中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

328 records (took 0.02 seconds)

    Self-aligning light directing surface mountable miniature incandescent lamp
    111.
    发明授权
    Self-aligning light directing surface mountable miniature incandescent lamp 失效
    自调光导光表面安装微型白炽灯

    公开(公告)号：US5382874A

    公开(公告)日：1995-01-17

    申请号：US970767

    申请日：1992-11-03

    Applicant: Ralph E. Johnson

    Inventor： Ralph E. Johnson

    IPC: H01K1/46 ,  H01J5/54 ,  H01K1/32 ,  H01K5/02 ,  H01K7/04 ,  H05K3/30 ,  H05K3/34 ,  H01K1/42

    CPC classification number: H05K3/3442 ,  H01J5/54 ,  H01K1/325 ,  H01K1/46 ,  H01K5/02 ,  H01K7/04 ,  H05K2201/10113 ,  H05K2201/10568 ,  H05K2201/10583 ,  H05K2201/10916 ,  H05K3/303 ,  Y02P70/613

    Abstract: A surface mountable miniature incandescent lamp assembly has an elongated substantially cylindrical glass envelope wherein a filament is contained in contact with metal members having glass-to-metal seals with the glass envelope. A substantial portion of the outer surface of the glass envelope is coated with a light reflective metal coating, with a non-coated elongated window transparent to light being left on the surface. The metal members extend axially to the outside from the envelope and, when mounted to a circuit board provide electric contact for the lamp. At least one of the end members includes a unique surface feature, such as a flat portion of an otherwise cylindrical surface, which is directionally coupled relative to the window of the glass envelope and which acts as a key or indexing surface for mounting the lamp assembly to the receiving surface (circuit board) with the window disposed in the desired direction.

    Abstract translation: 可表面安装的小型白炽灯组件具有细长的基本上圆柱形的玻璃外壳，其中灯丝包含与玻璃与金属密封件的金属部件接触。 玻璃外壳的外表面的主要部分涂覆有光反射金属涂层，其中未涂覆的细长窗口对于留在表面上的光而言是透明的。 金属构件从外壳轴向延伸到外部，并且当安装到电路板时为灯提供电接触。 至少一个端部构件包括独特的表面特征，例如其它圆柱形表面的平坦部分，其相对于玻璃外壳的窗口定向耦合，并且用作安装灯组件的键或分度表面 到达接收表面（电路板），窗口设置在所需方向。

    Surge absorber
    112.
    发明授权
    Surge absorber 失效
    浪涌吸收器

    公开(公告)号：US5311164A

    公开(公告)日：1994-05-10

    申请号：US959033

    申请日：1992-10-08

    Applicant: Fujio Ikeda ,  Kazuyuki Arai

    Inventor： Fujio Ikeda ,  Kazuyuki Arai

    IPC: H02H5/04 ,  H01H37/76 ,  H01T1/14 ,  H01T4/12 ,  H02H9/04 ,  H02H9/06 ,  H05K1/02 ,  H05K3/34 ,  H01H83/00

    CPC classification number: H02H9/042 ,  H05K1/0201 ,  H05K1/0257 ,  H01H2037/763 ,  H01H37/761 ,  H05K1/0259 ,  H05K1/026 ,  H05K2201/10181 ,  H05K2201/10583 ,  H05K2203/176 ,  H05K3/3442

    Abstract: A MELF (Metal Electrode Face Bonding Device) surge absorbing element which can be connected across a pair of input lines of an electronic device. The surge absorbing element is secured in electrical contact with the input lines by a conductive heat releasable adhering means, e.g., a solder. A spring is positioned in biased relationship against the surge absorbing element. When the surge absorbing element is subjected to overvoltages or overcurrents continuously across the input lines, the surge absorbing element heats up, which, in turn, heats the adhering means. When the temperature reaches a predetermined value, the adhering means releases its securement of the surge absorbing element, e.g., the solder melts, and no longer holds the element. When this occurs, the bias of the spring means positioned against the now unsecured surge absorbing element serves to move the element away from and out of electrical contact with the adhering means and, in turn, the input lines. This prevents further heating of the surge absorbing element.

    Abstract translation: 一种可以连接在电子设备的一对输入线上的MELF（金属电极面接合装置）浪涌吸收元件。 浪涌吸收元件通过导电的可热释放的粘合装置（例如焊料）固定成与输入线电接触。 弹簧被定位成与浪涌吸收元件偏置的关系。 当浪涌吸收元件在输入线上连续地经受过电压或过电流时，浪涌吸收元件加热，这进而加热粘附装置。 当温度达到预定值时，粘附装置释放其浪涌吸收元件的固定，例如焊料熔化，并且不再保持元件。 当这种情况发生时，弹簧装置的偏置抵靠当前不安全的浪涌吸收元件的位置用于使元件远离和脱离与粘附装置的电接触，并且反过来使输入线移动。 这防止喘振吸收元件的进一步加热。

    Chip type electronic part
    113.
    发明授权
    Chip type electronic part 失效
    片式电子部件

    公开(公告)号：US4990817A

    公开(公告)日：1991-02-05

    申请号：US880317

    申请日：1986-06-30

    Applicant: Mitsuro Hamuro

    Inventor： Mitsuro Hamuro

    IPC: H03H9/02 ,  H01C1/02 ,  H01G2/02 ,  H01G4/28 ,  H01L41/053 ,  H03H9/10 ,  H05K3/30 ,  H05K3/34

    CPC classification number: H03H9/1021 ,  H05K3/303 ,  H05K2201/10568 ,  H05K2201/10583 ,  H05K2201/2036 ,  H05K3/305 ,  H05K3/3431 ,  Y02P70/613

    Abstract: A chip type electronic part which comprises a chip main body of a cylindrical external shape having a circular cross section, and cap terminals also of a circular cross section applied onto opposite ends of the chip main body. The chip main body is covered, on its side peripheral face not applied with the cap terminals, by an outer covering member having a rectangular cross section, with an interval between a side face of the outer covering member and a corresponding side face of each of the cap terminals being set within a range of +0.2 mm to -0.2 mm.

    Abstract translation: 一种芯片型电子部件，包括具有圆形横截面的圆柱形外形的芯片主体和也被施加到芯片主体的相对端的圆形横截面的盖子端子。 芯片主体在其侧面未被盖端子覆盖的外侧覆盖部件具有矩形横截面，外侧部件的侧面与相应的侧面 盖端子设置在+ 0.2mm至-0.2mm的范围内。

Patent Agency Ranking