公开(公告)号：US20150334825A1

公开(公告)日：2015-11-19

申请号：US14297516

申请日：2014-06-05

Applicant: Kenneth S. Bahl ,  Konstantine Karavakis ,  Steve Carney

Inventor： Kenneth S. Bahl ,  Konstantine Karavakis ,  Steve Carney

IPC: H05K1/02 ,  H05K3/18 ,  H05K3/40 ,  H05K1/11 ,  C23C18/38 ,  C23C18/20 ,  C23C18/16 ,  H05K1/03 ,  H05K3/10 ,  H05K3/46

CPC classification number: C23C18/1608 ,  C23C18/204 ,  C23C18/38 ,  H05K3/185 ,  H05K3/4602 ,  H05K2201/0236 ,  H05K2201/0376 ,  H05K2203/025 ,  H05K2203/0716 ,  H05K2203/107 ,  Y10T29/49165

Abstract: A printed circuit board includes a laminate substrate. The laminate substrate includes catalytic core material that resists metal plating except where a surface of the catalytic material is ablated. Metal traces are formed within in trace channels within the laminate substrate. The channels extend below the surface of the catalytic material.

Abstract translation: 印刷电路板包括层叠基板。 层压基板包括抵抗金属电镀的催化芯材料，除了催化材料的表面被烧蚀之外。 金属痕迹形成在层压基板内的痕迹通道内。 通道延伸到催化材料的表面之下。

公开(公告)号：US20150247243A1

公开(公告)日：2015-09-03

申请号：US14427849

申请日：2013-09-05

Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION

Inventor： Takahiro Takano ,  Takahiko Sumino ,  Kentarou Ishihara ,  Naohisa Akashi

IPC: C23C18/28 ,  H01Q1/38 ,  C08K3/22 ,  C23C18/20 ,  C08K7/14

CPC classification number: C23C18/285 ,  C08G69/265 ,  C08K3/22 ,  C08K3/2279 ,  C08K7/14 ,  C08K2003/2231 ,  C08K2003/2241 ,  C08L53/02 ,  C08L77/06 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/38 ,  H01Q1/243 ,  H01Q1/38 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/182 ,  H05K2201/0236 ,  H05K2203/107

Abstract: Provide is a thermoplastic resin composition from which a resin molded article having high whiteness and mechanical strength can be obtained while retaining the plating properties of the resin molded article. A thermoplastic resin composition comprising a thermoplastic resin, and 1 to 30 parts by weight of a laser direct structuring additive, 0.1 to 20 parts by weight of a titanium oxide and 10 to 230 parts by weight of a glass fiber per 100 parts by weight of the thermoplastic resin, wherein the laser direct structuring additive has an L value of 50 or more, and the glass fiber comprises SiO2 and Al2O3 in a proportion of 60 to 70% by weight of SiO2 and 20 to 30% by weight of Al2O3.

Abstract translation: 提供一种热塑性树脂组合物，其中可以获得具有高白度和机械强度的树脂模塑制品，同时保持树脂模塑制品的电镀性能。 包含热塑性树脂的热塑性树脂组合物和1至30重量份的激光直接结构化添加剂，0.1至20重量份的氧化钛和10至230重量份的玻璃纤维，相对于每100重量份的 所述热塑性树脂，其中所述激光直接结构化添加剂的L值为50以上，所述玻璃纤维包含SiO 2和Al 2 O 3，所述SiO 2和Al 2 O 3的比例为60〜70重量％的SiO 2和20〜30重量％的Al 2 O 3。

公开(公告)号：US08933161B2

公开(公告)日：2015-01-13

申请号：US14005692

申请日：2012-03-16

Applicant: Takahiro Takano ,  Takahiko Sumino ,  Kentarou Ishihara ,  Bernardus Antonius Gerardus Schrauwen

Inventor： Takahiro Takano ,  Takahiko Sumino ,  Kentarou Ishihara ,  Bernardus Antonius Gerardus Schrauwen

IPC: B60C1/00 ,  C08J5/04 ,  C23C18/20 ,  C23C18/16 ,  C08G69/26 ,  C08K13/04 ,  H05K3/18 ,  B41M5/26 ,  H01Q1/38 ,  C08L77/06 ,  C08K7/04 ,  C23C18/38 ,  C08K9/02 ,  H05K1/03 ,  C08K3/22

