公开(公告)号：WO01089276A1

公开(公告)日：2001-11-22

申请号：PCT/JP2001/003439

申请日：2001-04-23

IPC: H05K1/09 ,  B23K26/00 ,  B23K26/38 ,  H05K3/00 ,  H05K3/02 ,  H05K3/38 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K3/025 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/384 ,  H05K3/4652 ,  H05K2201/0382

Abstract: A method for manufacturing a printed wiring board in which a copper foil and a resin layer can be machined simultaneously without etching the copper foil when via holes are made in a copper-clad laminate using a carbon dioxide gas laser. Recesses, e.g. via holes (8), are made in a copper-clad laminate (1) using a carbon dioxide gas laser (7), an etching resist layer (10) is formed by performing interlayer electrical connection plating (9), the etching resist layer is exposed and developed and then circuit etching is performed to manufacture a printed wiring board (11). The printed wiring board is manufactured using a copper-clad laminate having a corrugated outer layer copper foil (C).

Abstract translation: 一种制造印刷电路板的方法，其中当使用二氧化碳气体激光器在覆铜层压板中制造通孔时，可以同时加工铜箔和树脂层而不刻蚀铜箔。 凹槽，例如 通过使用二氧化碳气体激光器（7）在覆铜层压板（1）中制造通孔（8），通过进行层间电连接电镀（9）形成抗蚀剂层（10），抗蚀剂层 曝光和显影，然后执行电路蚀刻以制造印刷线路板（11）。 印刷电路板使用具有波纹状外层铜箔（C）的覆铜层压板制造。

公开(公告)号：WO1998024279A1

公开(公告)日：1998-06-04

申请号：PCT/SE1997001910

申请日：1997-11-13

Applicant: TELEFONAKTIEBOLAGET LM ERICSSON (publ)

Inventor： TELEFONAKTIEBOLAGET LM ERICSSON (publ) ,  BERGSTEDT, Leif, Roland

IPC: H05K01/18

CPC classification number: H05K1/0204 ,  H05K1/0243 ,  H05K3/0061 ,  H05K3/3421 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2201/10166

Abstract: The invention relates to an apparatus for achieving good contact between earth legs (11b, 11d) of a microwave circuit (1) against a corresponding earth connection on a circuit board (3). Earth connection areas (15a, 15b) are shaped directly from a carrier (5) of the circuit board (3), said carrier (5) being manufactured of an electrically conducting material, such as brass or copper, at the location on the circuit board (3) where the microwave circuit (1) is mounted, so that the earth connection areas (15a, 15b) protrude up above the top side (13) of the carrier. The microwave circuit (1) is mounted against the circuit board (3) at the intended location by connecting its legs (11a, 11b, 11c, 11d) to the intended connection area on the circuit board (3), the earth legs (11b, 11d) of the microwave circuit being connected against the shaped earth connection areas (15a, 15b). A method for manufacturing the above apparatus is described.

Abstract translation: 本发明涉及一种用于实现微波回路（1）的接地脚（11b，11d）与电路板（3）上相应的接地连接良好接触的装置。 接地连接区域（15a，15b）直接从电路板（3）的载体（5）成形，所述载体（5）由电路上的位置处的导电材料（例如黄铜或铜）制成 安装微波电路（1）的板（3），使得接地连接区域（15a，15b）在载体的顶侧（13）上方突出。 微波电路（1）通过将其腿部（11a，11b，11c，11d）连接到电路板（3）上的预期连接区域，接地腿（11b） ，11d）与所述成形的接地连接区域（15a，15b）连接。 对上述装置的制造方法进行说明。

公开(公告)号：JP2015053485A

公开(公告)日：2015-03-19

申请号：JP2014182524

申请日：2014-09-08

Applicant: インクテック カンパニー, リミテッドInktec Co., Ltd. ,  Inktec Co Ltd ,  インクテック カンパニー, リミテッドInktec Co., Ltd.

Inventor： CHUNG KWANG-CHOON ,  YOO JI HOON ,  SEONG JOONKI ,  HAN DAE SANG ,  CHO NAM-BOO

IPC: H05K3/22 ,  H05K3/12

CPC classification number: H05K3/1258 ,  H05K1/095 ,  H05K3/06 ,  H05K2201/0376 ,  H05K2201/0382 ,  H05K2201/09036 ,  H05K2201/09827 ,  H05K2203/1173 ,  Y10T29/49155

Abstract: 【課題】基板に形成される微細溝の形状を変形して、工程効率を改善するとともに、導電性インク組成物の成分を調節して、電気的特性及び光学的特性を容易に制御することができる導電性パターンの形成方法及び導電性パターンを提供すること。【解決手段】基板上に少なくとも一部区間が表面から深さ方向に沿って、幅が減少する形態の溝を形成する溝形成段階と、前記溝の内部に導電性インク組成物を充填する充填段階と、前記溝内部の導電性インク組成物に含まれる溶媒が揮発するように乾燥する乾燥段階とを含むことを特徴とする導電性パターンの形成方法。【選択図】図1

