公开(公告)号：KR1020100019481A

公开(公告)日：2010-02-18

申请号：KR1020097025444

申请日：2008-06-03

Applicant: 아토테크더치랜드게엠베하

Inventor： 슈나이더라인하르트 ,  쿤체헨리 ,  비에너페르디난트

IPC: C25D17/00 ,  C25D21/10 ,  C25D5/04 ,  C25D5/08

CPC classification number: C25D5/08 ,  C25D5/04 ,  C25D17/001 ,  C25D21/10 ,  H05K3/241 ,  H05K2203/0746 ,  H05K2203/1509

Abstract: An apparatus for the electrolytic treatment of the product L using a treatment agent is used to make the treatment of a plate-shaped product more uniform. This apparatus includes: devices for retaining 40, 42 the product L in the apparatus, one or a plurality of flow devices 10, which each include at least one nozzle 15 and are disposed situated opposite the product L, one or a plurality of counter electrodes 30, which are inert relative to the treatment agent and are disposed parallel to at least one treatment surface, means for generating a relative movement 44 between the product L, on the one side, and the flow devices 10 and/or the counter electrodes 30, on the other side, in at least one direction parallel to a treatment surface. The product L can be immersed into the treatment agent during the treatment.

Abstract translation: 使用用于使用处理剂电解处理产品L的装置来使板状产品的处理更均匀。 该装置包括：用于将产品L保持在设备中的装置，一个或多个流动装置10，每个流动装置10包括至少一个喷嘴15并且设置成与产品L相对设置，一个或多个对置电极 30，其相对于处理剂是惰性的并且平行于至少一个处理表面设置，用于在一侧的产品L与流动装置10和/或对电极30之间产生相对运动44的装置 另一方面，在平行于处理表面的至少一个方向上。 产品L可以在处理过程中浸入处理剂中。

公开(公告)号：KR1020080000563A

公开(公告)日：2008-01-02

申请号：KR1020077020833

申请日：2006-03-01

Applicant: 아토테크더치랜드게엠베하

Inventor： 다흠스,볼프강 ,  그리에세르,우도 ,  하르트만,필리프

IPC: C08F222/02 ,  C08F8/44 ,  C25D3/38

CPC classification number: C25D3/38 ,  C08F8/02 ,  C08F8/44 ,  C08F226/02 ,  C08F2800/10 ,  H05K3/423

Abstract: The invention relates to a polyvinylammonium compound, to a method of manufacturing said compound, to an aqueous acidic solution containing at least said polyvinylammonium compound for electrolytically depositing a copper deposit as well as to a method of electrolytically depositing a copper deposit using said aqueous acidic solution, said polyvinylammonium compound corresponding to the general chemical formula (I): as well as to polyvinylammonium compounds of the general chemical formula (I), wherein one of the monomer units or both having indices I and m are present in the neutral form.

Abstract translation: 本发明涉及一种聚乙烯铵化合物，涉及一种制备所述化合物的方法，至少含有所述聚乙烯基铵化合物的酸性水溶液用于电沉积铜沉积物以及使用所述酸性水溶液电沉积铜沉积物的方法 对应于一般化学式（I）的所述聚乙烯基铵化合物：以及一般化学式（I）的聚乙烯基铵化合物，其中一个单体单元或两个具有指数I和m的两者均以中性形式存在。

公开(公告)号：KR1020070043816A

公开(公告)日：2007-04-25

申请号：KR1020077002390

申请日：2005-07-28

Applicant: 아토테크더치랜드게엠베하

Inventor： 바론,데이빗,토머스 ,  호프만,한스피터 ,  슈나이더,라인하트

IPC: H05K1/18 ,  H01L21/48

CPC classification number: H01L21/4867 ,  H01L21/486 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/3011 ,  H05K1/185 ,  H05K3/107 ,  H05K3/125 ,  H05K3/1258 ,  H05K3/246 ,  H05K3/4069 ,  H05K3/465 ,  H05K3/4664 ,  H05K2201/0329 ,  H05K2201/0347 ,  H05K2201/09036 ,  H05K2203/013 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  H01L2924/00