CPC classification number: C08K13/04 ,  B41M5/265 ,  C08G69/265 ,  C08J5/043 ,  C08J2377/00 ,  C08K3/2279 ,  C08K7/04 ,  C08K9/02 ,  C08L77/06 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/38 ,  H01Q1/38 ,  H05K1/0366 ,  H05K3/185 ,  H05K2201/0129 ,  H05K2201/0236 ,  H05K2201/0293 ,  H05K2201/09118 ,  H05K2201/0999 ,  H05K2203/107 ,  C08L77/00

Abstract: Provided is a thermoplastic resin molded article excellent in bending strength, flexural modulus and Charpy impact strength, on which the plated layer may be formed in a successful manner. The thermoplastic resin composition for laser direct structuring comprising, per 100 parts by weight of the thermoplastic resin, 10 to 150 parts by weight of an inorganic fiber and 1 to 30 parts by weight of a laser direct structuring additive, the laser direct structuring additive containing at least one of copper, antimony and tin, and having a Mohs hardness 1.5 or more smaller than the Mohs hardness of the inorganic fiber.

Abstract translation: 提供了弯曲强度，弯曲模量和夏氏冲击强度优异的热塑性树脂成型体，其上可以成功地形成镀层。 用于激光直接结构的热塑性树脂组合物包括：相对于100重量份的热塑性树脂，10至150重量份的无机纤维和1至30重量份的激光直接结构化添加剂，所述激光直接结构化添加剂包含 铜，锑和锡中的至少一种，并且具有比无机纤维的莫氏硬度小1.5或更大的莫氏硬度。

公开(公告)号：US20140296410A1

公开(公告)日：2014-10-02

申请号：US14227271

申请日：2014-03-27

Applicant: SABIC Innovative Plastics IP B.V.

Inventor： Yunan Cheng ,  Xiaofeng Yu ,  Yuxian An

IPC: C08K3/22 ,  C08L69/00 ,  C08K3/34 ,  C08K3/40 ,  C08K3/04

CPC classification number: C08K3/22 ,  C08K3/04 ,  C08K3/24 ,  C08K3/32 ,  C08K3/34 ,  C08K7/14 ,  C08K2003/2251 ,  C08K2003/328 ,  C08L69/00 ,  H01B3/305 ,  H01B3/426 ,  H01B3/47 ,  H05K1/0373 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/107 ,  C08L83/10

Abstract: The present disclosure relates to a polymer composition. The disclosed composition comprises a polycarbonate polymer, a laser direct structuring additive capable of being activated by electromagnetic radiation and thereby forming elemental metal nuclei, reinforcing filler, and a laser direct structuring synergist. Also disclosed is a method for making the disclosed polymer composition and an article of manufacture comprising the disclosed polymer composition.

Abstract translation: 本公开涉及聚合物组合物。 所公开的组合物包含聚碳酸酯聚合物，能够被电磁辐射激活并由此形成元素金属核的激光直接结构化添加剂，增强填料和激光直接结构化增效剂。 还公开了制备所公开的聚合物组合物的方法和包含所公开的聚合物组合物的制品。

公开(公告)号：US20140290530A1

公开(公告)日：2014-10-02

申请号：US14242763

申请日：2014-04-01

Applicant: BYD COMPANY LIMITED ,  SHENZHEN BYD AUTO R&D COMPANY LIMITED

Inventor： Qing GONG ,  Wei ZHOU ,  Bifeng MAO ,  Weifeng MIAO

IPC: C23C18/40 ,  H05K3/18

CPC classification number: C09D11/322 ,  B01J23/002 ,  B01J23/825 ,  B01J23/868 ,  B01J23/8874 ,  B01J23/8878 ,  B01J31/06 ,  B01J35/023 ,  B01J37/0036 ,  B01J37/04 ,  B01J37/08 ,  B01J37/349 ,  B01J2523/00 ,  C01G15/006 ,  C01G37/006 ,  C01G39/006 ,  C01G49/009 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2006/60 ,  C01P2006/80 ,  C09D11/10 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1879 ,  C23C18/204 ,  C23C18/206 ,  H05K3/182 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/0709 ,  H05K2203/107 ,  H05K2203/1131 ,  H05K2203/125 ,  B01J2523/17 ,  B01J2523/31 ,  B01J2523/67 ,  B01J2523/32 ,  B01J2523/842 ,  B01J2523/33 ,  B01J2523/68

Abstract: The present disclosure provides a metal compound. The metal compound is represented by a formula (I): Cu2AαB2-αO4-β (I). A contains at least one element selected from the groups 6 and 8 of the periodic table. B contains at least one element selected from the group 13 of the periodic table, 0

