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    Method for fabricating embedded thin film resistors
    123.
    发明公开
    Method for fabricating embedded thin film resistors 有权
    一种用于制造嵌入薄膜电阻器的方法

    公开(公告)号：EP1592289A1

    公开(公告)日：2005-11-02

    申请号：EP05009384.8

    申请日：2005-04-28

    Applicant: Brain Power Co.

    Inventor： Su, Sung-Ling ,  Xu, Zhiqiang

    IPC: H05K1/16 ,  H05K3/18

    CPC classification number: H05K1/167 ,  H05K3/061 ,  H05K3/181 ,  H05K3/184 ,  H05K2201/0391 ,  H05K2203/0361 ,  H05K2203/1453

    Abstract: A method for fabricating the embedded thin film resistors of a printed circuit board is provided. The embedded thin film resistors are formed using a resistor layer built in the printed circuit board. Compared with conventional discrete resistors, embedded thin film resistors contribute to a smaller printed circuit board as the space for installing conventional resistors is saved, and better signal transmission speed and quality as the capacitive reactance effect caused by two connectors of the conventional resistors is avoided. The method for fabricating the embedded thin film resistors provided by the invention can be conducted using the process and equipment for conventional printed circuit boards and thereby saving the investment on new types of equipment. The method can be applied in the mass production of printed circuit boards and thereby reduce the manufacturing cost significantly.

    Resistors
    124.
    发明公开
    Resistors 审中-公开
    电阻器

    公开(公告)号：EP1263002A2

    公开(公告)日：2002-12-04

    申请号：EP02253404.4

    申请日：2002-05-15

    Applicant: Shipley Company LLC

    Inventor： Schemenaur, John ,  Senk, David D.

    IPC: H01C7/18 ,  H05K1/16

    CPC classification number: H01C17/08 ,  H01C7/006 ,  H01C7/18 ,  H05K1/167 ,  H05K2201/0373 ,  H05K2201/0391

    Abstract: Resistive materials having resistivities that are axis dependent are provided. Such resistive materials having a resistivity in a first direction and a very different resistivity in an orthogonal direction. These resistive materials are particularly suitable for use as resistors embedded in printed wiring boards.

    Abstract translation: 提供具有轴依赖性的电阻率的电阻材料。 这种电阻材料具有第一方向上的电阻率和正交方向上非常不同的电阻率。 这些电阻材料特别适合用作嵌入印刷线路板中的电阻器。

    Composite circuit board and manufacturing method of the same
    128.
    发明公开
    Composite circuit board and manufacturing method of the same 失效
    Zusammengestellte Schaltungsplatte und Herstellungsverfahrendafür。

    公开(公告)号：EP0430157A2

    公开(公告)日：1991-06-05

    申请号：EP90122636.5

    申请日：1990-11-27

    Applicant: THE FURUKAWA ELECTRIC CO., LTD.

    Inventor： Yamamoto, Masaaki ,  Yatabe, Hiroshi ,  Kobayashi, Kenzo ,  Mochizuki, Hajime

    IPC: H01L23/538 ,  H01L21/48 ,  H05K1/00 ,  H05K3/46

    CPC classification number: H05K1/0265 ,  H01L21/4857 ,  H01L23/5383 ,  H01L2924/0002 ,  H05K1/0298 ,  H05K3/202 ,  H05K3/429 ,  H05K3/4652 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0391 ,  Y10T29/49155 ,  H01L2924/00

    Abstract: The composite circuit board comprises a substrate (13) made of an insulating material, a thick circuit conductor (11), embedded in this substrate (13), which includes a parts-mounting section (11a) and has a predetermined circuit pattern, a thin circuit conductor (12), provided on the surface of said substrate (13), which includes a land (12a) corresponding to the parts-mounting section (11a) of said thick circuit conductor (11) and has a predetermined circuit pattern, and a conductor means (14, 14a) for electrically connecting said land and said parts-mounting section. In this circuit board, the land (12a) and the part-mounting section (11a) are connected by a conducting member provided in this through hole (14).

    Abstract translation: 复合电路板包括由绝缘材料制成的衬底（13），嵌入该衬底（13）中的厚电路导体（11），其包括部件安装部分（11a）并具有预定的电路图案， 设置在所述基板（13）的表面上的薄电路导体（12），其包括对应于所述厚电路导体（11）的部件安装部分（11a）的平台（12a）并且具有预定的电路图案， 以及用于电连接所述焊盘和所述部件安装部分的导体装置（14,14a）。 在该电路基板中，通过设置在该贯通孔（14）中的导电部件连接接合部（12a）和部件安装部（11a）。

    Post-termination process for thick-film resistors of printed-circuit boards
    129.
    发明公开
    Post-termination process for thick-film resistors of printed-circuit boards 失效
    Post-BeendungsverfahrenfürDickschichtwiderständevon Leiterplatten。

    公开(公告)号：EP0364095A2

    公开(公告)日：1990-04-18

    申请号：EP89308931.8

    申请日：1989-09-04

    Applicant: DELCO ELECTRONICS CORPORATION (a Delaware corp.)

    Inventor： Palanisamy, Ponnusamy

    IPC: H01C17/28 ,  H01C1/142 ,  H05K1/16 ,  H01C7/00

    CPC classification number: H05K1/167 ,  H01C1/142 ,  H01C7/003 ,  H01C17/281 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/035 ,  H05K2201/0391 ,  H05K2203/1453 ,  H05K2203/1461

    Abstract: A printed circuit board (10) includes both high and low resistive value thick film resistors interconnected by a copper film (18). To lower the contact resistance to the thick film resistors (12) of high value, each is provided at its ends with a termination (16A,16B) of a composition similar to that used for the low value resistors (16). This provides a relatively low-resistance contact region which overcomes the difficulty that a copper thick film conductor has in making electrical connections to compositions generally used for making high value thick film resistors. The compositions of high and low resistivities are adapted to permit firing of both compositions in a single firing step.

    Abstract translation: 印刷电路板（10）包括通过铜膜（18）互连的高电阻值和低电阻值厚膜电阻器。 为了降低对高值的厚膜电阻器（12）的接触电阻，它们的端部设置有与用于低值电阻器（16）的组成类似的组合的终端（16A，16B）。 这提供了一种相对低电阻的接触区域，其克服了铜厚膜导体与通常用于制造高价值厚膜电阻器的组合物的电连接的困难。 高电阻率和低电阻率的组合物适于允许在单个烧制步骤中对两种组合物进行烧制。

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