Abstract: 정당한 노력으로 전자 회로 어셈블리 상에 매우 작은 라인 및 공간(≤25㎛, 바람직하게는 ≤10㎛ 및 5㎛만큼 작은)을 생성하기 위해, a) 유전체층을 제공하는 단계; b) 트렌치 및 부품 리세스를 포함하는 그룹에서 선택된 층에 하나 이상의 구성요소를 제공하기 위해 레이저 삭마에 의해 상기 유전체층에 3차원 구조를 형성하는 단계; c) 상기 구성요소들에 노출된 상기 유전체층의 표면 영역의 적어도 일부에, 도전성 입자나 내재 도전성 폴리머 중 적어도 하나를 상기 표면 상에 함유하거나 형성하는 유체를 도포하는 단계; 및 d) 상기 표면 영역의 적어도 일부를 금속화하는 단계를 포함하는 방법이 이용된다.

公开(公告)号：KR1020070026698A

公开(公告)日：2007-03-08

申请号：KR1020067027933

申请日：2005-06-30

Applicant: 아토테크더치랜드게엠베하

Inventor： 슈나이더라인하르트

IPC: C25D7/12

CPC classification number: C23C18/1601 ,  C23C18/1619 ,  C25D7/12 ,  C25D17/02 ,  H05K3/0085

Abstract: A device and a method for chemically or electrolytically treating work pieces (1) are proposed in an effort to avoid irregular contours of finest conductive structures, pads and lands as well as bridges (shorts) on the one side or breaks on printed circuit boards on the other side. The device comprises processing tanks (2) for treating the work pieces and a conveyor system for the transport thereof. The conveyor system comprises at least one transport carriage (18), at least one holding element (14, 25) and at least one connection means (12, 13, 35) between the transport carriage(s) and the holding element(s). The processing tanks are adjoined with a clean room zone (3). The work pieces are conveyed through the clean room zone using the conveyor system. ® KIPO & WIPO 2007

Abstract translation: 提出了一种用于化学或电解处理工件（1）的装置和方法，以避免最细的导电结构，焊盘和焊盘以及一侧的桥（短路）的不规则轮廓或印刷电路板上的断裂 另一边。 该装置包括用于处理工件的处理罐（2）和用于运输工件的输送系统。 输送系统包括至少一个输送托架（18），至少一个保持元件（14,25）和至少一个连接装置（12,13,35）之间，该输送托架与保持元件之间， 。 处理槽与洁净室区（3）相邻。 通过传送系统将工件输送到洁净室区域。 ®KIPO＆WIPO 2007

公开(公告)号：KR1020060134136A

公开(公告)日：2006-12-27

申请号：KR1020067020126

申请日：2005-01-11

Applicant: 아토테크더치랜드게엠베하

Inventor： 펠스,칼,크리스쳔 ,  카미야,쇼이치 ,  존스,알렌,알,

IPC: C25D3/56

CPC classification number: C25D3/562 ,  C25D3/20

Abstract: In one embodiment, this invention relates to an aqueous acid iron phosphorus bath which comprises (A) at least one compound from which iron can be electrolytically deposited, (B) hypophosphite ion, and (C) a sulfur-containing compound selected from sulfoalkylated polyethylene imines, sulfonated safranin dye, and mercapto aliphatic sulfonic acids or alkali metal salts thereof. Optionally, the aqueous acidic iron phosphorus electroplating bath of the invention also may comprise aluminum irons. The alloys which are deposited on the substrates by the process of the present invention are characterized by the presence of iron, phosphorus and sulfur.

Abstract translation: 在一个实施方案中，本发明涉及酸性铁磷酸盐水溶液，其包含（A）至少一种可以电解沉积铁的化合物，（B）次亚磷酸根离子，和（C）选自磺烷基化聚乙烯的含硫化合物 亚胺，磺化番红素染料和巯基脂族磺酸或其碱金属盐。 任选地，本发明的酸性磷酸铁电镀浴也可以包括铝铁。 通过本发明的方法沉积在基底上的合金的特征在于铁，磷和硫的存在。

公开(公告)号：KR1020060133544A

公开(公告)日：2006-12-26

申请号：KR1020067013429

申请日：2005-01-20

Applicant: 아토테크더치랜드게엠베하

Inventor： 호프만한스피.

