公开(公告)号：KR1020110059563A

公开(公告)日：2011-06-02

申请号：KR1020107025728

申请日：2009-03-05

Applicant: 노쓰이스트 마리타임 인스티튜트, 인코포레이티드

Inventor： 마틴,시드니,에드워드 ,  다위키,에릭,로저 ,  다위키,안젤라,미셸

IPC: C09D165/04 ,  C08K3/22 ,  B05D7/24 ,  C23C16/455

CPC classification number: H05K3/284 ,  B05D1/60 ,  B05D3/142 ,  B05D2601/20 ,  C08K3/22 ,  C08K3/28 ,  C08K3/38 ,  C08L65/04 ,  C09D5/1662 ,  C09D7/61 ,  C09D7/69 ,  C09D165/04 ,  H05K1/0203 ,  H05K1/021 ,  H05K3/285 ,  H05K2201/0179 ,  H05K2201/0209 ,  H05K2201/09872

Abstract: 본 개시내용은 부분적으로, 개선된 특성, 예를 들어 개선된 열 전달 및 내구성 특성을 갖는 파릴렌 기재의 등각 코팅 조성물, 및 이들 조성물로 물체를 코팅하는 방법 및 장치, 및 이들 조성물로 코팅된 물체에 관한 것이다. 일부 측면에서, 파릴렌 및 질화붕소를 포함하는 코팅 조성물이 개시된다. 본 개시내용은 또한 파릴렌 화합물 및 질화붕소를 포함하는 등각 코팅물을 갖는 물체 (예를 들어, 전자 장비, 직물 등)를 포함한다.

公开(公告)号：US09992875B2

公开(公告)日：2018-06-05

申请号：US14779731

申请日：2014-03-25

Applicant: Semblant Limited

Inventor： Elizabeth Williams-Duncan

IPC: H01L23/552 ,  H01L23/00 ,  H01L21/3213 ,  H05K3/28 ,  H05K1/18

CPC classification number: H05K3/282 ,  H01L21/32138 ,  H01L23/552 ,  H01L23/562 ,  H01L23/564 ,  H01L2224/80007 ,  H01L2224/81007 ,  H01L2224/82007 ,  H01L2224/83007 ,  H01L2224/84007 ,  H01L2224/85007 ,  H01L2224/86007 ,  H05K1/181 ,  H05K3/285 ,  H05K2201/09872 ,  H05K2203/095 ,  H05K2203/1322 ,  H05K2203/1333 ,  H05K2203/1377

Abstract: The present invention relates to an electrical assembly which has a conformal coating, wherein said conformal coating is obtainable by a method which comprises: (a) plasma polymerization of a compound of formula (I) and a fluorohydrocarbon, wherein the molar ratio of the compound of formula (I) to the fluorohydrocarbon is from 5:95 to 50:50, and deposition of the resulting polymer onto at least one surface of the electrical assembly: wherein: R1 represents C1-C3 alkyl or C2-C3 alkenyl; R2 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; R3 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; R4 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; R5 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; and R6 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl, and (b) plasma polymerization of a compound of formula (I) and deposition of the resulting polymer onto the polymer formed in step (a).

公开(公告)号：US09992865B2

公开(公告)日：2018-06-05

申请号：US15045544

申请日：2016-02-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae-Hong Min ,  Myung-Sam Kang ,  Young-Gwan Ko ,  Min-Jae Seong

IPC: H05K7/00 ,  H05K1/02 ,  H01L23/13 ,  H01L23/498 ,  H01L23/00 ,  H05K1/11 ,  H05K3/46

CPC classification number: H05K1/0298 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/00 ,  H05K1/113 ,  H05K3/4608 ,  H05K2201/0195 ,  H05K2201/0367 ,  H05K2201/09672 ,  H05K2201/09872 ,  H05K2201/10674

Abstract: A circuit board and an assembly including the circuit board are provided. The circuit board includes a first insulation layer, a first conductive pattern disposed on the first insulation layer, an insulation film disposed on the first conductive pattern, and a second conductive pattern disposed on the insulation film. The insulation film includes an insulation thin film contacting the first conductive pattern, and a function film disposed on the insulation thin film and contacting the second conductive pattern.

