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    BLIND VIA LASER DRILLING SYSTEM
    122.
    发明申请
    BLIND VIA LASER DRILLING SYSTEM 审中-公开
    BLIA通过激光钻孔系统

    公开(公告)号：WO1997046349A1

    公开(公告)日：1997-12-11

    申请号：PCT/US1997009732

    申请日：1997-06-05

    Applicant: BURGESS, Larry, W.

    IPC: B23K26/08

    CPC classification number: H05K3/4679 ,  B23K26/066 ,  B23K26/0853 ,  B23K26/282 ,  B23K26/389 ,  H05K1/0269 ,  H05K1/112 ,  H05K1/167 ,  H05K3/0008 ,  H05K3/0035 ,  H05K3/4638 ,  H05K3/4652 ,  H05K2201/09518 ,  H05K2201/09918 ,  H05K2203/0165 ,  H05K2203/0554 ,  H05K2203/056 ,  H05K2203/081 ,  H05K2203/082

    Abstract: A laser drilling system for producing blind vias (13) in multilayered circuit boards (9) includes an RF excited sealed carbon dioxide laser oscillator (19), X-Y motion table for moving the boards during on-the-fly via formation, and a controller. A laser beam (20) is focused beneath the circuit board by a long focal length lens (17) so as to be defocused at the surface of the board. A slotted mask may be used to allow drilling of multiple vias simultaneously, air may be injected to the via to assist in material removal, glass scales may be used for feedback position control, both the mask and table may be rotatable, and a computer may be used for determining an optimal processing path.

    Abstract translation: 一种用于在多层电路板（9）中产生盲孔（13）的激光钻孔系统包括：RF激发的密封二氧化碳激光振荡器（19），用于在飞行中通过地层移动板的XY运动台，以及控制器 。 激光束（20）通过长焦距透镜（17）聚焦在电路板下方，以便在基板的表面处散焦。 可以使用开槽掩模以允许同时钻孔多个通孔，空气可以被注入到通孔中以辅助材料去除，玻璃鳞片可以用于反馈位置控制，掩模和工作台都可以是可旋转的，并且计算机可以 用于确定最佳处理路径。

    Method to form solder deposits on substrates
    123.
    发明公开
    Method to form solder deposits on substrates 审中-公开
    在基板上形成焊料沉积物的方法

    公开(公告)号：EP2244285A1

    公开(公告)日：2010-10-27

    申请号：EP09158715.4

    申请日：2009-04-24

    Applicant: ATOTECH Deutschland GmbH

    Inventor： Lamprecht, Sven ,  Matejat, Kai-Jens ,  Ewert, Ingo

    IPC: H01L21/48 ,  H05K3/34

    CPC classification number: H01L21/486 ,  H01L21/4853 ,  H01L2224/11502 ,  H01L2224/11849 ,  H05K3/28 ,  H05K3/3473 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2203/043 ,  H05K2203/054

    Abstract: Described is a method of forming a solder deposit on a substrate comprising the following steps i) provide a substrate including a surface bearing electrical circuitry that includes at least one inner layer contact pad, ii) form a solder mask layer that is placed on the substrate surface and patterned to expose the at least one contact area, iii) contact the entire substrate area including the solder mask layer and the at least one contact area with a solution suitable to provide a conductive layer on the substrate surface, iv) electroplate a solder deposit layer containing a tin or tin alloy onto the conductive layer and v) etch away an amount of the solder deposit layer containing tin or tin alloy sufficient to remove the solder deposit layer from the solder mask layer area leaving a solder material layer on the at least one contact area.

    Abstract translation: 描述了一种在衬底上形成焊料沉积物的方法，包括以下步骤i）提供包括表面承载电路的衬底，所述电路包括至少一个内层接触焊盘，ii）形成焊接掩模层，所述焊料掩模层放置在衬底 表面并且被图案化以暴露所述至少一个接触区域，iii）使包括所述焊接掩模层和所述至少一个接触区域的整个衬底区域与适合于在所述衬底表面上提供导电层的溶液接触，iv）电镀焊料 将包含锡或锡合金的沉积层沉积到导电层上，以及v）蚀刻掉一定量的包含锡或锡合金的焊料沉积层，其足以从焊料掩模层区域移除焊料沉积层，留下焊料材料层 至少一个接触面积。

    MULTILAYER CIRCUIT BOARD AND MOTOR DRIVE CIRCUIT BOARD
    124.
    发明公开
    MULTILAYER CIRCUIT BOARD AND MOTOR DRIVE CIRCUIT BOARD 有权
    MEHRSCHICHTIGE LEITERPLATTE UND MOTORANTRIEBS-LEITERPLATTE

    公开(公告)号：EP2104408A1

    公开(公告)日：2009-09-23

    申请号：EP07860057.4

    申请日：2007-12-25

    Applicant: JTEKT Corporation

    Inventor： NAKAI, Motoo ,  NAGASE, Shigeki

    IPC: H05K3/46 ,  B62D5/04

    CPC classification number: H05K1/0206 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H05K3/0061 ,  H05K3/244 ,  H05K3/429 ,  H05K3/4611 ,  H05K2201/0347 ,  H05K2201/0394 ,  H05K2201/09518 ,  H05K2201/09527 ,  H05K2201/0959 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: Conducting layers 11 and resin-made insulating layers 12 are alternately laminated to form a laminated circuit portion 13, and a metal substrate 14 is installed so as to be in contact with an insulating layer 12, which is the lowermost layer. The conducting layers 11, the insulating layers 12, and the metal substrate 14 are thermal compression bonded. In order to connect the uppermost conducting layer 11 on which electronic component 31 is placed with the lowermost insulating layer 12, a conducting layer 22 is formed on the inner surface by copper plating to install a heat dissipating via 21 into which a resin 23 is filled. A conducting layer 11, which is the uppermost layer, is subjected to gold plating 15, with nickel plating undercoated. An electronic component for driving a motor 31 is placed on the uppermost conducting layer 11, by which the metal substrate 14 can be used as a motor drive circuit substrate for an electric power steering system.

    Abstract translation: 导电层11和树脂制绝缘层12交替层叠以形成层叠电路部分13，并且金属基板14被安装成与作为最下层的绝缘层12接触。 导电层11，绝缘层12和金属基板14被热压接。 为了将其上放置有电子部件31的最上层的导电层11与最下层的绝缘层12连接，通过镀铜在内表面上形成导电层22，以安装填充有树脂23的散热通孔21 。 作为最上层的导电层11进行镀金15，镀镍底涂层。 用于驱动电动机31的电子部件被放置在最上面的导电层11上，金属基板14可以用作电动助力转向系统的电机驱动电路基板。

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