公开(公告)号：EP0218022B1

公开(公告)日：1992-07-29

申请号：EP86109827.5

申请日：1986-07-17

Applicant: OMRON TATEISI ELECTRONICS CO.

Inventor： Sagawa, Hiroyuki c/o Omron Tateisi Electronics Co. ,  Koga, Hirofumi c/o Omron Tateisi Electronics Co. ,  Agatahama, Shunichi c/o Omron Tateisi Electronics ,  Okumura, Hideyuki c/o Omron Tateisi Electronics ,  Matsuoka, Kazushige c/o Omron Tateisi Electronics ,  Sato, Ryuichi c/o Omron Tateisi Electronics

IPC: H05K1/18 ,  H05K3/30

CPC classification number: H05K3/305 ,  H01H50/14 ,  H01H2001/5888 ,  H01H2050/044 ,  H05K3/3426 ,  H05K3/381 ,  H05K2201/10053 ,  H05K2201/10568 ,  H05K2201/10628 ,  H05K2201/10689 ,  H05K2201/10969 ,  H05K2201/2036 ,  Y02P70/613

公开(公告)号：US11927431B1

公开(公告)日：2024-03-12

申请号：US16602843

申请日：2019-12-10

Applicant: Northrop Grumman Systems Corporation

Inventor： James D. Lucas ,  Eric M. McDonough

IPC: F42B3/12 ,  F42C11/04 ,  F42D1/05 ,  H01L23/498 ,  H05K1/18

CPC classification number: F42B3/124 ,  F42C11/04 ,  F42D1/05 ,  H01L23/49811 ,  H05K1/181 ,  F42B3/121 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10522 ,  H05K2201/10628 ,  H05K2201/10757

Abstract: A capacitive discharge unit (CDU) for detonating an explosive in response to a control signal comprises a set of CDU components, including an exploding foil initiator (EFI), a trigger circuit, a firing capacitor, and an insulated-gate bipolar transistor (IGBT) firing switch. In various embodiments the components are arranged on a board for mechanically and electrically supporting the components in an ordered arrangement along a CDU axis where the CDU having an axial length defined by the ordered arrangement of two or more of the EFI, the firing capacitor, and the IBGT firing switch, wherein the trigger circuit is offset from the CDU axis such that the trigger circuit does not contribute to the axial length.

公开(公告)号：US11888279B2

公开(公告)日：2024-01-30

申请号：US16540229

申请日：2019-08-14

Applicant: TE Connectivity Germany GmbH

Inventor： Andre Martin Dressel ,  Gunther Chritz ,  Jens Huber

IPC: H01R43/02 ,  H01R4/02 ,  H01R9/03 ,  H01R12/57 ,  H01R13/15 ,  H05K1/18 ,  H05K3/32

CPC classification number: H01R43/0221 ,  H01R4/02 ,  H01R9/03 ,  H01R12/57 ,  H01R13/15 ,  H05K1/181 ,  H05K3/328 ,  H05K2201/10628

Abstract: PROBLEM TO BE SOLVED: To provide a laser jointing method that joints two materials while imparting a sufficient strength thereto and minimizing heat influence. SOLUTION: The method overlaps first and second materials (V1, V2) on each other and irradiates the surface of the first material (V1) with a laser light (103) from the side of the first material (V1). When jointing both materials (V1, V2), the method intermittently irradiating an overlapped part of the first and second materials (V1, V2) with the laser light while moving the laser light (103) to form a welding bead (1) on the surface of the first material (V1), wherein the length of the welding bead (1) is formed gradually shorter.