IPC: H05K3/46

CPC classification number: H05K3/465 ,  H05K3/045 ,  H05K3/107 ,  H05K3/188 ,  H05K3/4661 ,  H05K2201/0323 ,  H05K2201/0329 ,  H05K2201/09036 ,  Y10T29/49155

Abstract: A method of manufacturing a circuit carrier and the use of said method are proposed, said method comprising, after providing a printed circuit board (a), coating the circuit board on at least one side thereof with a dielectric (b), structuring the dielectric for producing trenches and vias therein using laser ablation (c) are performed. Next, a primer layer is deposited onto the dielectric, either onto the entire surface thereof or into the produced trenches and vias only (d). A metal layer is deposited onto the primer layer, with the trenches and vias being completely filled with metal for forming conductor structures therein (e). Finally, the excess metal and the primer layer are removed until the dielectric is exposed if the primer layer was deposited onto the entire surface thereof, with the conductor structures remaining intact (f).

Abstract translation: 提出一种制造电路载体的方法和所述方法的使用，所述方法包括在提供印刷电路板（a）之后，在其至少一侧上用电介质（b）涂覆电路板，构造电介质 用于使用激光烧蚀（c）来制造其中的沟槽和通孔。 接下来，将底漆层沉积到电介质的整个表面上，或沉积到所制造的沟槽和通孔中（d）。 金属层沉积在底漆层上，其中沟槽和通孔被完全填充金属，用于在其中形成导体结构（e）。 最后，如果底漆层沉积在其整个表面上，导体结构保持完整（f），则去除多余的金属和底漆层直到电介质暴露。

公开(公告)号：KR1020060092225A

公开(公告)日：2006-08-22

申请号：KR1020067006122

申请日：2004-09-27

Applicant: 아토테크더치랜드게엠베하

Inventor： 프라우프터,해리 ,  바론,데이비드,토마스 ,  조알,쿨딥,싱 ,  브룩스,패트릭,폴

IPC: H05K3/06

CPC classification number: C23F1/18 ,  H05K3/022 ,  H05K3/064 ,  H05K3/383 ,  H05K3/4641 ,  H05K2201/0338 ,  H05K2201/068 ,  H05K2203/124

Abstract: Process to improve adhesion of dielectric materials to a metal layer, including providing an unpatterned metal layer having a first major surface; micro-roughening the first major surface to form a micro-roughened surface; and etching the metal layer to form a circuit pattern in the metal layer, in which the micro- roughening is carried out prior to the etching.

Abstract translation: 提高电介质材料对金属层的附着力的方法，包括提供具有第一主表面的未图案化金属层; 微粗化第一主表面形成微粗糙表面; 并蚀刻金属层以在金属层中形成电路图案，其中在蚀刻之前进行微粗化。

公开(公告)号：KR1020060031644A

公开(公告)日：2006-04-12

申请号：KR1020057024951

申请日：2004-04-14

Applicant: 아토테크더치랜드게엠베하

Inventor： 조쉬,나얀에이치. ,  메타,마우릭디.

IPC: C23C18/31 ,  C23C18/18 ,  C25D5/44

CPC classification number: C25D5/44 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/32 ,  C23C18/54 ,  C25D3/38 ,  C25D5/14

Abstract: The present invention provides a non-cyanide aqueous acidic immersion plating solution having a pH of from about 3.5 to about 6.5 and comprising zinc ions, nickel ions and/or cobalt iron ions, and fluoride ions. In one embodiment the immersion plating solutions of the invention also contain at least one inhibitor containing one or more nitrogen atoms, sulfur atoms, or both nitrogen and sulfur atoms. The present invention also relates to methods for depositing zinc alloy protective coatings on aluminum and aluminum alloy substrates comprising immersing the aluminum or aluminum alloy substrate in the non-cyanide acidic immersion plating solutions of the invention. Optionally, the zinc alloy coated aluminum or aluminum alloy substrate is plated using an electroless or electrolytic metal plating solution.

