公开(公告)号：US20140335635A1

公开(公告)日：2014-11-13

申请号：US13891637

申请日：2013-05-10

Applicant: Sridharan Venk ,  Adam Scotch ,  David Hamby

Inventor： Sridharan Venk ,  Adam Scotch ,  David Hamby

IPC: H01L23/00 ,  H01L33/48

CPC classification number: H01L24/80 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L2924/12041 ,  H01L2924/12042 ,  H05K1/141 ,  H05K3/0035 ,  H05K3/281 ,  H05K3/284 ,  H05K3/305 ,  H05K3/368 ,  H05K3/4069 ,  H05K2201/041 ,  H05K2201/049 ,  H05K2201/09281 ,  H05K2201/09727 ,  H05K2201/10106 ,  H01L2924/00

Abstract: Described herein are electronic assemblies including a subassembly film and methods for making the same. In some embodiments, a first subassembly is formed by placing an electronic die at a die placement location on a subassembly film. A second subassembly may be formed by placing the first subassembly at a subassembly placement position on a base layer, such that electrical contacts/traces on the first film overlap with electrical contacts/traces at a subassembly connection point on the base layer. Placement of the die on the subassembly film may be performed with automatic placement machinery that has a placement accuracy that is greater than that required to place the first subassembly on the base layer. As a result, the costly and time consuming manual inspection of die placement may be avoided.

Abstract translation: 这里描述的是包括子组件膜的电子组件及其制造方法。 在一些实施例中，通过将电子管芯放置在子组件膜上的管芯放置位置来形成第一子组件。 第二子组件可以通过将第一子组件放置在基底层上的子组件放置位置而形成，使得第一膜上的电接触/迹线与基底层上的子组件连接点处的电触点/迹线重叠。 可以使用具有大于将第一子组件放置在基层上所需的放置精度的自动放置机械来执行模具在子组件薄膜上的放置。 结果，可以避免成本高且耗时的针头放置的手动检查。

公开(公告)号：US20130201636A1

公开(公告)日：2013-08-08

申请号：US13574630

申请日：2011-01-31

Applicant: Jeroen Van Den Brand ,  Gerardus Titus Van Heck ,  Margaretha Maria De Kok

Inventor： Jeroen Van Den Brand ,  Gerardus Titus Van Heck ,  Margaretha Maria De Kok

IPC: H05K1/02 ,  H05K13/04

CPC classification number: H05K1/0277 ,  G09F9/00 ,  G09F19/22 ,  H01L27/3293 ,  H01L31/0392 ,  H01L31/042 ,  H01L51/5203 ,  H01L2251/5338 ,  H01L2251/5361 ,  H01R4/04 ,  H01R4/70 ,  H01R12/7076 ,  H05B33/0896 ,  H05B33/10 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/147 ,  H05K1/189 ,  H05K3/321 ,  H05K3/325 ,  H05K3/365 ,  H05K13/04 ,  H05K2201/029 ,  H05K2201/0311 ,  H05K2201/046 ,  H05K2201/083 ,  H05K2201/09081 ,  H05K2201/09281 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/10484 ,  Y02E10/50 ,  Y10T29/4913

Abstract: An assembly of a plurality of tiles (1) with a carrier (40). The tiles (1) comprise a foil (20) with an electro-physical transducer (10) and electrical connectors (24, 28) to said transducer. The tiles are mechanically and electrically coupled to the carrier in a connection portion (1c) of said tiles.

Abstract translation: 具有载体（40）的多个瓦片（1）的组件。 瓦片（1）包括具有电物理换能器（10）的箔（20）和到所述换能器的电连接器（24,28）。 所述瓦片在所述瓦片的连接部分（1c）中机械地和电耦合到所述载体。

