)日：1995-06-06

申请号：US880520

申请日：1992-05-08

Applicant: Takashi Hosokawa ,  Hirokazu Inoue ,  Mamoru Sawahata ,  Masaki Fukuoka

Inventor： Takashi Hosokawa ,  Hirokazu Inoue ,  Mamoru Sawahata ,  Masaki Fukuoka

IPC: H01L21/48 ,  H01L21/60 ,  H01L23/498 ,  H05K1/02 ,  H05K3/34 ,  H05K3/40 ,  H01L23/48 ,  H01L29/44 ,  H01L29/52 ,  H01L29/60

CPC classification number: H01L24/11 ,  H01L21/4853 ,  H01L23/49816 ,  H01L24/14 ,  H01L24/16 ,  H05K3/4007 ,  H01L2224/0401 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/0603 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/116 ,  H01L2224/11831 ,  H01L2224/11902 ,  H01L2224/13012 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13023 ,  H01L2224/13078 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/14141 ,  H01L2224/45124 ,  H01L2224/48744 ,  H01L2224/8159 ,  H01L2224/816 ,  H01L24/83 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/351 ,  H05K1/0271 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/10848 ,  H05K2203/0577 ,  H05K3/3436

Abstract: An electronic parts loaded module comprises a circuit board having electronic parts connected thereto via a plurality of projecting electrodes, in which two or more of the plurality of projecting electrodes for connecting the electronic parts have a narrowed portion between one end adjacent to the boundary for connection with the electronic parts and the other end adjacent to the boundary for connection with the board, the narrowed portion having a cross-section which has different dimensions in crossing directions, or a minor axis and a major axis different in length from each other. The projecting electrodes are disposed in a manner as the larger dimension or the major axis being aligned along the periphery or the side of the electronic parts, or as surrounding the central area of the surface, on which the electronic parts are loaded. The module can be used in IC cards and liquid crystal display apparatuses and the like.

Abstract translation: 电子部件加载模块包括电路板，其电子部件经由多个突出电极连接，其中，用于连接电子部件的多个突出电极中的两个或更多个在邻近边界的一端之间具有窄的部分 其中电子部件和另一端靠近用于与板连接的边界，所述变窄部分具有在交叉方向上具有不同尺寸的横截面，或者具有彼此不同长度的短轴和长轴。 突出电极以大尺寸或长轴沿着电子部件的周边或侧面对准的方式设置，或者围绕安装有电子部件的表面的中心区域。 该模块可以用于IC卡和液晶显示装置等。

公开(公告)号：US09332645B2

公开(公告)日：2016-05-03

申请号：US14190297

申请日：2014-02-26

Applicant: DENSO CORPORATION ,  Murata Manufacturing Co., Ltd.

Inventor： Yuuto Kamiya ,  Toru Itabashi ,  Ryoichi Shiraishi ,  Yuki Mikami ,  Akihiro Yanagisawa ,  Shigeki Nishiyama

IPC: H02H5/04 ,  H05K1/18 ,  H05K3/34

CPC classification number: H05K1/181 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10181 ,  H05K2201/10636 ,  H05K2201/10757 ,  H05K2201/10818 ,  H05K2201/10848 ,  H05K2201/10946 ,  Y02P70/611

Abstract: A main body of an electronic part has multiple electrodes, to which multiple terminals are respectively connected. The terminals include a fuse terminal and a normal terminal, each of which extends from the main body to a printed board so that the main body is supported at a position above and separated from a board surface of the printed board. The fuse terminal has an intermediate portion between an electrode-connected portion and a land-connected portion. The intermediate portion has a cut-off portion having a smaller width than other portions of the fuse terminal, so that the cut-off portion is melted down when excess current flows in the fuse terminal. The intermediate portion extends in a direction parallel to the board surface or in a direction inclined to the board surface at an angle smaller than 90 degrees.

Abstract translation: 电子部件的主体具有分别连接有多个端子的多个电极。 端子包括保险丝端子和正常端子，每个端子从主体延伸到印刷电路板，使得主体被支撑在印刷电路板的板表面上方和离开印刷电路板的位置。 熔丝端子在电极连接部分和平台连接部分之间具有中间部分。 中间部分具有比熔丝端子的其它部分更小的宽度的截止部分，使得当过剩电流在熔丝端子中流动时，切断部分熔化。 中间部分在平行于板表面的方向上或者以小于90度的角度沿与板表面倾斜的方向延伸。

公开(公告)号：US09318350B2

公开(公告)日：2016-04-19

申请号：US13936936

申请日：2013-07-08

Applicant: General Dynamics Advanced Information Systems, Inc.

Inventor： Deepak Keshav Pai ,  Melvin Eric Graf

IPC: B23K26/362 ,  H01L21/50 ,  H01L21/60 ,  H01L21/48 ,  B23K26/36 ,  H01L23/495 ,  H05K3/34

CPC classification number: H01L21/4821 ,  B23K26/361 ,  B23K26/362 ,  H01L21/50 ,  H01L23/49541 ,  H01L23/49548 ,  H01L2924/0002 ,  H05K3/3426 ,  H05K2201/10848 ,  H01L2924/00

Abstract: An embodiment of the invention generally relates to a method of converting a commercial off-the-shelf electrical lead to a rugged off-the-shelf electrical lead by laser machining a portion of the electrical lead. The method includes ablating material from the electrical lead of the commercial off-the-shelf component to reduce the moment of inertia or increase the flexibility of the electrical lead.