Abstract translation: 要解决的问题：提供一种形成导电图案的方法，其中通过使形成在基板中的细槽的形状变形来改善工艺效率，并且可以容易地控制导电图案的电特性和光学特性 调整导电油墨组合物; 导电图案的形成方法包括：在基板上形成凹槽的槽形成步骤，其特征在于，至少一部分截面具有沿表面的深度方向的宽度减小的特征; 用导电油墨组合物填充凹槽内部的填充步骤; 以及干燥步骤，干燥导电油墨组合物，使得槽内的导电油墨组合物中所含的溶剂挥发。

公开(公告)号：JP2014220016A

公开(公告)日：2014-11-20

申请号：JP2014174471

申请日：2014-08-28

Applicant: 凸版印刷株式会社 ,  Toppan Printing Co Ltd

Inventor： GOTO HIROYOSHI

IPC: G06K19/077 ,  G06K19/07

CPC classification number: G06K19/07783 ,  G06K19/07754 ,  H05K3/4038 ,  H05K3/4084 ,  H05K2201/0129 ,  H05K2201/0355 ,  H05K2201/0379 ,  H05K2201/0382 ,  H05K2201/0394 ,  H05K2201/10098 ,  H05K2203/0195 ,  H05K2203/107 ,  Y10T29/49016 ,  Y10T29/49018

Abstract: 【課題】アンテナの断線を防止して信頼性を向上させると共に電気抵抗を下げ、さらに生産性を向上させる。【解決手段】アンテナシートの製造方法は、熱可塑性樹脂を形成材料とする基板の一方の面に設けられ金属材料を形成材料とするアンテナコイル及び/又は接続パターンと、基板の他方の面に設けられた金属材料を形成材料とする導電部材との重なり部分を、押圧手段を用いて、基板の少なくとも一方の面から押圧するプレス工程と、アンテナコイル及び/又は接続パターンと、導電部材との重なり部分を溶接する溶接工程と、を有する。【選択図】図1A

Abstract translation: 要解决的问题：提供一种用于制造用于防止天线中的开路的天线片的方法，以提高可靠性，降低电阻，并且还提高可制造性。解决方案：一种制造天线片的方法包括：按压步骤，其中 由金属材料形成并设置在由热塑性树脂形成的基板的一个表面上的天线线圈和/或连接图案的重叠部分和由金属材料形成并设置在另一个上的导电构件 至少从衬底的至少另一个表面通过使用压制装置压制衬底的表面; 以及焊接步骤，其中焊接天线线圈和/或连接图案和导电构件的重叠部分。

公开(公告)号：JP2011049247A

公开(公告)日：2011-03-10

申请号：JP2009194602

申请日：2009-08-25

Applicant: Nec Lcd Technologies Ltd ,  Nec液晶テクノロジー株式会社

Inventor： KAMON YOICHIRO ,  HAGA HIROSHI ,  ASAKURA TETSURO

IPC: H05K1/14 ,  G02F1/1333 ,  G02F1/1345 ,  G09F9/00

CPC classification number: G02F1/13458 ,  G02F1/1345 ,  G02F1/13452 ,  H05K1/111 ,  H05K1/117 ,  H05K1/118 ,  H05K3/361 ,  H05K3/368 ,  H05K3/4046 ,  H05K2201/0382 ,  H05K2201/09845 ,  H05K2201/10136 ,  H05K2201/1028

Abstract: PROBLEM TO BE SOLVED: To solve the problem in which when mounting is performed beyond an uneven part by use of a flexible sheet including a conductive layer, the minimum curvature radius of the sheet prevents miniaturization of a mounting structure.
SOLUTION: The connecting structure for electronic device includes a first surface including a first conductor, a second surface including a second conductor, an end of the first surface substantially parallel to Y axis, and a flexible sheet-like connecting body including a conductive layer. The end is taken as the origin of X coordinate, and the direction from the second surface to the first surface is taken as positive direction of Z coordinate. The first conductor and the sheet-like connecting body are electrically connected by a first connecting terminal, and the second conductor and the sheet-like connecting body are electrically connected by a second connecting terminal. The sheet-like connecting body has a form such that it extends from the first connecting terminal to the second connecting terminal across the end, wherein the Y component of the distance between a point where the Z coordinate of the sheet-like connecting body becomes smaller than the first surface first when advancing from the first connecting terminal to the second connecting terminal along the surface and the second connecting terminal is larger than the X-component of the distance between the end and the second connecting terminal.
COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题为了解决通过使用包括导电层的柔性片超出不平坦部进行安装的问题，片的最小曲率半径防止了安装结构的小型化。 解决方案：电子设备的连接结构包括：第一表面，包括第一导体，包括第二导体的第二表面，基本上平行于Y轴的第一表面的端部;以及柔性片状连接体， 导电层。 将其作为X坐标的原点，将从第二面到第一面的方向作为Z坐标的正方向。 第一导体和片状连接体通过第一连接端子电连接，第二导体和片状连接体通过第二连接端子电连接。 片状连接体具有从第一连接端子延伸到第二连接端子的形式，其中，片状连接体的Z坐标点之间的距离的Y分量变小 比第一表面首先从第一连接端子沿着表面前进到第二连接端子，而第二连接端子大于端部和第二连接端子之间的距离的X分量。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP4591529B2

