Abstract:
A special electric component, such as a motor, an accumulator, or an electric subassembly, having at least one soldering pin for solder-joining the special electric component to a printed circuit board. The soldering pin has a connection end that comprises a front section at a free end of the soldering pin and a first section adjacent the front section. The front section has a width that is smaller than the width of the first section. A printed circuit board assembly and an electric device comprising at least one special electric component.
Abstract:
A printed circuit board (PCB) assembly includes a printed circuit board and first and second electrical terminals mounted thereto. The first electrical terminal comprises a body having a first end and a second end, a mounting member extending outwardly from the first end configured for insertion into an aperture formed in the PCB, shoulders defined adjacent the mounting member, and a first insertion tab extending outwardly from the body at the first end thereof. The second electrical terminal is mounted adjacent the first electrical terminal and comprises a body having a first end and a second end, a mounting portion extending outwardly from the first end configured for insertion into an aperture formed in the PCB, shoulders defined adjacent the mounting portion, and a second insertion tab extending outwardly from the body at the first end thereof. The first insertion tab and the second insertion tab are axially spaced apart.
Abstract:
An electronic circuit contains a circuit board with conducting tracks to which one or more electronic components with conducting contacts are positioned overlying portions of the conducting tracks and each such electronic component is held in place by a clamp that is in contact with the top surface of the electronic components so as to hold their conducting contacts in electrical contact with the conducting tracks of the circuit board. The clamp can include a resilient layer held between the top surface of electronic components and a rigid clamping sheet.
Abstract:
Structures, materials, and methods to control the spread of a solder material or other flowable conductive material in electronic and/or electromagnetic devices are provided.
Abstract:
Embodiments pin connections, electronic devices, and methods are shown that include pin configurations to reduce voids and pin tilting and other concerns during pin attach operations, such as attachment to a chip package pin grid array. Pin head are shown that include features such as convex surfaces, a number of legs, and channels in pin head surfaces.
Abstract:
The present invention discloses a fixing means for installing a plurality of output cables onto a circuit board and a method thereof. The method comprises steps of providing a fixing means that includes a fixing housing and interposing terminals, wherein the fixing housing is provided with inserting through holes which are located to correspond to output cable receiving holes on the circuit board, and respectively fixing the output cable inserting end(s) of the output cable(s) to be inserted into one of the output cable receiving holes together with one interposing terminal and forming electric connection; inserting each of the interposing terminals connected with the output cables into the corresponding inserting through hole in the fixing housing and fixing each of the interposing terminals in place; and installing the fixing means onto the circuit board, wherein each interposing terminal is inserted into the corresponding output cable receiving hole.
Abstract:
An electronic circuit contains a circuit board with conducting tracks to which one or more electronic components with conducting contacts are positioned overlying portions of the conducting tracks and each such electronic component is held in place by a clamp that covers and is contact with the top surface of the electronic components so as to hold their conducting contacts in electrical contact with the conducting tracks of the circuit board. The clamp can include a resilient layer held between the top surface of electronic components and a rigid clamping sheet.
Abstract:
A leadframe employed by a leadless package comprises a plurality of package units and an adhesive tape. Each of the package units has a die pad with a plurality of openings and a plurality of pins disposed in the plurality of openings. The adhesive tape is adhered to the surfaces of the plurality of package units and fixes the die pad and the plurality of pins.
Abstract:
A surface mount contact includes a conducting pin having a shank, a first end at one end of the shank and second end at the other end of the shank, a first annular flange extending around the periphery of the shank and spaced between the first end and the second end and a second annular flange extending around the periphery of the shank and spaced between the second end and the first annular flange, and a thermoplastic connection member joined to the second end of the conducting pin and spaced from the second annular flange at a predetermined distance so that there is a room for the user to judge the connection status and quality between the conducting pin and the thermoplastic connection member during surface mounting, assuring bonding stability.
Abstract:
A switch system for use with a printed circuit board is provided. The switch system includes: a switch base; an anti-overstress member or feature formed in the switch base; a plurality of retention legs formed in the base for retaining a printed circuit board, wherein a first via is in electrical communication with one of the plurality of retention legs; a spring-loaded contact formed in the base for contacting the anti-overstress feature, and wherein a second via is in electrical communication with the spring-loaded contact. A printed circuit board may be mounted in and attached to the plurality of retention legs.