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公开(公告)号：CA2352452A1
公开(公告)日：2002-02-04
申请号：CA2352452
申请日：2001-07-10
Applicant: MEMSCAP
Inventor： GUILLON BERTRAND , FEDELI JEAN-MARC
Abstract: Microcomposant inductif (1), tel que micro-inductance ou microtransformateur, comportant un bobinage métallique (2) ayant la forme d' un solénoïde, et un noyau magnétique (4) incluant un ruban (13) en un matériau ferromagnétique, positionné au centre du solénoïde (2), caractérisé en ce qu e le noyau (4) comporte au moins une couche additionnelle (14) parallèle au ruban (13), apte à générer un champ magnétique orienté perpendiculairement à l'axe (20) du solénoïde (2).
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公开(公告)号：FR2791470A1
公开(公告)日：2000-09-29
申请号：FR9903762
申请日：1999-03-23
Applicant: MEMSCAP
Inventor： BASTERES LAURENT , MHANI AHMED , VALENTIN FRANCOIS , KARAM JEAN MICHEL
IPC: H01F17/00 , H01L21/02 , H01L23/522 , H01L27/04 , H01L21/822 , H01L21/30 , H01L49/00 , H01F5/00
Abstract: An IC (1), with a thick copper induction winding (20) located above a passivation layer (6) and having depending ends (12) connected to contact pads (5), is new. A new monolithic IC (1) has metallic contact pads (5), extending from flush with the upper surface (6) of a passivation layer (4) to an underlying semiconductor substrate layer (2), and an induction coil winding (20) which is located in a plane parallel to the passivation layer upper surface (6) and which consists of copper turns (21, 22, 23, 27, 28) of greater than 10 microns thickness, the winding ends (12) extending below the winding plane for connection to the contact pads (5). An Independent claim is also included for manufacturing a monolithic IC incorporating an inductive component by: (a) depositing a polyimide or benzocyclobutene layer on a semiconductor substrate (2) which is covered with a passivation layer (4) and which has metallic contact pads (5) extending from the passivation layer upper surface (6) to the substrate (2); (b) depositing a silica layer (16) on the polyimide or benzocyclobutene layer; (c) forming openings in the silica and polyimide or benzocyclobutene layers down to the contact pads (5); (d) applying a metal growth layer and a photosensitive resin layer on the structure; (e) exposing and developing the resin to form the lower face of the inductive component; (f) electrodepositing a copper layer on the exposed zones of the metal growth layer to form the inductive component strip; and (g) removing residues of the resin and the metal growth layer.
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公开(公告)号：DE602004004898D1
公开(公告)日：2007-04-05
申请号：DE602004004898
申请日：2004-06-14
Applicant: MEMSCAP INC
Inventor： GLUKH KONSTANTIN , WOOD ROBERT L , AGRAWAL VIVEK
Abstract: A magnetic switch includes a substrate having a recess therein. A rotor or rotors are provided on the substrate. The rotor includes a tail portion that overlies the recess, and a head portion that extends on the substrate outside the recess. The rotor may be fabricated from ferromagnetic material, and is configured to rotate the tail in the recess in response to a changed magnetic field. First and second magnetic switch contacts also are provided that are configured to make or break electrical connection between one another in response to rotation of the tail in the recess, in response to the changed magnetic field. Related operation and fabrication methods also are described.
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公开(公告)号：FR2874807B1
公开(公告)日：2006-11-10
申请号：FR0451969
申请日：2004-09-03
Applicant: MEMSCAP SA
Inventor： LAURENS PAUL , RANSCH PASCAL
Abstract: A chip card for analyzing physicochemical properties of a cutaneous surface includes at least one body sensor which can deliver a signal representing a measurement of a physicochemical property of the cutaneous surface, and a processing unit used to treat signals delivered by the body sensor and an optional environment sensor and to then store signals in a storage unit on the card. An electrical energy source on the card provides electrical power to the body sensor and the processing unit.
