公开(公告)号：US20150162312A1

公开(公告)日：2015-06-11

申请号：US14532032

申请日：2014-11-04

Applicant: FUJITSU LIMITED

Inventor： Kozo Shimizu ,  Seiki Sakuyama

IPC: H01L25/065 ,  B23K3/08 ,  H01L25/00 ,  B23K1/00 ,  H01L23/367 ,  H01L23/00

CPC classification number: H01L24/17 ,  B23K1/0008 ,  B23K1/0016 ,  B23K3/085 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/264 ,  B23K2101/40 ,  B23K2101/42 ,  H01L23/145 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3675 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05082 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/13016 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/1601 ,  H01L2224/16145 ,  H01L2224/16157 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/16505 ,  H01L2224/16507 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/75253 ,  H01L2224/75501 ,  H01L2224/75502 ,  H01L2224/759 ,  H01L2224/81005 ,  H01L2224/81075 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81411 ,  H01L2224/81815 ,  H01L2224/81948 ,  H01L2224/81986 ,  H01L2225/06513 ,  H01L2924/014 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/10335 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/1579 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/16747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3512 ,  H01L2924/35121 ,  H05K1/0203 ,  H05K1/09 ,  H05K1/113 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0248 ,  H05K2201/09972 ,  H05K2201/1056 ,  H05K2203/1121 ,  H05K2203/304 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/00

Abstract: An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

Abstract translation: 电子设备包括具有第一端子的第一电子部件，与第一端子相对的第二端子的第二电子部件和与第一端子和第二端子连接的接合部。 接合部分包含在第一端子和第二端子彼此相对的方向上延伸的极性化合物。 接合部分包含杆状化合物，从而提高接合部分的强度。 当第一端子和第二端子接合时，第一电子部件和第二电子部件之一的温度被制成高于另一端子的温度。 在该状态下将接合材料冷却并固化。 通过这样做，形成极点状化合物。

公开(公告)号：US20130199034A1

公开(公告)日：2013-08-08

申请号：US13366316

申请日：2012-02-04

Applicant: Mehdi M. Yazdanpanah ,  Romaneh Jalilian

Inventor： Mehdi M. Yazdanpanah ,  Romaneh Jalilian

IPC: B23D81/00 ,  H05K3/10

CPC classification number: H05K3/222 ,  G01N35/10 ,  H01J2237/208 ,  H01J2237/31732 ,  H01J2237/31745 ,  H01J2237/31749 ,  H01L21/76892 ,  H05K2201/0248 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49718 ,  Y10T29/49721 ,  Y10T29/49726 ,  Y10T29/4973

Abstract: Embodiments of the present invention provide method and apparatus of restoring probes attached to the manipulator in a control environment (e.g. vacuum chamber of an focus ion beam) without a need to open the vacuum chamber. Another embodiment of the present invention teaches construction and application of various shapes of nanoforks from a nanoneedles array inside a FIB vacuum chamber. In another embodiment, the present invention teaches edition and correction of completed and oxide-coated circuit boards by re-nano-wiring using nanoneedles of a nanoneedles array (as nanowire supply), contained in the same controlled space. In this embodiment, individual nanoneedles in a nanoneedle array are manipulated by a manipulator and placed in such a way to make electrical contact between the desired points.

Abstract translation: 本发明的实施例提供了在控制环境（例如聚焦离子束的真空室）中恢复附接到操纵器的探针的方法和装置，而不需要打开真空室。 本发明的另一个实施方案教导了在FIB真空室内的纳米针阵列中构造和应用各种形状的纳摩耳。 在另一个实施例中，本发明通过使用包含在相同受控空间中的纳米针阵列（作为纳米线供应）的纳米针通过再纳米布线来教导完成的和氧化物涂覆的电路板的编辑和校正。 在该实施例中，纳米针阵列中的单个纳米针由操纵器操纵并且以这样的方式放置以在期望的点之间进行电接触。

公开(公告)号：US20130168841A1

公开(公告)日：2013-07-04

申请号：US13340430

申请日：2011-12-29

Applicant: Sam Ziqun Zhao ,  Kevin Kunzhong Hu ,  Sampath K.V. Karikalan ,  Rezaur Rahman Khan ,  Pieter Vorenkamp ,  Xiangdong Chen

Inventor： Sam Ziqun Zhao ,  Kevin Kunzhong Hu ,  Sampath K.V. Karikalan ,  Rezaur Rahman Khan ,  Pieter Vorenkamp ,  Xiangdong Chen

IPC: H01L23/495 ,  H01L21/326 ,  H05K1/11 ,  B82Y99/00

CPC classification number: H01L23/49827 ,  B82Y10/00 ,  H01L21/485 ,  H01L21/486 ,  H01L23/49822 ,  H01L2224/16225 ,  H05K1/029 ,  H05K3/4038 ,  H05K2201/0248 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/10378 ,  H05K2203/104 ,  H05K2203/105

