公开(公告)号：EP0844811A2

公开(公告)日：1998-05-27

申请号：EP97850147.6

申请日：1997-10-24

Applicant: TELEFONAKTIEBOLAGET LM ERICSSON

Inventor： Hellgren, Eva ,  Eriksson, Mats

IPC: H05K7/08 ,  H05K13/04

CPC classification number: H05K3/366 ,  H05K3/303 ,  H05K13/046 ,  H05K2201/10386 ,  H05K2201/10454 ,  H05K2201/10568 ,  H05K2201/10659 ,  H05K2201/10696 ,  H05K2203/167 ,  Y02P70/613

Abstract: There is a trend in the electronics industry towards a preference for components that can be surface mounted on a carrier, such as a circuit board. By using surface mountable leads on a component together with a "Single-In-Line" technique it is possible to surface mount a component (5) upstanding on a circuit board (7) with the component leads surface mounted on the board. The leads (8) may be bent at their bottom extremities and provided with feet (10) for effective contact with the board. Guide and support pins may be used to hold the component in position during mounting and connecting the component and to brace the leads on the component when mounted on the board.

Abstract translation: 电子行业倾向于可以表面安装在诸如电路板的载体上的部件。 通过使用“单列直插”技术在部件上使用表面可安装引线，可以将表面安装在电路板（7）上的部件（5），并将元件引线表面安装在电路板上。 引线（8）可以在它们的下端弯曲并设置有用于与板有效接触的脚（10）。 引导和支撑销可用于在组件安装和连接期间将组件保持在适当的位置，并在安装在电路板上时将组件的导线支撑在支架上。

公开(公告)号：EP0287870B1

公开(公告)日：1997-06-25

申请号：EP88105164.3

申请日：1988-03-30

Applicant: SGS-THOMSON MICROELECTRONICS s.r.l.

Inventor： Massironi, Angelo

IPC: H05K3/30

CPC classification number: H01L23/49548 ,  H01L2924/0002 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/09709 ,  H05K2201/10696 ,  H05K2201/10757 ,  H05K2201/10871 ,  H01L2924/00

公开(公告)号：EP0682366A2

公开(公告)日：1995-11-15

申请号：EP95107226.3

申请日：1995-05-12

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Russell, Ernest ,  Wallace, James S. ,  Baudouin, Daniel

IPC: H01L23/32 ,  H01L23/48 ,  H05K1/18 ,  H01L25/10 ,  H01L23/495 ,  H05K3/30

CPC classification number: H05K1/181 ,  H01L23/32 ,  H01L23/49555 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1082 ,  H01L2924/0002 ,  H05K3/303 ,  H05K2201/10454 ,  H05K2201/10545 ,  H05K2201/10568 ,  H05K2201/10659 ,  H05K2201/10696 ,  H05K2203/167 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00

Abstract: Two flat packages (110, 111) are arranged to achieve a mirrored footprint by employing guides (100), which are positioned within a mounting aperture a printed circuit board. The flat packages include leads (120,121) which extend from the edge of the flat package. A semiconductor chip is encapsulated by the flat packages.

Abstract translation: 布置两个扁平封装（110,111）以通过使用位于印刷电路板的安装孔内的引导件（100）来实现镜像覆盖。 扁平封装包括从扁平封装的边缘延伸的引线（120,121）。 半导体芯片由扁平封装封装。

公开(公告)号：EP0460559B1

公开(公告)日：1995-04-12

申请号：EP91109004.1

申请日：1991-06-02

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Takahashi, Hiroyuki

IPC: H01G2/06 ,  H03H9/10

CPC classification number: H01G2/06 ,  H03H9/0528 ,  H03H9/1042 ,  H05K1/0271 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/10651 ,  H05K2201/10696 ,  H05K2201/10871

公开(公告)号：EP0513743A3

公开(公告)日：1993-05-05

申请号：EP92108008.1

申请日：1992-05-12

Applicant: FUJITSU LIMITED

Inventor： Michio, Sono, c/o Fujitsu Limited ,  Junichi, Kasai, c/o Fujitsu Limited ,  Masanori, Yoshimoto,c/o Fujitsu Limited ,  Kazuto, Tsuji, c/o Fujitsu Limited ,  Kouji, Saito, c/o Fujitsu Limited

IPC: H01L23/495

CPC classification number: H05K3/303 ,  H01L23/49555 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/181 ,  H05K3/3426 ,  H05K2201/09709 ,  H05K2201/09781 ,  H05K2201/10454 ,  H05K2201/10522 ,  H05K2201/10568 ,  H05K2201/10659 ,  H05K2201/10696 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A semiconductor device (10) having a package (11) of a single in-line type comprises a semiconductor chip (15), a package body (11) that accommodates the semiconductor chip (15) therein and defined by a pair of opposing major surfaces (11a, 11b), a plurality of interconnection leads (14) held by the package body to extend substantially perpendicularly to a bottom surface (11 f ), wherein each of the interconnection leads consists of an inner lead part (14b) located inside the package body and an outer lead part (14a) located outside the package body, the outer lead part being bent laterally at a boundary between the inner part and outer part, in one of first and second directions that are opposite from each other and substantially perpendicular to the opposing major surfaces (11a, 11b) of the package body. The semiconductor device further includes a plurality of support legs (12a - 13b) extending laterally at the bottom surface (11 f ) of the package body for supporting the package body upright when the semiconductor device is placed on a substrate.