公开(公告)号：US11744020B2

公开(公告)日：2023-08-29

申请号：US17537721

申请日：2021-11-30

Applicant: Texas Instruments Incorporated

Inventor： Kyle Brent Norell ,  Claude Albert Fernandez ,  Charles Allen DeVries

IPC: H05K3/22 ,  H05K1/18 ,  H05K1/11 ,  H05K3/28 ,  H05K3/34

CPC classification number: H05K1/181 ,  H05K1/111 ,  H05K3/222 ,  H05K3/284 ,  H05K3/288 ,  H05K3/3421 ,  H05K2201/1003 ,  H05K2201/10015 ,  H05K2201/1031 ,  H05K2201/10174 ,  H05K2201/10628 ,  H05K2203/1316

Abstract: An electronic device includes a package substrate, at least one integrated circuit (IC) die including a substrate having a semiconductor surface including circuitry electrically coupled to bond pads positioned onto contact pads on a top surface of a package substrate. At least one surface mount device (SMD) component including at least a first terminal and a second terminal is on the package substrate positioned lateral to the IC die. There is at least one SMD interconnect electrically connecting to at least one of the first terminal and the second terminal to the bond pads. The SMD interconnect includes a portion of a tie bar that extends to an outer edge of the electronic device.

公开(公告)号：US20230171894A1

公开(公告)日：2023-06-01

申请号：US17537721

申请日：2021-11-30

Applicant: Texas Instruments Incorporated

Inventor： Kyle Brent Norell ,  Claude Albert Fernandez ,  Charles Allen DeVries

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/22 ,  H05K3/28 ,  H05K3/34

CPC classification number: H05K1/181 ,  H05K1/111 ,  H05K3/222 ,  H05K3/284 ,  H05K3/288 ,  H05K3/3421 ,  H05K2201/1003 ,  H05K2201/10015 ,  H05K2201/10174 ,  H05K2201/1031 ,  H05K2201/10628 ,  H05K2203/1316

Abstract: An electronic device includes a package substrate, at least one integrated circuit (IC) die including a substrate having a semiconductor surface including circuitry electrically coupled to bond pads positioned onto contact pads on a top surface of a package substrate. At least one surface mount device (SMD) component including at least a first terminal and a second terminal is on the package substrate positioned lateral to the IC die. There is at least one SMD interconnect electrically connecting to at least one of the first terminal and the second terminal to the bond pads. The SMD interconnect includes a portion of a tie bar that extends to an outer edge of the electronic device.

公开(公告)号：US20190096582A1

公开(公告)日：2019-03-28

申请号：US16134805

申请日：2018-09-18

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Naoki SAITO

IPC: H01G4/248 ,  H01G4/30 ,  H05K1/18

CPC classification number: H01G4/248 ,  H01G4/1218 ,  H01G4/1227 ,  H01G4/1236 ,  H01G4/232 ,  H01G4/30 ,  H05K1/111 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10628 ,  H05K2201/10946

Abstract: In an exemplary embodiment, an electronic component with metal terminals includes a multilayer ceramic capacitor 10 having a pair of external electrodes 12, and a pair of metal terminals 20 each having, integrally, a plate-like supporting part 21 and a plate-like connecting part 22, and is constituted so that the supporting part 21 of each of the metal terminals 20 is joined to each of the external electrodes 12 in a manner allowing the connecting parts 22 to face each other, wherein two projecting parts 23 are provided on the connecting face of the connecting part 22 of each of the metal terminals 20.

公开(公告)号：US10057985B2

公开(公告)日：2018-08-21

申请号：US15617082

申请日：2017-06-08

Applicant: DENSO CORPORATION

Inventor： Kenji Ochi

IPC: H05K1/09 ,  H05K1/11 ,  H05K1/18 ,  H05K5/00

CPC classification number: H05K1/092 ,  H05K1/09 ,  H05K1/111 ,  H05K1/181 ,  H05K3/4007 ,  H05K5/0069 ,  H05K2201/0338 ,  H05K2201/10522 ,  H05K2201/10628 ,  H05K2201/10636

Abstract: A printed substrate includes a land that is to be soldered. The land includes a plating film that defines a surface of the land. The plating film includes a metal as a main constituent and a pi-acceptor molecule that is dispersed in the plating film. The pi-acceptor molecule has pi-acceptability and causes ligand field splitting equal to or greater than that of 2,2′-bipyridyl in spectrochemical series. A content of the pi-acceptor molecule in the plating film is equal to or greater than 0.1 weight percent, in terms of carbon atoms, with respect to the metal of the plating film.