Abstract: An exemplary implementation of the present disclosure includes a programmable interposer having top and bottom interface electrodes and conductive particles interspersed within the programmable interposer. The conductive particles are capable of forming an aligned configuration between the top and bottom interface electrodes in response to application of an energy field to the programmable interposer so as to electrically connect the top and bottom interface electrodes. The conductive particles can have a conductive outer surface. Also, the conductive particles can be spherical. The conductive particles can be within a bulk material in an interface layer in the programmable interposer, and the bulk material can be cured to secure programmed paths between the top and bottom interface electrodes.

Abstract translation: 本公开的示例性实现包括具有顶部和底部接口电极和散布在可编程插值器内的导电粒子的可编程插值器。 响应于将能量场施加到可编程内插器，导电颗粒能够在顶部和底部界面电极之间形成对准的构造，以便电连接顶部和底部界面电极。 导电颗粒可具有导电外表面。 此外，导电粒子可以是球形的。 导电颗粒可以在可编程插入器中的界面层中的体积材料内，并且可以固化块状材料以确保顶部和底部界面电极之间的编程路径。

公开(公告)号：US20120281362A1

公开(公告)日：2012-11-08

申请号：US13522218

申请日：2011-01-13

Applicant: Yuusaku Ishimine ,  Masayuki Moriyama ,  Kenji Komatsubara

Inventor： Yuusaku Ishimine ,  Masayuki Moriyama ,  Kenji Komatsubara

IPC: H01L23/15 ,  H05K7/20 ,  B32B33/00 ,  H05K1/00

CPC classification number: H01L23/13 ,  C04B35/587 ,  C04B37/026 ,  C04B2235/3206 ,  C04B2235/3217 ,  C04B2235/3224 ,  C04B2235/3878 ,  C04B2235/3882 ,  C04B2235/5276 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/604 ,  C04B2235/6581 ,  C04B2235/6582 ,  C04B2235/6587 ,  C04B2235/721 ,  C04B2235/723 ,  C04B2235/77 ,  C04B2235/786 ,  C04B2235/80 ,  C04B2235/945 ,  C04B2235/9607 ,  C04B2237/125 ,  C04B2237/368 ,  C04B2237/407 ,  C04B2237/74 ,  H01L23/15 ,  H01L23/3731 ,  H01L23/3735 ,  H01L35/32 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/38 ,  H05K2201/0248 ,  H05K2201/0266 ,  H05K2201/0269 ,  Y10T428/24413 ,  Y10T428/24421 ,  Y10T428/25 ,  Y10T428/259 ,  H01L2924/00

Abstract: A silicon nitride substrate comprises a substrate comprising a silicon nitride sintered body, and a plurality of granular bodies containing silicon and integrated to a principal surface of the substrate, wherein a plurality of needle crystals or column crystals comprising mainly silicon nitride are extended from a portion of the granular bodies. A brazing material is applied to a principal surface of the substrate, and a circuit member and a heat radiation member are arranged on the applied brazing material, and bonded by heating. Because of a plurality of granular bodies integrated to the principal surface of the substrate, and a plurality of the needle crystals or the column crystals extended from a portion of the granular bodies, a high anchor effect is produced so that the circuit member and the heat radiation member are firmly bonded to the silicon nitride substrate.

Abstract translation: 氮化硅衬底包括含有氮化硅烧结体的衬底和多个含有硅的颗粒体并且与衬底的主表面集成在一起，其中主要包含氮化硅的多个针状晶体或柱状晶体从一部分 的颗粒体。 将钎焊材料施加到基板的主表面，并且将电路构件和散热构件布置在所施加的钎焊材料上，并通过加热粘合。 由于集成到基板的主面的多个粒状体以及从一部分粒状体延伸的多个针状晶体或柱状晶体，产生高的锚定效应，使得电路部件和热量 辐射构件牢固地结合到氮化硅衬底上。

公开(公告)号：US08252385B2

公开(公告)日：2012-08-28

申请号：US11388669

申请日：2006-03-23

Applicant: Steven Dale Ittel ,  Jennifer Leigh White

Inventor： Steven Dale Ittel ,  Jennifer Leigh White

IPC: B05D1/06

CPC classification number: B05D1/06 ,  B82Y10/00 ,  H01B1/22 ,  H05K1/092 ,  H05K1/097 ,  H05K3/1241 ,  H05K2201/0248 ,  H05K2201/026 ,  H05K2203/0126 ,  Y10T428/249924 ,  Y10T428/29

Abstract: Processes for printing conductors, insulators, dielectrics, phosphors, emitters, and other elements containing elongated functional particles aligned along the axis of a spun fiber or film that can be for electronics and display applications are provided. Also provided are viscoelastic compositions used in the processes, and devices made therefrom.