公开(公告)号：US09949377B2

公开(公告)日：2018-04-17

申请号：US14593614

申请日：2015-01-09

Applicant: HZO, INC.

Inventor： Max Sorenson ,  Blake Stevens ,  Alan Rae ,  Marc Chason

IPC: H05K1/16 ,  H05K3/28 ,  H05K1/18 ,  H05K13/00

CPC classification number: H05K3/284 ,  H01L2224/16225 ,  H05K1/185 ,  H05K13/00 ,  H05K2201/09872 ,  Y10T29/49002 ,  Y10T29/49117

Abstract: A moisture-resistant electronic device includes at least one electronic component at least partially covered by a moisture-resistant coating. The moisture-resistant coating may be located within an interior of the electronic device. The moisture-resistant coating may cover only portions of a boundary of an internal space within the electronic device. A moisture-resistant coating may include one or more discernible boundaries, or seams, which may be located at or adjacent to locations where two or more components of the electronic device interface with each other. Assembly methods are also disclosed.

公开(公告)号：US09935353B2

公开(公告)日：2018-04-03

申请号：US14862159

申请日：2015-09-23

Applicant: Intel Corporation

Inventor： Gong Ouyang ,  Shaowu Huang ,  Kai Xiao

IPC: H01P3/08 ,  H01P11/00 ,  H01P3/04 ,  H05K1/02

CPC classification number: H01P3/081 ,  H01P3/04 ,  H01P11/003 ,  H05K1/024 ,  H05K1/0243 ,  H05K1/0245 ,  H05K2201/09036 ,  H05K2201/09872

Abstract: A conductor in a laminar structure, such as a printed circuit board or thin-film stack, is closely flanked by at least one open trench filled with an ambient medium (e.g., air, another gas, vacuum) of a lower dielectric loss than the conductor's surrounding dielectric. The trench may be made by any suitably precise method such as laser scribing, chemical etching or mechanical displacement. A thin layer of dielectric may be left on the sides of the conductor to prevent oxidation or other reactions that may reduce conductivity. When the conductor carries a signal, part of an electric and/or magnetic field that would ordinarily travel through the surrounding dielectric encounters the low-loss ambient medium (e.g. air) in the trench. The effective dielectric loss surrounding the conductor is lowered, reducing signal attenuation and crosstalk, particularly at high frequencies.

公开(公告)号：US20180083662A1

公开(公告)日：2018-03-22

申请号：US15382241

申请日：2016-12-16

Applicant: Syed Taymur Ahmad ,  Bruce Acton

Inventor： Syed Taymur Ahmad ,  Bruce Acton

IPC: H04B1/3888 ,  H05K3/28 ,  H05K3/10 ,  H05K5/00 ,  H05K1/03 ,  H05K1/09 ,  H01R13/648

CPC classification number: H04B1/3888 ,  H05K3/284 ,  H05K2201/015 ,  H05K2201/0162 ,  H05K2201/09872 ,  H05K2203/1361 ,  H05K2203/1366

Abstract: Methods for protecting an electronic device from contaminants by applying different insulating and conducting materials to different vital components of a device are disclosed. In one embodiment, the method comprises applying an electrically insulating material, such as isobutylene isoprene rubber, to one or more connectors and components located on the printed circuit board of the device. The method further comprises applying a polymer capable of carrying a charge, such as a silicone-based polymer, to different connectors and components on the printed circuit board. The method leads to different components being coated with different materials. Electronic devices that are protected by such coatings are also disclosed, such as smart phones, computers, head phones, and gaming devices, all of which show improve protection from contaminants, especially liquid contaminants.

