中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

667 records (took 0.033 seconds)

    WIRING BOARD AND MOUNTING STRUCTURE THEREOF
    141.
    发明申请
    WIRING BOARD AND MOUNTING STRUCTURE THEREOF 有权
    接线板及其安装结构

    公开(公告)号：US20130153279A1

    公开(公告)日：2013-06-20

    申请号：US13819080

    申请日：2011-08-25

    Applicant: Katsura Hayashi

    Inventor： Katsura Hayashi

    IPC: H05K1/11 ,  H05K1/18

    CPC classification number: H05K1/115 ,  H05K1/18 ,  H05K3/4673 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/09827

    Abstract: A wiring board according to an embodiment includes an inorganic insulating layer provided with a via-hole which is a penetrating hole, and a via-conductor which is a penetrating conductor disposed inside the via-hole. The inorganic insulating layer includes first inorganic insulating particles connected to each other and second inorganic insulating particles that are larger in particle size than the first inorganic insulating particles and are connected to each other via the first inorganic insulating particles, and also has, at an inner wall of the via-hole V, a protrusion including at least part of the second inorganic insulating particle. The protrusion is covered with the via-conductor.

    Abstract translation: 根据实施例的布线板包括设置有穿孔的通孔的无机绝缘层和布置在通孔内的穿透导体的通孔导体。 无机绝缘层包括彼此连接的第一无机绝缘颗粒和与第一无机绝缘颗粒相比粒径大的第二无机绝缘颗粒，并且通过第一无机绝缘颗粒彼此连接，并且在内部 通孔V的壁，包括至少部分第二无机绝缘颗粒的突起。 突起被通孔导体覆盖。

    Liquid crystal polyester composition and electronic circuit board using the same
    142.
    发明授权
    Liquid crystal polyester composition and electronic circuit board using the same 有权
    液晶聚酯组合物和电子电路板使用相同

    公开(公告)号：US08465670B2

    公开(公告)日：2013-06-18

    申请号：US13387236

    申请日：2010-07-23

    Applicant: Takeshi Kondo ,  Sadanobu Iwase ,  Hironobu Iyama

    Inventor： Takeshi Kondo ,  Sadanobu Iwase ,  Hironobu Iyama

    IPC: C09K19/00 ,  C09K19/06 ,  C09K19/34 ,  C09K19/52 ,  H05K1/00

    CPC classification number: H05K1/056 ,  C08L67/03 ,  C09D167/03 ,  C09K19/3809 ,  H05K2201/0141 ,  H05K2201/0209 ,  H05K2201/0266 ,  Y10T428/10 ,  Y10T428/1036

    Abstract: To provide a liquid crystal polyester composition which is suited for use as a material for forming a liquid crystal polyester film having excellent thermal conductivity. Also, an excellent electronic circuit board is provided by using an insulating film obtained from the liquid crystal polyester composition. The liquid crystal polyester composition of the present invention is composed of a liquid crystal polyester, a solvent and a thermally conductive filler. The thermally conductive filler is contained in the amount of 50 to 90 volume % based on the total amount of the liquid crystal polyester and the thermally conductive filler, and the thermally conductive filler contains 0 to 20 volume % of a first thermally conductive filler having a volume average particle diameter of 0.1 μm or more and less than 1.0 μm, 5 to 40 volume % of a second thermally conductive filler having a volume average particle diameter of 1.0 μm or more and less than 5.0 μm and 40 to 90 volume % of a third thermally conductive filler having a volume average particle diameter of 5.0 μm or more and 30.0 μm or less.

    Abstract translation: 提供一种液晶聚酯组合物，其适用于形成具有优异导热性的液晶聚酯膜的材料。 此外，通过使用由液晶聚酯组合物获得的绝缘膜提供了优异的电子电路板。 本发明的液晶聚酯组合物由液晶聚酯，溶剂和导热填料组成。 导热性填料的含量相对于液晶聚酯和导热性填料的总量为50〜90体积％，导热性填料含有0〜20体积％的具有 体积平均粒径为0.1μm以上且小于1.0μm，5〜40体积％的体积平均粒径为1.0μm以上且小于5.0μm的第二导热性填料和40〜90体积％的 第三导热填料，其体积平均粒径为5.0μm以上且30.0μm以下。

    METAL NANOPARTICLES AND METHODS FOR PRODUCING AND USING SAME
    146.
    发明申请
    METAL NANOPARTICLES AND METHODS FOR PRODUCING AND USING SAME 有权
    金属纳米粒子及其制造方法和使用方法

    公开(公告)号：US20120100374A1

    公开(公告)日：2012-04-26

    申请号：US13335846

    申请日：2011-12-22

    Applicant: Alfred A. ZINN

    Inventor： Alfred A. ZINN

    IPC: B32B5/16 ,  B23K1/20 ,  B23K26/22 ,  B22F9/16 ,  B05D5/12 ,  B82Y40/00 ,  B82Y30/00

    CPC classification number: C23C24/08 ,  B22F1/0018 ,  B22F1/0062 ,  B22F1/025 ,  B22F9/24 ,  B82Y30/00 ,  H05K1/097 ,  H05K3/3484 ,  H05K3/3494 ,  H05K2201/0218 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2203/107 ,  Y10S977/777 ,  Y10T428/12028 ,  Y10T428/12049 ,  Y10T428/12181 ,  Y10T428/2991