Abstract translation: 具有单列直插式封装的半导体器件包括半导体芯片（15），其中容纳半导体芯片并由一对相对的主表面（11a，11b）限定的封装体（11），多个 由所述封装主体保持的互连引线（14）基本上垂直于底表面（11f）延伸，其中每个所述互连引线由位于所述封装主体内部的内引线部分（14b）和外引线部分（14a） ），所述外引线部分在所述内部部分和外部部分之间的边界处侧向弯曲，所述外引线部分在第一和第二方向之一中彼此相对并且基本上垂直于相对的主表面（11a，11b） ）的包装体。 半导体器件还包括在封装主体的底表面（11f）处横向延伸的多个支撑腿（12a-13b），用于当将半导体器件放置在衬底上时支撑封装体直立。

公开(公告)号：EP0520490A1

公开(公告)日：1992-12-30

申请号：EP92110825.4

申请日：1992-06-26

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： McLellan, Robert N. ,  Chiu, Anthony M.

IPC: H05K3/30 ,  H01L23/495

CPC classification number: H05K3/301 ,  H01L23/49555 ,  H01L2924/0002 ,  H05K3/303 ,  H05K2201/10454 ,  H05K2201/10568 ,  H05K2201/10696 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/49121 ,  Y10T29/49139 ,  H01L2924/00

Abstract: An electronic device (10) includes a package (16) having two posts (30) suitable for insertion in PCB holes. Package (16) presents a lengthwise molding plane (32) along which the upper portion (42) and bottom portion (44) of package (16) are mated during the molding process. Posts (30) are disposed substantially exclusively in bottom portion (44) so that posts (30) are asymmetric about lengthwise molding plane (32). Thus, even if a top mold (42a) and a bottom mold (44a) are misaligned there will be no effect on the dimensional tolerance of posts (30) and thus the tolerance of post (30) can be closely matched with a PCB hole (20) tolerance to insure a snug fit. Thus, device (10) is mounted edgewise on a PCB (18) by insertion of posts (30) into PCB holes (20) so that tips (24) of lead fingers (14) can be connected to PCB (18) by surfacing-mounting techniques or the like.

Abstract translation: 电子设备（10）包括具有适于插入PCB孔中的两个柱（30）的封装（16）。 包装（16）呈现纵向成型平面（32），在模制过程中，包装（16）的上部（42）和底部（44）沿着该成型平面配合。 柱（30）基本上仅设置在底部（44）中，使得柱（30）在纵向模制平面（32）周围是不对称的。 因此，即使顶模（42a）和底模（44a）不对准，也不会影响柱（30）的尺寸公差，因此柱（30）的公差可以与PCB孔 （20）容忍，以确保贴合。 因此，通过将柱（30）插入PCB孔（20）中，装置（10）沿边缘安装在PCB（18）上，使得引线指（14）的尖端（24）可以通过堆焊连接到PCB（18） 安装技术等。

公开(公告)号：EP0427151A3

公开(公告)日：1992-03-11

申请号：EP90121068.2

申请日：1990-11-02

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Farnworth,Warren M.

IPC: H05K3/30 ,  H01L23/495

CPC classification number: H05K1/181 ,  H01L23/49555 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1076 ,  H01L2924/0002 ,  H05K3/303 ,  H05K2201/09709 ,  H05K2201/10454 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2201/10568 ,  H05K2201/10696 ,  H05K2203/1572 ,  H05K2203/167 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00

Abstract: A semiconductor package having a gull-wing, zig-zag, inline-lead configuration and end-of-package anchoring devices for rigidly af fixing the package to a circuit board such that each lead is in compressive contact with its associated mounting pad on the board. The anchoring devices of a first embodiment comprise anchoring pins (12) having fish-hook-type barbs (20) which lock against the under side of the board (13) when the pins are inserted through holes (15) in the board; a second embodiment utilizes anchoring pins (54) which are adhesively bonded in recesses (52) that have been drilled or molded into the board (52); a third embodiment utilizes anchoring pins (62), the ends of which can be bonded directly to planar peg-bonding regions on the surface of the board (63); and a fourth utilizes tapered anchoring pin (74) which may be inserted with an interference fit into holes (75) in the board. The invention eliminates the need for mechanical support of the packages during solder reflow operations used during board assembly and repair.

公开(公告)号：EP0427151A2

公开(公告)日：1991-05-15

申请号：EP90121068.2

申请日：1990-11-02

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Farnworth,Warren M.