公开(公告)日：2010-12-01

申请号：JP2008079771

申请日：2008-03-26

Applicant: 株式会社デンソー

Inventor： 昌明 田中 ,  君治 粥川

IPC: H01L21/60 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18

CPC classification number: H01L24/81 ,  B23K1/0016 ,  B23K2201/42 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13019 ,  H01L2224/13076 ,  H01L2224/13078 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/81193 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01R12/52 ,  H01R43/0256 ,  H05K3/326 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/0382 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49213 ,  H01L2224/05599

公开(公告)号：JP4525734B2

公开(公告)日：2010-08-18

申请号：JP2007286403

申请日：2007-11-02

Applicant: セイコーエプソン株式会社

Inventor： 伸晃 橋元

IPC: H05K1/18 ,  H01L21/60

CPC classification number: H05K3/325 ,  H01L2224/05001 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/13008 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/3511 ,  H05K3/305 ,  H05K2201/0382 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2201/10984 ,  H01L2224/05099

公开(公告)号：JP2010080491A

公开(公告)日：2010-04-08

申请号：JP2008244040

申请日：2008-09-24

Applicant: Seiko Epson Corp ,  セイコーエプソン株式会社

Inventor： HASHIMOTO NOBUAKI

IPC: H01L21/60 ,  H05K1/18

CPC classification number: H05K3/305 ,  G02F1/13458 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/08 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/02373 ,  H01L2224/02377 ,  H01L2224/02379 ,  H01L2224/02381 ,  H01L2224/0239 ,  H01L2224/0331 ,  H01L2224/0332 ,  H01L2224/03515 ,  H01L2224/0361 ,  H01L2224/0362 ,  H01L2224/03831 ,  H01L2224/0519 ,  H01L2224/05191 ,  H01L2224/05548 ,  H01L2224/05551 ,  H01L2224/05553 ,  H01L2224/05556 ,  H01L2224/05572 ,  H01L2224/05582 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/0569 ,  H01L2224/05691 ,  H01L2224/061 ,  H01L2224/06155 ,  H01L2224/06505 ,  H01L2224/08058 ,  H01L2224/08238 ,  H01L2224/09055 ,  H01L2224/2731 ,  H01L2224/2732 ,  H01L2224/27515 ,  H01L2224/2761 ,  H01L2224/27825 ,  H01L2224/27831 ,  H01L2224/29008 ,  H01L2224/29011 ,  H01L2224/29013 ,  H01L2224/29017 ,  H01L2224/29023 ,  H01L2224/29082 ,  H01L2224/29101 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/29563 ,  H01L2224/2957 ,  H01L2224/29582 ,  H01L2224/29624 ,  H01L2224/29644 ,  H01L2224/29647 ,  H01L2224/29655 ,  H01L2224/29664 ,  H01L2224/29666 ,  H01L2224/29671 ,  H01L2224/29684 ,  H01L2224/301 ,  H01L2224/30155 ,  H01L2224/30505 ,  H01L2224/32058 ,  H01L2224/32238 ,  H01L2224/33055 ,  H01L2224/80194 ,  H01L2224/80203 ,  H01L2224/80385 ,  H01L2224/80424 ,  H01L2224/80444 ,  H01L2224/80447 ,  H01L2224/80488 ,  H01L2224/8085 ,  H01L2224/80862 ,  H01L2224/8088 ,  H01L2224/80902 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83385 ,  H01L2224/834 ,  H01L2224/83424 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83488 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/83902 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19041 ,  H05K3/325 ,  H05K2201/0367 ,  H05K2201/0382 ,  H05K2201/091 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/01023 ,  H01L2924/00 ,  H01L2924/01022 ,  H01L2924/01028