公开(公告)号：US08256111B2

公开(公告)日：2012-09-04

申请号：US12645303

申请日：2009-12-22

Applicant: Yu-Hsu Lin ,  Jeng-Da Wu ,  Chih-Hang Chao

Inventor： Yu-Hsu Lin ,  Jeng-Da Wu ,  Chih-Hang Chao

IPC: H05K3/02 ,  H05K3/10

CPC classification number: H01L23/50 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0224 ,  H05K1/0253 ,  H05K2201/09281 ,  H05K2201/09681 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A method for laying out a circuit board includes following steps. A substrate board is formed with a plurality of board sides. A ground plane, including a plurality of tiles, is provided. Each ground trace tile is defined by a plurality of ground traces. A signal plane on the substrate board has a plurality of signal traces that comprise of a plurality of straight line segments. Any one ground trace of each tile is arranged at an angle other than zero degrees relative to one determined board side. The straight line segments is applied to be mapped on the ground plane crossing one ground trace of one tile within an angle range determined by the ground traces of the tile and an adjacent diagonal line of the tile. The one ground trace and the straight line segments are applied at an angle movable in a range from 22.5° to 32.5°.

Abstract translation: 布线电路板的方法包括以下步骤。 衬底板形成有多个板侧。 提供包括多个瓦片的接地平面。 每个接地迹线瓦片由多个接地迹线限定。 衬底板上的信号平面具有包括多个直线段的多个信号迹线。 每个瓦片的任何一个接地迹线相对于一个确定的电路板侧以非零度的角度布置。 直线段被施加以映射在跨越由瓦片的接地轨迹和瓦片的相邻对角线确定的角度范围内的一个瓦片的一个接地轨迹的接地平面上。 一个接地迹线和直线段以可在22.5°至32.5°的范围内的角度施加。

公开(公告)号：US08079011B2

公开(公告)日：2011-12-13

申请号：US12000366

申请日：2007-12-12

Applicant: Cheng Siew Tay ,  Wendy Chet Ming Ngoh ,  Choi Keng Chan

Inventor： Cheng Siew Tay ,  Wendy Chet Ming Ngoh ,  Choi Keng Chan

IPC: G06F17/50 ,  H05K1/16

CPC classification number: H05K1/111 ,  H05K2201/09227 ,  H05K2201/09281 ,  H05K2201/09481 ,  H05K2201/10734 ,  Y02P70/611 ,  Y10T29/49144 ,  Y10T29/5313

Abstract: A printed circuit board includes a group of pads suitable to be soldered to a respective group of solder-balls of a device. Each pad of the group has a crack initiation point on its perimeter at a location where cracks in a solder-ball are anticipated to start after that solder-ball is soldered to that pad. For a pad of that group having a microvia located therein, a center of that microvia is located farther than a center of that pad from its crack initiation point. For a pad of that group having a trace merging along a portion of its perimeter, that portion does not include a vicinity of that crack initiation point.

Abstract translation: 印刷电路板包括适合于焊接到装置的相应组焊球的一组焊盘。 该组的每个焊盘在其焊接球被焊接到该焊盘之后预期在焊球上的裂纹开始的位置处具有在其周边上的裂纹起始点。 对于具有位于其中的微孔的该组的垫，该微孔的中心位于比该垫的中心从其裂纹起始点更远的位置。 对于具有沿着其周边的一部分的轨迹合并的该组的焊盘，该部分不包括该裂纹起始点的附近。

公开(公告)号：US08053679B2

公开(公告)日：2011-11-08

申请号：US12344250

申请日：2008-12-25

Applicant: Fa-Ping Fan

Inventor： Fa-Ping Fan

IPC: H05K1/11

CPC classification number: H05K1/111 ,  H05K1/0245 ,  H05K2201/09236 ,  H05K2201/09281 ,  Y02P70/611

Abstract: An exemplary printed circuit board includes a substrate, a differential transmission line, and at least two weld pad pairs. The differential transmission line and the at least two weld pad pairs are disposed on the substrate. The differential transmission line includes two parallel signal conductors disposed on the substrate. Each of the two signal conductors is electrically connected to an edge of one of the weld pads of a respective pair of the at least two weld pad pairs. Thereby, the two signal conductors of the differential transmission line can extend in the same distance anywhere, particularly in the position where the two signal conductors pass the two weld pad pairs. As a result, the coupling performance and the capability of the differential transmission line to resist electromagnetic interference are both enhanced.