公开(公告)号：US20170251913A1

公开(公告)日：2017-09-07

申请号：US15057767

申请日：2016-03-01

Applicant: KARL STORZ Endovision, Inc.

Inventor： Dashiell Birnkrant ,  Gerard Vadenais ,  Jordan He ,  Jason Curtis

IPC: A61B1/05 ,  H05K3/34 ,  A61B1/00 ,  H04N5/335

CPC classification number: A61B1/0011 ,  A61B1/051 ,  H04N5/2253 ,  H04N2005/2255 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10356 ,  H05K2201/10628 ,  H05K2201/10757

Abstract: An image sensor module includes a circuit board, image sensor, electronic component assembly, and cable assembly. The circuit board includes a center section located between two end sections. The end sections each extend away from the center section and define an interior area there between. The image sensor is secured to an outer face of the circuit board in the center section with sensor contact fingers being connected at the circuit board outer face in one or both end sections. The electronic component arrangement is mounted on an inner face of the circuit board in the center section. A number of wires of the cable assembly extend through an end gap between the circuit board end sections and are connected to the inner face of the circuit board so as to overlap with the sensor contact fingers along a module longitudinal axis.

公开(公告)号：US20170150595A1

公开(公告)日：2017-05-25

申请号：US14947437

申请日：2015-11-20

Applicant: Hamilton Sundstrand Corporation

Inventor： Tran Lin

IPC: H05K1/02 ,  H01L23/367 ,  H01L23/50 ,  H05K3/22 ,  H05K1/18 ,  H05K1/11 ,  G01R31/02 ,  G01R31/04 ,  H01L23/15 ,  H01L23/498

CPC classification number: H05K1/0268 ,  G01R31/026 ,  G01R31/046 ,  H01L23/15 ,  H01L23/3675 ,  H01L23/49827 ,  H01L23/50 ,  H05K1/0206 ,  H05K1/0215 ,  H05K1/111 ,  H05K1/181 ,  H05K3/225 ,  H05K3/3421 ,  H05K2201/094 ,  H05K2201/10628 ,  H05K2201/10689 ,  H05K2203/16 ,  H05K2203/162 ,  Y02P70/613

Abstract: A printed circuit board includes a body and a belly pad seated within with the body. The belly pad is electrically separated into a first pad and a second pad. The first pad and the second pad are arranged to be electrically connected to one another by an interconnect electrically connecting the belly pad to a conductive plane of an electrical component, thereby allowing continuity testing across an interface between the first pad and the interconnect.

公开(公告)号：US20170135226A1

公开(公告)日：2017-05-11

申请号：US14981961

申请日：2015-12-29

Applicant: FUJIAN JOY SOLAR TECHNOLOGY CORPORATION

Inventor： Guangyan Chen

IPC: H05K3/30 ,  F21S9/03 ,  H05K3/00 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K3/34 ,  F21S9/037 ,  F21Y2101/00 ,  H05K1/111 ,  H05K1/181 ,  H05K1/183 ,  H05K3/0044 ,  H05K3/301 ,  H05K3/3421 ,  H05K2201/09072 ,  H05K2201/09845 ,  H05K2201/10037 ,  H05K2201/10106 ,  H05K2201/10143 ,  H05K2201/10628 ,  H05K2201/10651 ,  H05K2203/0228 ,  H05K2203/04 ,  Y02P70/613

Abstract: A PCB adaptation for a solar lamp, characterized in that, at least one slot is set on the PCB, both sides of the slot comprises a pad, the pad connects to an inner circuit on the PCB, two leads of a leaded component is respectively soldered to the pad which is located on the both skies of the slot. By cutting a slot on the PCB in the present invention, auto surface-mount technology can be implemented to automatically solder the leaded component to the PCB. Low-cost leaded component and surface-mount technology are used in above technical solution, which can decrease the cost and increase the productivity and product quality.