    Abstract: A composition may have metal nanoparticles having a diameter of 20 nanometers or less and have a fusion temperature of less than about 220° C. A method of fabricating the metal nanoparticles may include preparing a solvent, adding a precursor with a metal to the solvent, adding a first surfactant, mixing in a reducing agent, and adding in a second surfactant to stop nanoparticle formation. Copper and/or aluminum nanoparticle compositions formed may be used for lead-free soldering of electronic components to circuit boards. A composition may include nanoparticles, which may have a copper nanocore, an amorphous aluminum shell and an organic surfactant coating. A composition may have copper or aluminum nanoparticles. About 30-50% of the copper or aluminum nanoparticles may have a diameter of 20 nanometers or less, and the remaining 70-50% of the copper or aluminum nanoparticles may have a diameter greater than 20 nanometers.

    Abstract translation: 组合物可以具有直径为20纳米或更小并且具有小于约220℃的熔融温度的金属纳米颗粒。制备金属纳米颗粒的方法可包括制备溶剂，向溶剂中加入前体与金属， 加入第一表面活性剂，在还原剂中混合，并加入第二表面活性剂以阻止纳米颗粒的形成。 形成的铜和/或铝纳米颗粒组合物可用于将电子部件无铅焊接到电路板。 组合物可以包括可以具有铜纳米孔，无定形铝壳和有机表面活性剂涂层的纳米颗粒。 组合物可以具有铜或铝纳米颗粒。 大约30-50％的铜或铝纳米颗粒可以具有20纳米或更小的直径，剩余的70-50％的铜或铝纳米颗粒可以具有大于20纳米的直径。

    METAL BASE CIRCUIT BOARD, LED, AND LED LIGHT SOURCE UNIT
    150.
    发明申请
    METAL BASE CIRCUIT BOARD, LED, AND LED LIGHT SOURCE UNIT 有权
    金属基板电路板，LED和LED光源单元

    公开(公告)号：US20090032295A1

    公开(公告)日：2009-02-05

    申请号：US11911914

    申请日：2006-04-19

    Applicant: Yoshihiko Okajima ,  Katsunori Yashima ,  Keiji Takano ,  Takuya Okada

    Inventor： Yoshihiko Okajima ,  Katsunori Yashima ,  Keiji Takano ,  Takuya Okada

    IPC: H05K1/00 ,  H05K1/16

    CPC classification number: H05K1/0203 ,  F21K9/00 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2924/13091 ,  H05K1/0233 ,  H05K1/028 ,  H05K1/056 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/0061 ,  H05K3/281 ,  H05K3/386 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/086 ,  H05K2201/09318 ,  H05K2201/0989 ,  H05K2201/10106 ,  H05K2203/0191 ,  H05K2203/063 ,  H05K2203/302 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: To provide a thin metal base circuit board which can be not only installed on a flat portion but also closely attached to a side or bottom surface of a case or to a stepped or curved portion and which is excellent in heat dissipation performance, electrical insulating performance and flexibility; a process for its production; and a hybrid integrated circuit, an LED module and a bright, ultra-long-life LED light source employing it.A metal base circuit board having insulating layers and conductive circuits or metal foils alternately laminated, characterized in that the thickness of each conductive circuit or metal foil is from 5 μm to 450 μm, each insulating layer is made of a cured product of a resin composition comprising an inorganic filler and a thermosetting resin, and the thickness of each insulating layer is from 9 μm to 300 μm; and a hybrid circuit board employing it. The metal base circuit board wherein a coverlay is provided, and a layer having a magnetic loss or a layer having a dielectric loss is laminated on the surface of the coverlay. A LED light source unit having at least one light-emitting diode (LED) mounted on the conductive circuit.

    Abstract translation: 为了提供一种薄的金属基底电路板，其不仅可以安装在平坦部分上，而且可以紧密地附接到壳体的侧面或底部表面，或者可以是阶梯状或弯曲部分，并且散热性能优异，电绝缘性能 灵活性; 一个生产过程; 和混合集成电路，LED模块和采用它的明亮，超长寿命的LED光源。 具有交替层叠绝缘层和导电电路或金属箔的金属基电路板，其特征在于，每个导电电路或金属箔的厚度为5μm至450μm，每个绝缘层由树脂组合物的固化产物 包括无机填料和热固性树脂，并且每个绝缘层的厚度为9μm至300μm; 和采用它的混合电路板。 提供覆盖层的金属基底电路板，具有磁损耗的层或具有介电损耗的层层叠在覆盖层的表面上。 一种LED光源单元，其具有安装在导电电路上的至少一个发光二极管（LED）。

Patent Agency Ranking