Abstract translation: 示例性印刷电路板包括基板，差分传输线和至少两个焊盘对。 差分传输线和至少两个焊盘对设置在基板上。 差分传输线包括设置在基板上的两个并行信号导体。 两个信号导体中的每一个电连接到相应的一对至少两个焊盘对的焊接焊盘之一的边缘。 因此，差分传输线的两个信号导体可以在任何地方延伸相同的距离，特别是在两个信号导体通过两个焊盘对的位置。 结果，提高了耦合性能和差动传输线抵抗电磁干扰的能力。

公开(公告)号：US07973244B2

公开(公告)日：2011-07-05

申请号：US11765453

申请日：2007-06-20

Applicant: Yu-Hsu Lin ,  Chan-Fei Tai ,  Jeng-Da Wu ,  Chih-Hang Chao

Inventor： Yu-Hsu Lin ,  Chan-Fei Tai ,  Jeng-Da Wu ,  Chih-Hang Chao

IPC: H05K1/03

CPC classification number: H05K1/0248 ,  H05K1/025 ,  H05K1/0366 ,  H05K2201/029 ,  H05K2201/09227 ,  H05K2201/09281

Abstract: A printed circuit board includes a base formed from a plurality of woven fibers, and signal traces laid on the base. Each of the signal traces includes at least a straight line segment. The signal traces are laid on the base in such a manner that the line segments of the signal traces mapped on the base cross the fibers at angles not equal to zero degrees.

Abstract translation: 印刷电路板包括由多根编织纤维形成的底座和放置在基座上的信号迹线。 每个信号迹线至少包括直线段。 信号迹线以这样的方式铺设在基座上，使得映射在基座上的信号迹线的线段以不等于零度的角度跨越光纤。

公开(公告)号：US20080265872A1

公开(公告)日：2008-10-30

申请号：US12108780

申请日：2008-04-24

Applicant: Atsushi Nagashima

Inventor： Atsushi Nagashima

IPC: G01R1/20

CPC classification number: H05K3/3421 ,  G01R1/203 ,  H05K1/111 ,  H05K3/222 ,  H05K2201/09281 ,  H05K2201/09381 ,  H05K2201/09909 ,  H05K2203/0465 ,  H05K2203/167 ,  Y02P70/611 ,  Y02P70/613

Abstract: An object of the present invention is to provide a wiring substrate capable of accurately detecting a potential difference in a shunt resistor and a current to be detected without being influenced by soldering, and a current detection device. A land mounted with a rectangular surface at each end of a shunt resistor is configured by first and second lands each having a rectangular portion and being arranged at a predetermined interval with a central line as a center, and third and fourth lands each having an area smaller than those of the first and second lands and being arranged at one end of the first and second lands to be connected respectively to the first and second lands. A wiring pattern for detecting a potential difference between the both ends of the shunt resistor is configured by a first wiring pattern connected to the third land and pulled out from the third land towards the fourth land, a second wiring pattern connected to the fourth land and pulled out from the fourth land towards the third land, and third and fourth wiring patterns connected respectively to the first and second wiring patterns and pulled out into one direction.

Abstract translation: 本发明的目的是提供一种能够在不受焊接影响的情况下精确地检测分流电阻器和待检测电流的电位差的布线基板和电流检测装置。 在分流电阻器的每一端安装有矩形表面的焊盘由第一和第二焊盘构成，第一焊盘和第二焊盘均具有矩形部分，并且以中心线为中心以预定间隔布置，并且第三和第四焊盘各自具有面积 小于第一和第二平台的布置在第一和第二平台的一端以分别连接到第一和第二平台。 用于检测分流电阻器的两端之间的电位差的布线图案由连接到第三焊盘并从第三焊盘朝向第四焊盘拉出的第一布线图案，连接到第四焊盘的第二布线图案和 从第四面朝向第三平面拉出，第三和第四布线图案分别连接到第一和第二布线图案并拉出到一个方向。

