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121.发明公开公开(公告)号：US20230213389A1
公开(公告)日：2023-07-06
申请号：US17996125
申请日：2021-04-14
Inventor： Geoffroy DUMONT , Jean-Jacques YON
CPC classification number: G01J5/045 , G01J5/10 , G01J5/046 , G01J5/0225 , B81B7/0051 , B81C1/00325 , G01J2005/106 , B81B2201/0278 , B81B2203/0127 , B81C2201/0109 , B81C2201/0133
Abstract: The invention relates to a method for fabricating a detection device, comprising the following steps: producing thermal detectors and an encapsulating structure by way of mineral sacrificial layers; partially removing the mineral sacrificial layers, by wet chemical etching in an acid medium, so as to free the thermal detectors and to obtain a peripheral wall, and to free an upper portion of the encapsulating thin layer; the peripheral wall then having a lateral recess resulting in a vertical enlargement of the cavity, between the readout substrate and the upper portion, this lateral recess defining an intermediate area; producing reinforcing pillars, arranged in the intermediate area around the matrix-array of thermal detectors.
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公开(公告)号：US11686637B2
公开(公告)日：2023-06-27
申请号：US17583392
申请日：2022-01-25
Applicant: XI'AN JIAOTONG UNIVERSITY
Inventor： Xudong Fang , Ziyan Fang , Chen Wu , Hao Sun , Libo Zhao , Bian Tian , Zhuangde Jiang , Wubin Deng , Bonan Gao , Junxia Wu , Songli Wang , Nan Zhu
CPC classification number: G01L9/005 , B81B7/02 , G01L9/0054 , B81B2201/0264 , B81B2201/0278
Abstract: A silicon carbide-based micro-electro-mechanical system (MEMS) combined temperature-pressure sensor chip and a preparation thereof. The chip includes a peripheric pressure-measuring unit and a center temperature-measuring unit. The pressure-measuring unit includes a silicon carbide substrate with a raised island and a pressure sensitive diaphragm formed by etching the back of the substrate. The raised island and the pressure-sensitive diaphragm constitute a membrane-island structure. Four piezoresistive strips are arranged symmetrically along a circumferential direction of a root of the pressure-sensitive diaphragm and between the raised island and the pressure-sensitive diaphragm. The temperature-measuring unit includes the raised island and a thin-film thermocouple arranged thereon.
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公开(公告)号：US20190194013A1
公开(公告)日：2019-06-27
申请号：US16312324
申请日：2017-06-09
Applicant: Knowles Electronics, LLC
Inventor： Venkataraman Chandrasekaran , John Szczech , Josh Watson , Claus Furst
CPC classification number: B81B7/0061 , B81B2201/0214 , B81B2201/0257 , B81B2201/0278 , B81B2207/012 , H04R1/04 , H04R19/04 , H04R2201/003
Abstract: Systems and apparatuses for a microelectromechanical system (MEMS) device. The MEMS device includes a housing, a transducer, and a sensor. The housing includes a substrate defining a port and a cover. The substrate and the cover cooperatively form an internal cavity. The port fluidly couples the internal cavity to an external environment. The transducer is disposed within the internal cavity and positioned to receive acoustic energy through the port. The transducer is configured to convert the acoustic energy into an electrical signal. The sensor is disposed within the internal cavity and positioned to receive a gas through the port. The sensor is configured to facilitate detecting at least one of an offensive odor, smoke, a volatile organic compound, carbon monoxide, carbon dioxide, a nitrogen oxide, methane, and ozone.
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公开(公告)号：US10005660B1
公开(公告)日：2018-06-26
申请号：US15433793
申请日：2017-02-15
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Kay Stefan Essig
CPC classification number: B81C1/00238 , B81B2201/0235 , B81B2201/0242 , B81B2201/0257 , B81B2201/0264 , B81B2201/0278 , B81C2203/0792
Abstract: The present disclosure relates to a semiconductor package device. The semiconductor package device includes a carrier, a first Micro Electro Mechanical Systems (MEMS) and a first electronic component. The carrier has a first surface and a second surface opposite the first surface. The MEMS is disposed in the carrier. The first MEMS is exposed from the first surface of the carrier and is exposed from the second surface of the carrier. The first electronic component is disposed on the first surface of the carrier and is electrically connected to the first MEMS.
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公开(公告)号：US09975760B2
公开(公告)日：2018-05-22
申请号：US15195061
申请日：2016-06-28
Applicant: Robert Bosch GmbH
Inventor： Mikko VA Suvanto
CPC classification number: B81B7/008 , B81B2201/0207 , B81B2201/0214 , B81B2201/0235 , B81B2201/0242 , B81B2201/0257 , B81B2201/0264 , B81B2201/0278 , B81B2201/0292 , B81B2207/012 , B81C1/0023 , H01L2224/48137 , H04R1/326 , H04R2201/003
Abstract: A microelectromechanical system (MEMS) sensor device includes a package housing having a top member, bottom member, and a spacer coupled the top member to the bottom member, defining a cavity. At least one sensor circuit and a MEMS sensor disposed within the cavity of the package housing. A first opening formed on the package housing a control device embedded within the package housing is electrically coupled to the sensor circuit and is controlled to tune the MEMS sensor from a directional mode to an omni-directional mode.