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公开(公告)号：FR2874807A1
公开(公告)日：2006-03-10
申请号：FR0451969
申请日：2004-09-03
Applicant: MEMSCAP SA
Inventor： LAURENS PAUL , RANSCH PASCAL
Abstract: Dispositif d'analyse des propriétés physico-chimiques d'une surface cutanée se présentant sous la forme d'une carte à puce (1) et comportant :- au moins un capteur (2) apte à délivrer un signal représentatif d'une mesure de la propriété physico-chimique ;- une unité de traitement (3) apte à conditionner le signal délivré par le capteur (2) et à le mémoriser dans une unité de stockage (4) ;une source d'énergie électrique (5) pour alimenter ledit capteur (2) et l'unité de traitement
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Patent Agency Ranking
公开(公告)号：CA2530658A1
公开(公告)日：2005-01-20
申请号：CA2530658
申请日：2004-06-14
Applicant: MEMSCAP INC
Inventor： GLUKH KONSTANTIN , WOOD ROBERT L , AGRAWAL VIVEK
Abstract: A magnetic switch includes a substrate having a recess therein. A rotor or rotors are provided on the substrate. The rotor includes a tail portion that overlies the recess, and a head portion that extends on the substrate outsid e the recess. The rotor may be fabricated from ferromagnetic material, and is configured to rotate the tail in the recess in response to a changed magneti c field. First and second magnetic switch contacts also are provided that are configured to make or break electrical connection between one another in response to rotation of the tail in the recess, in response to the changed magnetic field. Related operation and fabrication methods also are described .
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公开(公告)号：DE60101110T2
公开(公告)日：2004-09-09
申请号：DE60101110
申请日：2001-03-19
Applicant: MEMSCAP CROLLES
Inventor： WOOD ROBERT L
Abstract: Lockable microelectromechanical actuators include a microelectromechanical actuator, a thermoplastic material that is coupled to the microelectromechanical actuator to lock the microelectromechanical actuator, and a heater that melts the thermoplastic material to allow movement of the microelectromechanical actuator. When the thermoplastic material solidifies, movement of the microelectromechanical actuator can be locked, without the need to maintain power, in the form of electrical, magnetic and/or electrostatic energy, to the microelectromechanical actuator, and without the need to rely on mechanical friction to hold the microelectromechanical actuator in place. Thus, the thermoplastic material can act as a glue to hold structures in a particular position without the need for continuous power application. Moreover, it has been found unexpectedly, that the thermoplastic material can solidify rapidly enough to lock the microelectromechanical actuator at or near its most recent position.
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公开(公告)号：FR2842018B3
公开(公告)日：2004-06-04
申请号：FR0208253
申请日：2002-07-02
Applicant: MEMSCAP
Inventor： GIRARDIE LIONEL
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公开(公告)号：FR2834387B1
公开(公告)日：2004-02-27
申请号：FR0117069
申请日：2001-12-31
Applicant: MEMSCAP
Inventor： GIRARDIE LIONEL
IPC: H01L27/04 , C23C16/40 , C23C16/44 , C23C16/455 , H01L21/28 , H01L21/316 , H01L21/822 , H01L29/51 , H01L29/92 , H01L21/329
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公开(公告)号：FR2832853B1
公开(公告)日：2004-02-27
申请号：FR0115458
申请日：2001-11-29
Applicant: MEMSCAP
Inventor： GIRARDIE LIONEL , DAVID JEAN BAPTISTE
IPC: H01F17/00 , H01F41/04 , H01L21/3205 , H01L21/822 , H01L23/52 , H01L23/522 , H01L23/532 , H01L27/04 , H01L21/02
Abstract: Electronic component incorporating inductive microcomponent is manufactured by etching copper-diffusion barrier layer (15) between turns (30, 31) of inductive microcomponent. Fabrication of electronic component incorporating inductive microcomponent, comprises: (i) depositing layer of material having low relative permittivity on substrate (1); (ii) depositing layer (12) forming hard mask; (iii) forming aperture in the hard mask vertically above the metal pads; (iv) etching the layer on material having low relative permittivity down to metal pad to form interconnection hole or via; (v) depositing layer forming copper barrier diffusion; (vi) depositing copper primer layer; (vii) depositing protective mask and removing it from the bottom of the via; (viii) depositing copper electrolytically in the via; (ix) removing the rest of the protective mask; (x) depositing top resist layer with thickness similar to the thickness of turns of the inductive microcomponent; (xi) etching the resist layer to form channels defining geometry of turns of the inductive microcomponent; (xii) depositing layer electrolytically in the etch channels; (xiii) removing the rest of the top resist layer; (xiv) etching the copper primer layer between copper turns; and (xv) etching copper-diffusion barrier layer between turns of inductive microcomponent.
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