公开(公告)号：JP6379405B2

公开(公告)日：2018-08-29

申请号：JP2015514349

申请日：2013-05-25

Applicant: キーケルト アクツィーエンゲゼルシャフト

Inventor： バームシャイト, クリスチャン ,  フックス, カーステン

IPC: E05B85/02 ,  B60J5/00 ,  E05B81/54

CPC classification number: B60R16/03 ,  E05B81/54 ,  E05B85/02 ,  H05K1/0284 ,  H05K3/202 ,  H05K3/222 ,  H05K2201/09118 ,  H05K2201/10363 ,  H05K2203/1316

公开(公告)号：JP6256364B2

公开(公告)日：2018-01-10

申请号：JP2015019385

申请日：2015-02-03

Applicant: 株式会社オートネットワーク技術研究所 ,  住友電装株式会社 ,  住友電気工業株式会社

Inventor： 中村 有延 ,  陳 登

IPC: H05K1/18 ,  H05K1/11 ,  H05K7/06 ,  H02G3/16

CPC classification number: H05K1/183 ,  H05K1/0263 ,  H05K1/05 ,  H05K2201/0311 ,  H05K2201/09072 ,  H05K2201/10166 ,  H05K2201/10272 ,  H05K2201/10363

公开(公告)号：JPWO2016132424A1

公开(公告)日：2017-11-24

申请号：JP2015529727

申请日：2015-02-16

Applicant: 日本メクトロン株式会社

Inventor： 田 文 彦 松 ,  田 文 彦 松

IPC: H05K3/24 ,  H05K3/12 ,  H05K3/40

CPC classification number: H05K3/025 ,  H05K1/115 ,  H05K3/0035 ,  H05K3/027 ,  H05K3/40 ,  H05K3/4053 ,  H05K3/4685 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/05 ,  H05K2201/09509 ,  H05K2201/10363 ,  H05K2203/0264 ,  H05K2203/0568

Abstract: フレキシブルプリント配線板の製造方法として、絶縁基板(2)と、絶縁基板(2)の少なくとも一方の主面に設けられた金属箔(3,4)とを有する金属箔張積層板(1)を用意する工程と、金属箔(3)をパターニングして回路パターン(5)を形成する工程と、回路パターンを埋設するように絶縁基板の上に剥離可能な印刷版層(6)を形成する工程と、印刷版層を部分的に除去して、内部に回路パターンが露出した有底孔(7a,7b)を形成する工程と、印刷版層を印刷マスクとして導電性ペーストを印刷して、有底孔内に導電性ペースト(8)を充填する工程と、印刷版層を金属箔張積層板から剥離する工程とを備える。印刷版層(6)を用いることにより微細な回路パターンに対して導電性ペーストを精度良く印刷することが可能であり、回路パターンの微細化を進めることができる。

公开(公告)号：JP6104189B2

公开(公告)日：2017-03-29

申请号：JP2014015751

申请日：2014-01-30

Applicant: キヤノン株式会社

Inventor： 芹澤 慎介

IPC: G03G15/00 ,  G03G15/16 ,  G03G15/02 ,  G03G15/08 ,  H05K1/11 ,  H01R12/71 ,  H01R13/11 ,  H05K1/02

CPC classification number: H05K1/0296 ,  G03G15/50 ,  G03G15/80 ,  G03G21/1652 ,  H05K1/0269 ,  H05K1/117 ,  H05K3/403 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/09181 ,  H05K2201/10287 ,  H05K2201/10363 ,  H05K3/4015

公开(公告)号：JP5909660B2

公开(公告)日：2016-04-27

申请号：JP2013546502

申请日：2012-06-18

Applicant: パナソニックIPマネジメント株式会社

Inventor： 齋藤 孝夫

IPC: H05K1/02

CPC classification number: H05K1/0263 ,  H05K2201/0305 ,  H05K2201/10363 ,  H05K3/222 ,  H05K3/3447

公开(公告)号：JP5773679B2

公开(公告)日：2015-09-02

申请号：JP2011030883

申请日：2011-02-16

Applicant: 三菱重工業株式会社

Inventor： 和久 浩行

IPC: B32B15/08 ,  B29C70/06 ,  B64C1/00 ,  B64C3/18 ,  B32B5/28

CPC classification number: H05K1/115 ,  B29C70/882 ,  B64C3/18 ,  B64C3/20 ,  B64C3/26 ,  B64D45/02 ,  H05K13/00 ,  B29K2307/04 ,  H05K1/0366 ,  H05K2201/029 ,  H05K2201/0323 ,  H05K2201/10363 ,  H05K3/4602 ,  H05K3/4632 ,  Y02T50/433 ,  Y10T29/49117