Abstract translation: 提供了用于印刷导体，绝缘体，电介质，磷光体，发射体和其它包含可以用于电子和显示应用的纺丝纤维或薄膜轴线对准的细长功能颗粒的元件。 还提供了用于该方法的粘弹性组合物和由其制备的装置。

公开(公告)号：US20120067619A1

公开(公告)日：2012-03-22

申请号：US13375670

申请日：2010-05-18

Applicant: Masamichi Yamamoto ,  Kyouichirou Nakatsugi ,  Takashi Yamaguchi ,  Shigeki Kawakami ,  Michihiro Kimura

Inventor： Masamichi Yamamoto ,  Kyouichirou Nakatsugi ,  Takashi Yamaguchi ,  Shigeki Kawakami ,  Michihiro Kimura

IPC: H01B5/00 ,  B23K1/20 ,  B32B37/14 ,  B32B37/12 ,  B23K31/02

CPC classification number: H05K3/361 ,  C23F11/149 ,  H01L2924/0002 ,  H05K3/282 ,  H05K3/305 ,  H05K3/323 ,  H05K3/3431 ,  H05K3/4007 ,  H05K2201/0248 ,  H05K2201/0373 ,  H05K2201/094 ,  H05K2201/10977 ,  H05K2201/10992 ,  H05K2203/308 ,  Y10T156/10 ,  H01L2924/00

Abstract: [Object] Provided are a connection method and an electronic device, in which the manufacturing process can be simplified, and a connection structure using an adhesive can be produced at low cost.[Solution] A connection method according to the present invention includes a step (a1) of preparing base materials 10 and 21 each including an electrode for connection using an adhesive, a step (b1) of covering electrodes 12 and 22 for connection using an adhesive with organic films 15 configured to prevent oxidation, the electrodes 12 and 22 being located on the base materials, a step (c1) of removing or thinning the organic films, and after the step (c1), a step (d1) of bonding the electrodes for connection using an adhesive to each other with an adhesive 30 mainly containing a thermosetting resin to establish electrical connection.

Abstract translation: 提供了一种连接方法和电子设备，其中可以简化制造过程，并且可以以低成本生产使用粘合剂的连接结构。 [解决方案]根据本发明的连接方法包括制备基材10和21的步骤（a1），每个基材10和21各自包括使用粘合剂连接的电极，用于使用粘合剂连接的覆盖电极12和22的步骤（b1） 配置有防止氧化的有机膜15，电极12和22位于基材上，除去或变薄有机膜的步骤（c1），在步骤（c1）之后，将 用于使用主要包含热固性树脂的粘合剂30使用粘合剂彼此连接以建立电连接的电极。

公开(公告)号：US08018568B2

公开(公告)日：2011-09-13

申请号：US12712096

申请日：2010-02-24

Applicant: Pierre-Marc Allemand ,  Haixia Dai ,  Shuo Na ,  Hash Pakbaz ,  Florian Pschenitzka ,  Xina Quan ,  Jelena Sepa ,  Michael A. Spaid ,  Jeffrey Wolk

Inventor： Pierre-Marc Allemand ,  Haixia Dai ,  Shuo Na ,  Hash Pakbaz ,  Florian Pschenitzka ,  Xina Quan ,  Jelena Sepa ,  Michael A. Spaid ,  Jeffrey Wolk

IPC: G02F1/13

CPC classification number: H01L31/022466 ,  B82Y10/00 ,  G02F1/13439 ,  H01B1/22 ,  H01L31/1884 ,  H01L51/0021 ,  H01L51/102 ,  H01L51/5206 ,  H01L51/5253 ,  H01L2251/5369 ,  H05K1/095 ,  H05K3/06 ,  H05K9/009 ,  H05K9/0092 ,  H05K2201/0108 ,  H05K2201/0248 ,  H05K2201/026 ,  Y02E10/50

Abstract: A transparent conductor including a conductive layer coated on a substrate is described. More specifically, the conductive layer comprises a network of nanowires that may be embedded in a matrix. The conductive layer is optically clear, patternable and is suitable as a transparent electrode in visual display devices such as touch screens, liquid crystal displays, plasma display panels and the like.