Abstract: PROBLEM TO BE SOLVED: To provide a structure for mounting an electronic component, which improves a bonding strength between a bump electrode and a substrate-side terminal, improves the reliability of a conductive connection state and allows easy manufacture. SOLUTION: The bump electrode 12 includes base resin 13 arranged on an active face 121a of the electronic component 121 and a conductive film 14 which covers part of a surface of base resin 13, exposes a remaining part and performs conduction to an electrode terminal 16 installed on the active face 121a. Base resin 13 includes an opening 13b surrounding a plurality of electrode terminals 16, a connection 13A whose one end is connected to the electrode terminal 16 and on which part of the conductive film 14 pulled out to the surface is disposed and an adhesion part 13a which is formed in a region except for the opening 13b and the connection 13A and is bonded to a substrate. The base resin 13 is elastically deformed in the connection 13A. Thus, the adhesion part 13a is bonded to the substrate, and the conductive film 14 and the terminal on the substrate are kept in a connection state. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：为了提供提高凸起电极和基板侧端子之间的接合强度的电子部件的安装结构，提高了导电连接状态的可靠性，并且容易制造。 解决方案：凸块电极12包括布置在电子部件121的有源面121a上的基底树脂13和覆盖基础树脂13的表面的一部分的导电膜14，露出剩余部分并对电极进行导电 端子16安装在主动面121a上。 基体树脂13包括围绕多个电极端子16的开口13b，其一端连接到电极端子16并且导电膜14的一部分被拉出到表面的连接13A和粘附部13a 形成在开口部13b和连接部13A以外的区域，并与基板接合。 基体树脂13在连接部13A中弹性变形。 因此，粘接部13a与基板接合，导电膜14和基板上的端子保持连接状态。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP4353263B2

公开(公告)日：2009-10-28

申请号：JP2007069190

申请日：2007-03-16

Applicant: セイコーエプソン株式会社

Inventor： 茂久 多次見

IPC: H01L21/60

CPC classification number: H05K3/3436 ,  H01L22/12 ,  H01L23/13 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81208 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H05K1/189 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0382 ,  H05K2201/10674 ,  H05K2203/0278 ,  Y02P70/613 ,  H01L2224/0401

Abstract: A method for manufacturing a semiconductor device includes: preparing a wiring board having a base substrate and wiring that is plated on surface with a plating metal; pressing a bump that is formed on the active side of the semiconductor chip against an end part of the wiring of the wiring board, thereby exfoliating the area surrounding the pressed portion of the wiring from the base substrate while keeping the end of the wiring bonded with the base substrate; melting the plating metal that is located on the end part of the wiring, thereby causing the plating metal and the bump to form an alloy that bonds the bump and the wiring and infiltrate the plating metal into a space between the wiring and the base substrate; and judging that the bump and the wiring are well bonded if the plating metal has infiltrated a space between the wiring and the base substrate so as to have an area, width or length of infiltration that exceeds a reference value.

公开(公告)号：JP2009170580A

公开(公告)日：2009-07-30

申请号：JP2008005458

申请日：2008-01-15

Applicant: Panasonic Corp ,  パナソニック株式会社

Inventor： NAGAIKE SHOTARO

IPC: H01L23/02

CPC classification number: H05K1/181 ,  G02F1/13452 ,  H01L23/04 ,  H01L23/24 ,  H01L2924/0002 ,  H05K1/0218 ,  H05K3/284 ,  H05K2201/0382 ,  H05K2201/10128 ,  H05K2201/10371 ,  H05K2201/10515 ,  H05K2201/2018 ,  H05K2203/1316 ,  Y02P70/611 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a circuit board module capable of preventing a short circuit of an electronic component even when an electronic component having a height larger than those of the other electronic components is included in mounted electronic components, and allowing reduction of its thickness; and an electronic apparatus equipped with the same.
SOLUTION: This circuit board module is provided with: a board 1 having a mounting surface; the electronic components 2 mounted on the mounting surface; a frame body 4 surrounding the electronic components 2, mounted on the mounting surface, and having conductivity; a resin part 6 located inside the frame body 4, and tightly fitted to the electronic components 2, the mounting surface and the frame body 4; and a lid part 8 covering the electronic components 2, having conductivity and connected to the frame body 4. The lid part 8 has a flat part 82 projecting outward relative to the other parts in a part including a region corresponding to the component 2H having a height larger than those of the other components within the electronic components 2.
COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：为了提供一种能够防止电子部件短路的电路板模块，即使在安装的电子部件中包括具有比其他电子部件的高度大的电子部件的电子部件，并且允许减小 的厚度 以及配备该电子设备的电子设备。 解决方案：该电路板模块设置有：具有安装表面的板1; 安装在安装面上的电子部件2; 围绕安装在安装面上并具有导电性的电子部件2的框体4; 位于框体4的内部并与电子部件2，安装面和框体4紧密配合的树脂部6; 以及覆盖电子部件2的盖部8，其具有导电性并与框体4连接。盖部8具有平面部82，该平坦部82相对于其他部分向外突出，部分包括对应于具有 高度大于电子元件2中的其他部件的高度。版权所有（C）2009，JPO＆INPIT