公开(公告)号：US09834686B2

公开(公告)日：2017-12-05

申请号：US14537250

申请日：2014-11-10

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Kyungjae Shin ,  Kiwoong Kim

IPC: H05K7/00 ,  C09D5/00 ,  H05K1/18 ,  H05K1/02 ,  H05K3/00 ,  C08L83/04 ,  C08J3/24 ,  C08K5/00 ,  H01L23/29 ,  C08K3/22 ,  C08K3/28 ,  C08K3/38

CPC classification number: C09D5/00 ,  C08J3/243 ,  C08K5/0025 ,  C08K2003/222 ,  C08K2003/2227 ,  C08K2003/2231 ,  C08K2003/2296 ,  C08K2003/282 ,  C08K2003/385 ,  C08L83/04 ,  H01L23/296 ,  H05K1/0259 ,  H05K1/18 ,  H05K3/0011 ,  H05K3/284 ,  H05K3/285 ,  H05K2201/0162 ,  H05K2201/09872 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10166 ,  H05K2201/10181

Abstract: An integrated silicone for protecting electronic devices includes a base resin, a thermal initiator, and a photoinitiator.

公开(公告)号：US20170287880A1

公开(公告)日：2017-10-05

申请号：US15470960

申请日：2017-03-28

Applicant: Infineon Technologies AG

Inventor： Edward Fuergut ,  Holger Doepke ,  Olaf Hohlfeld ,  Michael Juerss

IPC: H01L25/07 ,  H01L23/00 ,  H01L23/29 ,  H01L21/52 ,  H01L21/56

CPC classification number: H01L25/072 ,  H01L21/52 ,  H01L21/563 ,  H01L21/565 ,  H01L23/295 ,  H01L23/3135 ,  H01L23/3142 ,  H01L23/552 ,  H01L23/562 ,  H01L24/05 ,  H01L24/06 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/181 ,  H05K3/282 ,  H05K2201/09872 ,  H05K2203/1377 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099

Abstract: A method for fabricating an electronic device package includes providing a carrier, disposing a semiconductor chip onto the carrier, the semiconductor chip having a contact pad on a main face thereof remote from the carrier, applying a contact element onto the contact pad, applying a dielectric layer on the carrier, the semiconductor chip, and the contact element, and applying an encapsulant onto the dielectric layer.

公开(公告)号：US20170273193A1

公开(公告)日：2017-09-21

申请号：US15615306

申请日：2017-06-06

Applicant: Eric Sari ,  Brian Stumm ,  Roger Plough

Inventor： Eric Sari ,  Brian Stumm ,  Roger Plough

IPC: H05K3/28 ,  G05B19/042 ,  B65G43/00 ,  B65G37/00

CPC classification number: G05B19/0421 ,  B65G43/00 ,  H05K3/0091 ,  H05K3/28 ,  H05K3/287 ,  H05K2201/09872 ,  H05K2203/1361 ,  H05K2203/1366

Abstract: A unit can include a power supply interface; a processor board power interface operatively coupled to the power supply interface where the processor board power interface operatively couples to and supplies power to a processor board; a serial interface that operatively couples to the processor board; a microcontroller operatively coupled to the serial interface; memory operatively coupled to the microcontroller; a motor control interface operatively coupled to the microcontroller; an optically isolated digital input interface operatively coupled to the microcontroller; a digital output interface operatively coupled to the microcontroller; and instructions stored in the memory and executable by the microcontroller to instruct the unit to receive digital input via the optically isolated digital input interface from a machine and to output motor control signals via the motor control interface to at least one motor of the machine.

公开(公告)号：US20170253765A1

公开(公告)日：2017-09-07

申请号：US15059665

申请日：2016-03-03

Applicant: Motorola Mobility LLC

Inventor： Richard W. Brotzman ,  Ernest Sirois ,  Deborah Paskiewicz

IPC: C09D183/04 ,  H05K1/18

CPC classification number: C09D183/04 ,  C08G77/24 ,  C08G77/80 ,  C09D183/08 ,  H05K1/18 ,  H05K3/282 ,  H05K3/285 ,  H05K2201/0162 ,  H05K2201/09872 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2203/095

Abstract: A polysiloxane film comprises Si—O bonds and has a thickness of 0.3 to 1.5 microns. Adjacent electrodes coated with the polysiloxane film have a leakage current of at most 0.01 mA at 10 V after contact with water. An electrode coated with the polysiloxane film has a contact resistance of at least 0.01 ohms at 1.0 mm of pogo pin compression under a 1.0 N load. The polysiloxane film provides IPx7 protection from ingress of water.