Abstract translation: 本发明的一个实施方案一般涉及通过激光加工一部分电引线将商业现货电导线转换成坚固的现成的电引线的方法。 该方法包括从商业现成部件的电引线上烧掉材料以减少转动惯量或增加电引线的灵活性。

公开(公告)号：US08325005B2

公开(公告)日：2012-12-04

申请号：US13164315

申请日：2011-06-20

Applicant: Joseph Szwarc ,  Dany Mazliah ,  Makio Sato ,  Toru Okamoto

Inventor： Joseph Szwarc ,  Dany Mazliah ,  Makio Sato ,  Toru Okamoto

IPC: H01C7/10

CPC classification number: H01C1/14 ,  H01C1/144 ,  H01C7/003 ,  H01C17/006 ,  H01C17/28 ,  H05K3/3426 ,  H05K2201/10651 ,  H05K2201/10848 ,  Y02P70/613 ,  Y10T29/49082

Abstract: A chip resistor having first and second opposite ends includes a rigid insulated substrate having a top surface and an opposite bottom surface, a first electrically conductive termination pad and a second electrically conductive termination pad, both termination pads on the top surface of the rigid insulated substrate, a layer of resistive material between the first and second electrically conductive termination pads, and a first and a second flexible lead, each made of an electrically conductive metal with a solder enhancing coating. The first flexible lead attached and electrically connected to the first electrically conductive termination pad and the second flexible lead attached and electrically connected to the second electrically conductive termination pad. Each of the flexible leads has a plurality of lead sections facilitating bending around the end of the chip resistor.

Abstract translation: 具有第一和第二相对端的芯片电阻器包括具有顶表面和相对底表面的刚性绝缘基板，第一导电终端焊盘和第二导电终端焊盘，刚性绝缘基板的顶表面上的两个端接焊盘 ，在第一和第二导电终端焊盘之间的电阻材料层，以及每个由具有焊料增强涂层的导电金属制成的第一和第二柔性引线。 第一柔性引线附接并电连接到第一导电终端焊盘和第二柔性引线，并且电连接到第二导电终端焊盘。 每个柔性引线具有多个引线部分，便于围绕芯片电阻器的端部弯曲。

公开(公告)号：US08129227B2

公开(公告)日：2012-03-06

申请号：US12885654

申请日：2010-09-20

Applicant: John P Tellkamp

Inventor： John P Tellkamp

IPC: H01L21/44 ,  H01L21/48

CPC classification number: H01L23/49548 ,  H01L21/4828 ,  H01L21/4842 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/3426 ,  H05K2201/10689 ,  H05K2201/10848 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/00012

Abstract: A packaged surface-mount semiconductor device has the outer, un-encapsulated lead segments structured in five adjoining portions: The first portion protrudes from the encapsulation about horizontally; the second portion forms a convex bend downwardly; the third portion is approximately straight downwardly; the fourth portion forms a concave bend upwardly; and the fifth portion is straight horizontally. Each segment has across the width a first groove in the third portion, either on the bottom surface or on the top surface. Preferably, the groove is about 2 leadframe thicknesses vertically over the bottom surface of the fifth lead portion. When stamped, the groove may have an angular outline about 5 and 50 μm deep; when etched, the groove may have an approximately semicircular outline about 50 to 125 μm deep. A second groove may be located in the second segment portion; a third groove may be located in the transition region from the third to the fourth segment portions.

Abstract translation: 封装的表面贴装半导体器件具有构造在五个相邻部分中的外部未封装引线段：第一部分围绕水平从封装突出; 第二部分向下形成凸起的弯曲部分; 第三部分大致直线向下; 第四部分向上形成凹弯; 第五部分是水平的。 每个段在宽度上具有第三部分中的第一凹槽，无论是在底表面上还是在顶表面上。 优选地，凹槽在垂直于第五引线部分的底表面上的约2个引线框厚度。 当冲压时，凹槽可以具有约5和50μm深的角轮廓; 当蚀刻时，凹槽可以具有约50至125μm深的近似半圆形轮廓。 第二槽可以位于第二段部分中; 第三凹槽可以位于从第三分段部分到第四分段部分的过渡区域中。

公开(公告)号：US20090217519A1

公开(公告)日：2009-09-03

申请号：US12279483

申请日：2007-02-15

Applicant: Bruno Lefevre ,  Christian Schwartz ,  Jean-Yves Moreno

Inventor： Bruno Lefevre ,  Christian Schwartz ,  Jean-Yves Moreno

IPC: H05K3/34

CPC classification number: H05K13/00 ,  B23K3/047 ,  H05K1/181 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/3494 ,  H05K13/0465 ,  H05K2201/10515 ,  H05K2201/10848 ,  H05K2203/1115 ,  H05K2203/1476 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/53174

Abstract: The invention relates to a method for producing an electronic module (2) comprising a printed circuit (4) board (3), at least one first type of component (5), and a second type of component (6), said method comprising the following steps: solder (8) is placed on the board; the first type of component is placed in position; the board is generally heated in order to melt the solder in such a way as to solder the first type of component; the second type of component is positioned in such a way that it has tongues (7) which are supported on the board by means of solder; and the solder is locally heated such that it melts in order to solder the second type of component. The invention also relates to a production line for implementing said method.

Abstract translation: 本发明涉及一种用于制造电子模块（2）的方法，该电子模块（2）包括印刷电路板（4），至少一种第一类型的部件（5）和第二类型的部件（6），所述方法包括 以下步骤：将焊料（8）放在板上; 第一种类型的部件被放置就位; 板通常被加热以便熔化焊料，以便焊接第一类型的部件; 第二类型的部件被定位成使得其具有通过焊料支撑在板上的舌部（7）; 并且焊料被局部加热，使得其熔化以便焊接第二类型的部件。 本发明还涉及一种用于实现所述方法的生产线。