公开(公告)号：JPS594873B2

公开(公告)日：1984-02-01

申请号：JP11882878

申请日：1978-09-26

Applicant: Matsushita Electric Ind Co Ltd

Inventor： KONISHIGAWA KAORU ,  SASAKI SHUNSUKE ,  HIROSE FUMINORI ,  HIGUCHI KOICHI

IPC: H05K1/11 ,  H01R12/51 ,  H01R31/08 ,  H05K1/00 ,  H05K1/14 ,  H05K3/22 ,  H05K3/34 ,  H05K3/36

CPC classification number: H05K3/222 ,  H05K1/0289 ,  H05K1/141 ,  H05K3/3442 ,  H05K3/368 ,  H05K2201/09181 ,  H05K2201/10212 ,  H05K2201/10363 ,  H05K2201/10666

公开(公告)号：EP3334263A1

公开(公告)日：2018-06-13

申请号：EP17205871.1

申请日：2017-12-07

Applicant: OSRAM GmbH ,  OSRAM S.P.A. - SOCIETA' RIUNITE OSRAM EDISON CLERICI

Inventor： BOBBO, Simon ,  MICHIELAN, Valerio ,  VOLPATO, Luca

IPC: H05K13/00 ,  H05K1/02 ,  H05B33/08

CPC classification number: H05B33/083 ,  H05B33/0803 ,  H05K1/029 ,  H05K1/11 ,  H05K1/181 ,  H05K3/222 ,  H05K13/00 ,  H05K2201/10106 ,  H05K2201/10363 ,  H05K2203/0228 ,  H05K2203/173 ,  H05K2203/175

Abstract: There is described a printed circuit board for implementing lighting modules. The printed circuit board includes metallic zones including:
- a first (200a), a second (200e) and a third positive terminal (200f),
- a first (200b) and a second (200d) negative terminal, wherein the second negative terminal (200d) is connected to the first negative terminal (200b), and
- electric contacts for the mounting of one or more LEDs (L) and electric traces such that the LEDs (L) are connected in series forming a LED string (22).
Specifically, the printed circuit board comprises selection means (JP1, JP2) implemented with electric traces and metallic contacts adapted to be shortcircuited via links in order to permit all of the following connections:
a) a connection of the LED string (22) between the first positive terminal (200a) and the third positive terminal (200f),
b) a connection of the LED string (22) between the first positive terminal (200a) and the first negative terminal (200b),
c) a connection of the LED string (22) between the second positive terminal (200a) and the third positive terminal (200f), and
d) a connection of the LED string (22) between the second positive terminal (200a) and the first negative terminal (200b).

公开(公告)号：EP2680679B1

公开(公告)日：2018-01-17

申请号：EP13171339.8

申请日：2013-06-11

Applicant: Coriant Oy

Inventor： Holma, Antti ,  Kokko, Peter

IPC: H05K3/22 ,  H05K3/30

CPC classification number: H05K3/303 ,  H05K1/02 ,  H05K3/22 ,  H05K3/222 ,  H05K3/30 ,  H05K3/306 ,  H05K2201/09972 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/10363 ,  H05K2201/1059 ,  H05K2201/2018 ,  H05K2203/162 ,  Y10T29/49004 ,  Y10T29/4913

Abstract: A circuit board system comprising mechanical protection of electrical components is presented. The circuit board system comprises a circuit board (101) furnished with electrical components (103-111) and a protection element (102) attached to areas of the circuit board which are free from the electrical components. The protection element has thickness in the direction perpendicular to the circuit board and it is shaped to leave the electrical components unscreened in the direction perpendicular to the circuit board. Thus, the protection element constitutes barriers protecting the electrical components but still allows the electrical components to be accessed from the direction perpendicular to the circuit board for example in a flying probe testing. The body of the protection element can be made of same material as the electrically insulating body of the circuit board. Thus, the thermal expansion coefficient of the protection element can be substantially the same as that of the circuit board.

公开(公告)号：EP3089563A4

公开(公告)日：2016-11-02

申请号：EP14897429

申请日：2014-12-22

Applicant: MITSUBISHI ELECTRIC CORP

Inventor： AOSHIMA TAKUMA

IPC: H05K1/02

CPC classification number: H02K5/225 ,  F24F11/04 ,  F24F11/74 ,  F24F13/1426 ,  F24F2013/1433 ,  H05K1/02 ,  H05K1/0262 ,  H05K1/0269 ,  H05K1/029 ,  H05K1/181 ,  H05K2201/09936 ,  H05K2201/1009 ,  H05K2201/10189 ,  H05K2201/10363 ,  H05K2201/10522 ,  H05K2203/173

Abstract: A printed wiring board (100) includes a primary circuit (101) that receives power supply of a high voltage from a high power source; a pattern for a low voltage circuit (105) that is used when a low voltage component (102) used for a low voltage lower than the high voltage and a power supply terminal block that receives power supply of the low voltage from a low power source (112) are provided; a pattern for a common circuit (104) that is used when a high voltage component (108) used for the high voltage and the low voltage that insulates the pattern for the primary circuit (101) from the pattern for the common circuit (104); a first insulator (106) which insulates the pattern of the primary circuit (101) from the pattern of the common circuit (104); and a second insulator (107) that insulates the pattern for the common circuit (104) from the pattern for the low voltage circuit (105).