Abstract translation: 本发明提供pH为约3.5至约6.5的非氰化物水性酸性浸液，其包含锌离子，镍离子和/或钴铁离子以及氟离子。 在一个实施方案中，本发明的浸镀溶液还含有至少一种含有一个或多个氮原子，硫原子或氮原子和硫原子的抑制剂。 本发明还涉及在铝和铝合金基底上沉积锌合金保护涂层的方法，包括将铝或铝合金基底浸入本发明的非氰化物酸性浸渍电镀溶液中。 任选地，使用无电镀或电解金属电镀溶液对涂有锌合金的铝或铝合金基板进行镀覆。

公开(公告)号：KR1020060004981A

公开(公告)日：2006-01-16

申请号：KR1020057021326

申请日：2004-06-01

Applicant: 아토테크더치랜드게엠베하

Inventor： 오즈콕아키프 ,  로엘프스베른트오트마르 ,  이겔오스발트 ,  겐스헤르코 ,  마테자트카이-젠스

IPC: C25D21/18 ,  H05K3/42

CPC classification number: H05K3/423 ,  C25D21/18 ,  H05K2201/09563 ,  H05K2203/0796

Abstract: The invention provides a process for filling mu-blind vias in the manufacture of printed circuit boards, which process comprises the following steps: (i) providing a bath electrolyte for galvanic plating with metallic coatings comprising a copper metal salt and optionally organic additives, (ii) operating the bath with direct current density of 0.5 to 10 A/dm2, or current pulses at an effective current density of 0.5 to A/dm2, (iii) withdrawing part of the electrolyte from the galvanic bath, (iv) adding an oxidizing agent to the part of the electrolyte which has been withdrawn, (v) optionally irradiating the withdrawn electrolyte with UV light and (vi) recycling the withdrawn part to the galvanic bath and replacing the organic additives destroyed by the oxidation treatment.

Abstract translation: 本发明提供了一种用于在制造印刷电路板中填充多孔通孔的方法，该方法包括以下步骤：（i）提供用于电镀的浴电解液，其中金属涂层包括铜金属盐和任选的有机添加剂（ ii）以0.5至10A / dm 2的直流电流密度或电流脉冲以0.5至A / dm 2的有效电流密度操作浴，（iii）从电镀槽中取出部分电解质，（iv） （v）任选地用UV光照射所提取的电解质，和（vi）将取出的部分再循环到电镀浴中，并且替换由氧化处理破坏的有机添加剂。

公开(公告)号：KR1020050058423A

公开(公告)日：2005-06-16

申请号：KR1020057002957

申请日：2003-08-28

Applicant: 아토테크더치랜드게엠베하

Inventor： 슈나이더라인하르트 ,  케니스테판 ,  퀴스너토르슈텐 ,  플뢰제볼프강 ,  렌츠베르트 ,  슈트로이프헤리베르트

IPC: C23C18/00

CPC classification number: C25D17/28 ,  C25D17/06 ,  H05K3/241

Abstract: A problem during electrolytic treatment of printed circuit boards having a very thin basic metallization is that the treatment yields irregular results in various regions on the surface of the printed circuit board. In overcoming this problem the invention provides a device for electrolytically treating an at least superficially electrically conducting work piece having at least two substantially opposing side edges. The device comprises current supply devices for the work piece, said current supply devices each comprising contact strips located on the opposing side edges which are capable of electrically contacting the work piece at the substantially opposing side edges.

Abstract translation: 在具有非常薄的碱性金属化的印刷电​​路板的电解处理期间的问题是，处理在印刷电路板的表面上的各个区域产生不规则的结果。 在克服这个问题时，本发明提供一种用于电解处理至少表面上导电的工件的装置，其具有至少两个基本相对的侧边缘。 该装置包括用于工件的电流供应装置，所述电流供应装置各自包括位于相对的侧边缘上的接触条，其能够在大致相对的侧边缘处电接触工件。