IPC: H05K3/30 ,  H01L23/495

CPC classification number: H05K1/181 ,  H01L23/49555 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1076 ,  H01L2924/0002 ,  H05K3/303 ,  H05K2201/09709 ,  H05K2201/10454 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2201/10568 ,  H05K2201/10696 ,  H05K2203/1572 ,  H05K2203/167 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00

Abstract: A semiconductor package having a gull-wing, zig-zag, inline-lead configuration and end-of-package anchoring devices for rigidly af fixing the package to a circuit board such that each lead is in compressive contact with its associated mounting pad on the board. The anchoring devices of a first embodiment comprise anchoring pins (12) having fish-hook-type barbs (20) which lock against the under side of the board (13) when the pins are inserted through holes (15) in the board; a second embodiment utilizes anchoring pins (54) which are adhesively bonded in recesses (52) that have been drilled or molded into the board (52); a third embodiment utilizes anchoring pins (62), the ends of which can be bonded directly to planar peg-bonding regions on the surface of the board (63); and a fourth utilizes tapered anchoring pin (74) which may be inserted with an interference fit into holes (75) in the board. The invention eliminates the need for mechanical support of the packages during solder reflow operations used during board assembly and repair.

Abstract translation: 具有鸥翼的半导体封装，锯齿形，直列导线结构和锚定装置用于刚性地自动对焦封装固定于电路板检查确实每个引线是与在其相关联的安装垫压缩接触包结束 板。 的第一实施例包括锚定销锚定装置（12），其具有鱼钩型倒钩（20），当该销被穿过板中的孔（15）插入抵靠板（13）的下侧哪个锁; 实施例二使用锚固销（54），其被粘结到凹部（52）并已被钻出或模制到板（52）; 第三实施例利用锚定销（62），其端部可以被直接结合到平面PEG-接合区域的板（63）的表面上; 和第四利用其可与过盈配合插入到间到在所述板中的孔（75）渐缩的锚定销（74）。 本发明消除了用于在电路板装配和维修过程中使用的焊料回流操作机械支撑包装的需要。

公开(公告)号：TWI391055B

公开(公告)日：2013-03-21

申请号：TW095137797

申请日：2006-10-13

Applicant: 哈尼威爾國際公司 ,  HONEYWELL INTERNATIONAL INC.

Inventor： 丹尼爾J 馬克卡西 ,  MCCARTHY, DANIEL J. ,  雷克書門S 威薩納華森 ,  WITHANAWASAM, LAKSHMAN S.

IPC: H05K3/32

CPC classification number: H01L23/3121 ,  H01L21/4846 ,  H01L23/49805 ,  H01L25/105 ,  H01L2224/48247 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1064 ,  H05K3/3442 ,  H05K2201/10454 ,  H05K2201/10696 ,  Y02P70/613

公开(公告)号：TW200730052A

公开(公告)日：2007-08-01

申请号：TW095137797

申请日：2006-10-13

Applicant: 哈尼威爾國際公司 HONEYWELL INTERNATIONAL INC.

Inventor： 丹尼爾J 馬克卡西 MCCARTHY, DANIEL J. ,  雷克書門S 威薩納華森 WITHANAWASAM, LAKSHMAN S.

IPC: H05K

CPC classification number: H01L23/3121 ,  H01L21/4846 ,  H01L23/49805 ,  H01L25/105 ,  H01L2224/48247 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1064 ,  H05K3/3442 ,  H05K2201/10454 ,  H05K2201/10696 ,  Y02P70/613

Abstract: 本發明揭示一種可垂直裝設的積體電路(IC)封裝之製造方法。將一積體電路裝設在一印刷電路板(PCB)上且電耦接至該PCB上的一結合襯墊。該結合襯墊與一嵌入該PCB中的通道耦接。分離出該IC、該結合襯墊、該通道及該PCB之一部分以產生一可垂直裝設的IC封裝。在分離期間沿橫截面切開該通道以曝露該通道之一部分且藉此為該IC封裝提供一可裝設區域。可將該IC封裝囊封或包容於介電材料中。另外,可用防止氧化且促進可焊性之保焊劑或其他適當之無電極金屬電鍍沈積來處理該通道。

Abstract in simplified Chinese: 本发明揭示一种可垂直装设的集成电路(IC)封装之制造方法。将一集成电路装设在一印刷电路板(PCB)上且电耦接至该PCB上的一结合衬垫。该结合衬垫与一嵌入该PCB中的信道耦接。分离出该IC、该结合衬垫、该信道及该PCB之一部分以产生一可垂直装设的IC封装。在分离期间沿横截面切开该信道以曝露该信道之一部分且借此为该IC封装提供一可装设区域。可将该IC封装囊封或包容于介电材料中。另外,可用防止氧化且促进可焊性之保焊剂或其他适当之无电极金属电镀沉积来处理该信道。