Abstract translation: 本发明提供金属化合物。 金属化合物由式（I）表示：Cu2AaB2-αO4-＆bgr; （一世）。 A包含选自周期表的组6和8中的至少一种元素。 B包含选自周期表第13组中的至少一个元素，0 <α<2，0 <＆bgr <1.5。 还提供了含有金属化合物的聚合物制品和聚合物制品的制备方法以及聚合物制品的表面的选择性金属化。 此外，本公开提供了使用该油墨组合物的油墨组合物和用于绝缘基材的表面的选择性金属化。

公开(公告)号：US08771805B2

公开(公告)日：2014-07-08

申请号：US11270907

申请日：2005-11-10

Applicant: Lucien D. Laude ,  Robert J. Greenberg

Inventor： Lucien D. Laude ,  Robert J. Greenberg

IPC: B05D1/18 ,  B05D3/00 ,  B05D3/06

CPC classification number: H05K3/185 ,  C08J7/12 ,  C08J2383/04 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1657 ,  C23C18/204 ,  C23C18/206 ,  H05K3/28 ,  H05K3/387 ,  H05K2201/0133 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2201/0236 ,  H05K2203/107 ,  H05K2203/1105 ,  Y10T428/26 ,  Y10T428/31663

Abstract: The present invention provides a process for embedding at least one layer of at least one metal trace in a silicone-containing polymer, comprising: a) applying a polymer layer on a substrate; b) thermally treating the polymer; c) irradiating at least one surface area of the polymer with a light beam emitted by an excimer laser; d) immersing the irradiated polymer in at least one autocatalytic bath containing ions of at least one metal, and metallizing the polymer; e) thermally treating the metallized polymer; f) applying a polymer layer covering the thermally treated metallized polymer; and g) thermally treating the metallized covered polymer. The present invention further provides a polymer layer comprising silicone containing oxide particles of SiO2, TiO2, Sb2O3, SnO2, Al2O3, ZnO, Fe2O3, Fe3O4, talc, hydroxyapatite or mixtures thereof and at least one metal trace embedded in said polymer layer.The present invention further provides a flexible electrode array comprising silicone containing oxide particles of SiO2, TiO2, Sb2O3, SnO2, Al2O3, ZnO, Fe2O3, Fe3O4, talc, hydroxyapatite or mixtures thereof and at least one metal trace embedded in said polymer layer.

Abstract translation: 本发明提供了一种在含硅酮聚合物中嵌入至少一层至少一种金属痕迹的方法，包括：a）在基底上施加聚合物层; b）热处理聚合物; c）用由准分子激光器发射的光束照射所述聚合物的至少一个表面积; d）将经辐射的聚合物浸入至少一种含有至少一种金属的离子的自催化浴中，并对聚合物进行金属化; e）热处理金属化聚合物; f）涂覆覆盖热处理的金属化聚合物的聚合物层; 和g）热处理金属化被覆聚合物。 本发明还提供一种聚合物层，其包含含硅氧烷的SiO 2，TiO 2，Sb 2 O 3，SnO 2，Al 2 O 3，ZnO，Fe 2 O 3，Fe 3 O 4，滑石，羟基磷灰石或其混合物的氧化物颗粒，以及嵌入所述聚合物层中的至少一种金属迹线。 本发明还提供一种柔性电极阵列，其包括含硅氧烷的SiO 2，TiO 2，Sb 2 O 3，SnO 2，Al 2 O 3，ZnO，Fe 2 O 3，Fe 3 O 4，滑石，羟基磷灰石或其混合物的氧化物颗粒和嵌入所述聚合物层中的至少一种金属迹线。

公开(公告)号：US20140159285A1

公开(公告)日：2014-06-12

申请号：US14115473

申请日：2011-05-27

Applicant: Kwan Soo Choi

Inventor： Kwan Soo Choi

IPC: B29C67/00 ,  C08K3/22 ,  C08K11/00

CPC classification number: B29C67/0051 ,  B29C64/00 ,  C08K3/22 ,  C08K11/00 ,  C09D5/32 ,  H05K1/0373 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2203/107

Abstract: In an embodiment of the present invention, a touch screen is provided, the touch screen characterized by: an indium tin oxide (ITO) film deposited on a top surface of a flexible plastic film; a first metal layer deposited on the ITO film, and a second metal layer plated on the first metal layer. According to the embodiment of the present invention, the touch screen and the method of manufacturing the same having the excellent sensitivity while securing durability may be provided.