公开(公告)号：US07436268B2

公开(公告)日：2008-10-14

申请号：US11217658

申请日：2005-08-31

Applicant: Shin-Shing Jiang ,  Sheng-Yuan Lee

Inventor： Shin-Shing Jiang ,  Sheng-Yuan Lee

IPC: H03H7/38

CPC classification number: H01R12/58 ,  H01R12/7064 ,  H01R24/50 ,  H01R2103/00 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/0243 ,  H05K1/116 ,  H05K3/3447 ,  H05K3/429 ,  H05K2201/09281 ,  H05K2201/09618 ,  H05K2201/09727 ,  H05K2201/09809 ,  H05K2201/10189

Abstract: A signal transmission structure for connecting a coaxial cable connector is provided. The coaxial cable connector has a signal pin. The signal transmission structure includes a reference plane and a conductive layer, and the conductive layer is located on one side of the reference plane. Moreover, the conductive layer includes a signal perforated pad, a first line segment, a second line segment, and a compensation pad. The signal pin is suitable for threading the signal perforated pad. The first line segment is connected to the signal perforated pad, and the compensation pad is connected between the first line segment and the second line segment.

Abstract translation: 提供了用于连接同轴电缆连接器的信号传输结构。 同轴电缆连接器有一个信号引脚。 信号传输结构包括参考平面和导电层，并且导电层位于参考平面的一侧。 此外，导电层包括信号穿孔垫，第一线段，第二线段和补偿垫。 信号针适用于信号穿孔垫的穿线。 第一线段连接到信号穿孔焊盘，补偿焊盘连接在第一线段和第二线段之间。

公开(公告)号：US20080186687A1

公开(公告)日：2008-08-07

申请号：US11765453

申请日：2007-06-20

Applicant: YU-HSU LIN ,  CHAN-FEI TAI ,  JENG-DA WU ,  CHIH-HANG CHAO

Inventor： YU-HSU LIN ,  CHAN-FEI TAI ,  JENG-DA WU ,  CHIH-HANG CHAO

IPC: H05K1/09

CPC classification number: H05K1/0248 ,  H05K1/025 ,  H05K1/0366 ,  H05K2201/029 ,  H05K2201/09227 ,  H05K2201/09281

Abstract: A printed circuit board includes a base formed from a plurality of woven fibers, and signal traces laid on the base. Each of the signal traces includes at least a straight line segment. The signal traces are laid on the base in such a manner that the line segments of the signal traces mapped on the base cross the fibers at angles not equal to zero degrees.

Abstract translation: 印刷电路板包括由多根编织纤维形成的底座和放置在基座上的信号迹线。 每个信号迹线至少包括直线段。 信号迹线以这样的方式铺设在基座上，使得映射在基座上的信号迹线的线段以不等于零度的角度跨越光纤。

公开(公告)号：US20080066955A1

公开(公告)日：2008-03-20

申请号：US11901078

申请日：2007-09-13

Applicant: Takamasa Nodo ,  Haruo Takagi

Inventor： Takamasa Nodo ,  Haruo Takagi

IPC: H05K1/11

CPC classification number: H05K1/111 ,  H05K3/3442 ,  H05K2201/09254 ,  H05K2201/09281 ,  H05K2201/09381 ,  H05K2201/09727 ,  H05K2201/10522 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: A surface mounting structure for a surface mounting electronic component comprises an electronic component a land, a wiring, and an electrical connection pattern. The electronic component has electrodes at opposite ends thereof. The land is connected to each electrode through a solder. The wiring is connected to the land and has a width which is smaller than a width of the electronic component in a width direction thereof. The wiring is connected to the electrical connection pattern. The electrical connection pattern has on a side on which the wiring is connected to the electrical connection pattern a width which is larger than the width of the electronic component in the width direction thereof.

Abstract translation: 用于表面安装电子部件的表面安装结构包括电子部件，焊盘，布线和电连接图案。 电子部件在其相对端具有电极。 焊盘通过焊料连接到每个电极。 布线连接到台面，其宽度小于电子部件的宽度方向的宽度。 接线连接到电气连接图案。 电连接图案具有在电连接图案的与电子部件的宽度方向的宽度大的宽度上连接的一侧。