Abstract translation: 描述了包括涂覆在基板上的导电层的透明导体。 更具体地，导电层包括可嵌入矩阵中的纳米线网络。 导电层是透明的，可图案化的，并且适合作为诸如触摸屏，液晶显示器，等离子显示面板等的视觉显示装置中的透明电极。

公开(公告)号：US07875807B2

公开(公告)日：2011-01-25

申请号：US11673904

申请日：2007-02-12

Applicant: Takeshi Sano ,  Hirofumi Kobayashi ,  Hideaki Ohkura

Inventor： Takeshi Sano ,  Hirofumi Kobayashi ,  Hideaki Ohkura

IPC: H05K1/02

CPC classification number: H05K3/325 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/13386 ,  H01L2224/13439 ,  H01L2224/13444 ,  H01L2224/13447 ,  H01L2224/13455 ,  H01L2924/0001 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/4007 ,  H05K2201/0248 ,  H05K2201/0314 ,  H05K2201/0367 ,  H01L2924/00014 ,  H01L2924/0542 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05147

Abstract: An electronic device includes an electronic part including at least one first electrode, a substrate including at least one second electrode, and at least one bump formed on the at least one first electrode and formed from an elastic conductive resin including a resin having rubbery elasticity, and an acicular conductive filler including a surface layer coated with one of gold, silver, nickel, and copper. The at least one first electrode and the at least one second electrode are electrically connected to each other by mechanically contacting the at least one bump with the at least one second electrode.

Abstract translation: 电子设备包括电子部件，其包括至少一个第一电极，包括至少一个第二电极的基板和形成在所述至少一个第一电极上的至少一个凸块，并由包括具有橡胶弹性的树脂的弹性导电树脂形成， 以及包括涂覆有金，银，镍和铜之一的表面层的针状导电填料。 所述至少一个第一电极和所述至少一个第二电极通过使所述至少一个凸块与所述至少一个第二电极机械接触而彼此电连接。

公开(公告)号：US07851059B2

公开(公告)日：2010-12-14

申请号：US11529453

申请日：2006-09-28

Applicant: Gary Stevens ,  James D. B. Smith ,  John W. Wood

Inventor： Gary Stevens ,  James D. B. Smith ,  John W. Wood

IPC: B32B5/16 ,  B32B27/38 ,  B32B29/00

CPC classification number: H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0224 ,  H05K2201/0248 ,  Y10T428/25 ,  Y10T428/251 ,  Y10T428/254 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/258 ,  Y10T428/259 ,  Y10T428/31511 ,  Y10T428/31993

Abstract: A high thermal conductivity resin that is made up of a host resin matrix (42) and high thermal conductivity fillers (30) that are mixed within the host resin to form a resin mixture. The fillers comprise at least 3-5% by weight of the resin mixture, and the fillers are from an average of 1-100 nm in at least one dimension, and where the particles are smaller than an average of 1000 nm in the particles' longest dimension. The host resin matrix forms an ordered resin shell (40) around the high thermal conductivity fillers (30), whereby resin molecules are aligned perpendicular to the surface of the high thermal conductivity fillers. An overlap of the ordered resin shells (44) is formed between the high thermal conductivity fillers such that continuous pathways for ordered resin shells are created through the resin mixture.

公开(公告)号：US20100239851A1

公开(公告)日：2010-09-23

申请号：US11529453

申请日：2006-09-28

Applicant: Gary Stevens ,  James D.B. Smith ,  John W. Wood

Inventor： Gary Stevens ,  James D.B. Smith ,  John W. Wood

IPC: B32B5/16 ,  B32B29/06 ,  C08L63/00

CPC classification number: H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0224 ,  H05K2201/0248 ,  Y10T428/25 ,  Y10T428/251 ,  Y10T428/254 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/258 ,  Y10T428/259 ,  Y10T428/31511 ,  Y10T428/31993

Abstract: A high thermal conductivity resin that is made up of a host resin matrix (42) and high thermal conductivity fillers (30) that are mixed within the host resin to form a resin mixture. The fillers comprise at least 3-5% by weight of the resin mixture, and the fillers are from an average of 1-100 nm in at least one dimension, and where the particles are smaller than an average of 1000 nm in the particles' longest dimension. The host resin matrix forms an ordered resin shell (40) around the high thermal conductivity fillers (30), whereby resin molecules are aligned perpendicular to the surface of the high thermal conductivity fillers. An overlap of the ordered resin shells (44) is formed between the high thermal conductivity fillers such that continuous pathways for ordered resin shells are created through the resin mixture.

Abstract translation: 由主体树脂基体（42）和高导热性填料（30）构成的高导热性树脂，其混合在主体树脂内以形成树脂混合物。 填料包含至少3-5重量％的树脂混合物，并且填料在至少一个维度上平均为1-100nm，并且其中颗粒小于平均粒径为1000nm的颗粒' 最长尺寸。 主体树脂基体在高导热性填料（30）周围形成有序的树脂壳（40），由此树脂分子垂直于高热导率填料的表面排列。 在高导热性填料之间形成有序树脂壳（44）的重叠，使得通过树脂混合物产生有序树脂壳的连续路径。