公开(公告)号：US20130136869A1

公开(公告)日：2013-05-30

申请号：US13741446

申请日：2013-01-15

Applicant: MacDermid Acumen, Inc.

Inventor： Robert Hamilton ,  Ernest Long ,  Andrew M. Krol

IPC: B05D3/06

CPC classification number: B05D3/06 ,  C23C18/1612 ,  C23C18/204 ,  C23C18/2086 ,  C23C18/38 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/0786 ,  H05K2203/107 ,  H05K2203/122

Abstract: A method of treating a laser-activated thermoplastic substrate having a metal compound dispersed therein is described. The substrate is contacted with an aqueous composition comprising: (i) a thiol functional organic compound; (ii) an ethoxylated alcohol surfactant; and (iii) xanthan gum. By use of the treatment composition, when the substrate is subsequently laser-activated and plated by electroless plating, extraneous plating of the substrate is substantially eliminated.

Abstract translation: 描述了一种处理其中分散有金属化合物的激光活化热塑性基材的方法。 将底物与含水组合物接触，所述水性组合物包含：（i）硫醇官能的有机化合物; （ii）乙氧基化醇表面活性剂; 和（iii）黄原胶。 通过使用处理组合物，当基板随后通过无电镀进行激光激活和电镀时，基本上消除了基板的外部电镀。

公开(公告)号：US20120060368A1

公开(公告)日：2012-03-15

申请号：US13301812

申请日：2011-11-22

Applicant: Cheng-Po Yu ,  Han-Pei Huang

Inventor： Cheng-Po Yu ,  Han-Pei Huang

IPC: H05K3/22

CPC classification number: H05K1/11 ,  H05K1/0284 ,  H05K1/142 ,  H05K3/185 ,  H05K3/4007 ,  H05K3/4661 ,  H05K2201/0236 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09163 ,  H05K2201/09436 ,  H05K2201/09509 ,  H05K2201/09845 ,  H05K2203/1327 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T428/24802 ,  Y10T428/24917

Abstract: A method of fabrication a circuit board structure comprising providing a circuit board main body, forming a molded, irregular plastic body having a non-plate type, stereo structure and at least one scraggy surface by encapsulating at least a portion of said circuit board main body with injection molded material, and forming a first three-dimensional circuit pattern on said molded, irregular plastic body thereby defining a three-dimensional circuit device.

Abstract translation: 一种制造电路板结构的方法，包括提供电路板主体，通过封装所述电路板主体的至少一部分来形成具有非板型，立体结构和至少一个刮痕表面的模制的不规则塑料体 并且在所述模制的不规则塑料体上形成第一三维电路图案，从而限定三维电路装置。

公开(公告)号：US20100307799A1

公开(公告)日：2010-12-09

申请号：US12479791

申请日：2009-06-06

Applicant: Cheng-Feng CHIANG

Inventor： Cheng-Feng CHIANG

IPC: H05K1/03 ,  H05K3/10 ,  H01K3/22

CPC classification number: H05K3/242 ,  H01L33/486 ,  H01L33/60 ,  H01L33/641 ,  H01L2924/0002 ,  H05K1/0209 ,  H05K1/0284 ,  H05K1/183 ,  H05K3/027 ,  H05K3/108 ,  H05K3/181 ,  H05K3/244 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2201/09127 ,  H05K2201/09363 ,  H05K2201/10106 ,  H05K2201/2054 ,  Y10T29/49158 ,  H01L2924/00

Abstract: A carrier structure for electronic components includes a carrier, an interface layer, insulation paths and a metal layer. The carrier is made of a molded plastic. A reflection cup is formed on the carrier. The carrier is etched, catalyzed and activated, then deposited Ni or Cu by chemical deposition to form an interface layer on it. Afterwards insulation paths are formed on the interface layer by ablating part of the insulation layer employing laser beam radiation, in the followed step, electroplating process is carried out using Cu, Ni, Ag or Au to form a metal layer on the interface layer thereby completing the carrier structure for electronic components.

Abstract translation: 用于电子部件的载体结构包括载体，界面层，绝缘路径和金属层。 载体由模制塑料制成。 在载体上形成反射杯。 载体被蚀刻，催化和活化，然后通过化学沉积沉积Ni或Cu以在其上形成界面层。 之后，通过使用激光束辐射烧蚀绝缘层的一部分，在界面层上形成绝缘路径，在随后的步骤中，使用Cu，Ni，Ag或Au进行电镀工艺，以在界面层上形成金属层，从而完成 电子元件的载体结构。