Abstract:
The invention has the object of improving the ease of making press-fit connections and preventing degradation of impedance characteristics. The electrical connector of the present invention has a group of contacts comprising a plurality of signal contacts and a plurality of ground contacts, to be press-fit connected to through holes on a PCB, such that the plurality of signal contacts and plurality of ground contacts have bulge portions of larger lateral dimension than the through holes, and the bulge portions have openings in a direction lateral to a direction of insertion of the contacts; and at least one of the ground contacts has an extension portion extending from the bulge portion thereof.
Abstract:
Die Erfindung betrifft Leiterplatten (1) mit mindestens einem Verbindungshaken (2) oder mindestens einer Verbindungsausnehmung (3) zur Herstellung einer mechanischen Verbindung von mindestens zwei Leiterplatten bzw. Flachbaugruppen. Diese mechanische Verbindung hält, in Erfüllung der Aufgabe der Erfindung, einer erhöhten mechanischen Belastung wie z.B. Schwing- und/oder Schockbeanspruchungen stand und ist somit insbesondere für einen Einsatz in der Robotik optimal geeignet . Erreicht wird dies durch die speziell geformten Verbindungshaken (2) im Zusammenspiel mit den dazu passenden Verbindungsausnehmungen (3) , durch die die Leiterplatten nach dem Durchstecken der Haken durch die Ausnehmung mittels Verschieben der Leiterplatten gegeneinander zu einer stabilen formschlüssigen Verbindung zusammengefügt werden.
Abstract:
In this application, a description is given of a passive component comprising two electric connections with a plug-in portion for securing and electrically connecting the component to a printed circuit board, for example an electrolytic capacitor. In accordance with the invention, this component is so constructed that both plug-in portions are provided with two pins, with the plug-in portions being so positioned that the four pins do not extend in a flat plane. By virtue of the measure in accordance with the invention, resoldering of such components can be dispensed with. The use of pins whose length and width are different enables the manual installation of the components in accordance with the invention in the correct position to be simplified.
Abstract:
A semiconductor device package may include a substrate having an insulating layer with a patterned conductive layer formed thereon, the patterned conductive layer including at least a first pattern portion and a second pattern portion. The semiconductor device package may include a leadframe having a lead that is soldered to the substrate with solder provided in an opening between the first pattern portion and the second pattern portion and with the lead inserted into the opening.
Abstract:
A mounting plate and a security device using the same are provided. The mounting plate is for being fixed to a surface, wherein a mounting device is hanged up on the mounting plate, and the mounting plate comprises a first conductive sheet and a second conductive sheet electrically connected to a first electrode of an exterior power and a second electrode of the exterior power respectively. When the mounting device is hanged up on the mounting plate, the exterior power is electrically connected to the mounting device through the first conductive sheet and the second conductive sheet.
Abstract:
The invention relates to an arrangement comprising an electric and/or electronic module (10) and a circuit carrier (12), wherein at least one electric connecting line (14) of the electric and/or electronic module (10) can be accommodated in a recess (16) of the circuit carrier (12). The arrangement comprises at least one clamping element (18a, 18b, 18c, 18d) which immobilizes the at least one connecting line (14) in the recess (16) once it has been introduced into the recess (16).