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Patent Agency Ranking
公开(公告)号：US09967679B2
公开(公告)日：2018-05-08
申请号：US14613106
申请日：2015-02-03
Applicant: Infineon Technologies AG
Inventor： Ulrich Krumbein , Alfons Dehe
CPC classification number: H04R23/00 , B81B7/02 , B81B2201/0257 , B81B2201/0278 , B81B2207/015 , H04R17/02 , H04R19/005 , H04R19/013 , H04R19/016 , H04R19/02 , H04R19/04 , H04R31/00 , H04R2201/003
Abstract: According to embodiment, a transducer includes a microfabricated element integrated on a single die and an interface IC coupled to the microfabricated element. The microfabricated element includes an acoustic transducer and a temperature sensor, and the interface IC is electrically coupled to the acoustic transducer and the temperature sensor.
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127.发明授权公开(公告)号：US09890038B2
公开(公告)日：2018-02-13
申请号：US15049339
申请日：2016-02-22
Applicant: Versana Micro Inc
Inventor： Bishnu Prasanna Gogoi
CPC classification number: B81B7/02 , B81B2201/0207 , B81B2201/0214 , B81B2201/0228 , B81B2201/0257 , B81B2201/0264 , B81B2201/0278 , B81B2207/012 , B81B2207/05 , B81B2207/09 , H01L27/14 , H01L27/16 , H01L27/22 , H01L41/1132 , H01L41/1138 , H01L2924/00 , H05K7/02
Abstract: A monolithically integrated multi-sensor (MIMS) is disclosed. A MIMs integrated circuit comprises a plurality of sensors. For example, the integrated circuit can comprise three or more sensors where each sensor measures a different parameter. The three or more sensors can share one or more layers to form each sensor structure. In one embodiment, the three or more sensors can comprise MEMs sensor structures. Examples of the sensors that can be formed on a MIMs integrated circuit are an inertial sensor, a pressure sensor, a tactile sensor, a humidity sensor, a temperature sensor, a microphone, a force sensor, a load sensor, a magnetic sensor, a flow sensor, a light sensor, an electric field sensor, an electrical impedance sensor, a galvanic skin response sensor, a chemical sensor, a gas sensor, a liquid sensor, a solids sensor, and a biological sensor.
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公开(公告)号：US20170369305A1
公开(公告)日：2017-12-28
申请号：US15195061
申请日：2016-06-28
Applicant: Robert Bosch GmbH
Inventor： Mikko VA Suvanto
CPC classification number: B81B7/008 , B81B2201/0207 , B81B2201/0214 , B81B2201/0235 , B81B2201/0242 , B81B2201/0257 , B81B2201/0264 , B81B2201/0278 , B81B2201/0292 , B81B2207/012 , B81C1/0023 , H01L2224/48137 , H04R1/326 , H04R2201/003
Abstract: A microelectromechanical system (MEMS) sensor device includes a package housing having a top member, bottom member, and a spacer coupled the top member to the bottom member, defining a cavity. At least one sensor circuit and a MEMS sensor disposed within the cavity of the package housing. A first opening formed on the package housing a control device embedded within the package housing is electrically coupled to the sensor circuit and is controlled to tune the MEMS sensor from a directional mode to an omni-directional mode.
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公开(公告)号：US20170299622A1
公开(公告)日：2017-10-19
申请号：US15482173
申请日：2017-04-07
Applicant: Robert Bosch GmbH
Inventor： Florian Schoen , Christian Lemier , Torsten Kramer
CPC classification number: G01P5/12 , B81B3/0081 , B81B2201/0278 , B81B2203/0127 , G01F1/684 , G01F1/692 , G01F1/86
Abstract: A sensor element for thermal anemometry includes a semiconductor substrate and a thin-film diaphragm attached to the semiconductor substrate and having a front side and a rear side. A resistive heating element and a temperature-dependent resistor are attached to the front side of the thin-film diaphragm. In the area of the rear side of the thin-film diaphragm, the semiconductor substrate has a first recess. A silicon layer including a recess which merges with the first recess of the semiconductor substrate is located between the thin-film diaphragm and the semiconductor substrate.
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公开(公告)号：US20170203959A1
公开(公告)日：2017-07-20
申请号：US15474613
申请日：2017-03-30
Applicant: WIN Semiconductors Corp.
Inventor： PEI-CHUN LIAO , PO-WEI TING , CHIH-FENG CHIANG , YU-KAI WU , YU-FAN CHANG , RE-CHING LIN , SHU-HSIAO TSAI , CHENG-KUO LIN
CPC classification number: H03H9/25 , B81B7/0077 , B81B2201/0242 , B81B2201/0271 , B81B2201/0278 , B81B2203/0315 , G01C19/5783 , H01L23/562 , H01L24/29 , H01L25/162 , H01L25/165 , H01L2224/29144 , H01L2224/29147 , H01L2225/06541
Abstract: A chip stack having a protection structure for semiconductor device package comprises a first chip and a second chip stacked with each other. A first surface of the first chip and a second surface of the second chip are facing to each other. At least one metal pillar is formed on at least one of the first surface and the second surface and connected with the other. At least one protection ring is formed on at least one of the first surface and the second surface and having a first gap with the other. At least one electrical device is formed on at least one of the first surface and the second surface and is located inside at least one of the at least one protection ring, wherein the at least one electrical device includes a temperature sensor.
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