公开(公告)号：US06169325A

公开(公告)日：2001-01-02

申请号：US09210883

申请日：1998-12-15

Applicant: Shuichiro Azuma ,  Takayuki Okinaga ,  Takashi Emata ,  Tomoaki Kudaishi ,  Tamaki Wada ,  Kunihiko Nishi ,  Masachika Masuda ,  Toshio Sugano

Inventor： Shuichiro Azuma ,  Takayuki Okinaga ,  Takashi Emata ,  Tomoaki Kudaishi ,  Tamaki Wada ,  Kunihiko Nishi ,  Masachika Masuda ,  Toshio Sugano

IPC: H01L2302

CPC classification number: H05K3/303 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/0002 ,  H05K2201/09781 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2201/10568 ,  H05K2201/10681 ,  H05K2201/1078 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00

Abstract: To realize low-profile electronic apparatus (a memory module and a memory card) of a large storage size by mounting tape carrier packages (TCPs) with a memory chip encapsulated onto a wiring board in high density. To be more specific, a TCP is composed of an insulating tape, leads formed on one side thereof, a potting resin with a semiconductor chip encapsulated, and a pair of support leads arranged on two opposite short sides. The pair of support leads function to hold the TCP at a constant tilt angle relative to the mounting surface of the wiring board. By varying the length vertical to the mounting surface, the TCP can be mounted to a desired tilt angle.

Abstract translation: 通过将具有以高密度封装在布线板上的存储芯片的载带封装（TCP）安装在一起，实现了大型存储尺寸的小型电子设备（存储器模块和存储卡）。 更具体地说，TCP由绝缘带，在其一侧形成的引线，封装有半导体芯片的灌封树脂和布置在两个相对的短边上的一对支撑引线构成。 一对支撑引线用于将TCP保持在相对于布线板的安装表面的恒定倾斜角度。 通过改变垂直于安装表面的长度，可以将TCP安装到期望的倾斜角度。

公开(公告)号：US5920770A

公开(公告)日：1999-07-06

申请号：US837960

申请日：1997-04-14

Applicant: Masatoshi Yasunaga ,  Shin Nakao ,  Shinji Baba ,  Mitsuyasu Matsuo ,  Hironori Matsushima

Inventor： Masatoshi Yasunaga ,  Shin Nakao ,  Shinji Baba ,  Mitsuyasu Matsuo ,  Hironori Matsushima

IPC: H01L21/60 ,  H01L21/56 ,  H01L21/68 ,  H01L23/12 ,  H01L23/28 ,  H01L23/31 ,  H01L23/32 ,  H01L23/485 ,  H01L25/10 ,  H05K3/30 ,  H05K3/34 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L21/568 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L25/10 ,  H01L25/105 ,  H05K3/303 ,  H01L2224/0231 ,  H01L2224/0233 ,  H01L2224/02333 ,  H01L2224/02335 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/1131 ,  H01L2224/11332 ,  H01L2224/11334 ,  H01L2224/1147 ,  H01L2224/1191 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16105 ,  H01L2224/16108 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4813 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/83104 ,  H01L2225/1005 ,  H01L2225/1035 ,  H01L2225/107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K2201/09909 ,  H05K2201/10454 ,  H05K2201/10484 ,  H05K2201/2036 ,  H05K3/3442 ,  Y02P70/613

Abstract: Bonding pads are formed on a main surface of a semiconductor chip. An insulating layer having openings located on the bonding pads is formed on the main surface of the semiconductor chip. Base metal layers are formed on the bonding pads. A buffer coat film having a portion laid on a periphery of the base metal layer is formed on the insulating layer. Connection layers are formed on the base metal layers. First conductors are formed on the connection layers. A seal resin exposing only top surfaces of the first conductors is formed. Lumpish second conductors are formed on the top surfaces of the first conductor. Thereby, a resin seal semiconductor package can be made compact and it has improved electrical characteristics and high reliability.

Abstract translation: 接合焊盘形成在半导体芯片的主表面上。 在半导体芯片的主表面上形成具有位于接合焊盘上的开口的绝缘层。 在接合焊盘上形成基底金属层。 在绝缘层上形成具有放置在基底金属层周围的部分的缓冲涂膜。 连接层形成在基底金属层上。 第一导体形成在连接层上。 形成仅露出第一导体的顶表面的密封树脂。 在第一导体的顶表面上形成笨重的第二导体。 因此，可以使树脂密封半导体封装紧凑并且具有改善的电特性和高可靠性。

公开(公告)号：US5663901A

公开(公告)日：1997-09-02

申请号：US527254

申请日：1995-09-12

Applicant: Robert F. Wallace ,  Robert D. Norman ,  Eliyahou Harari

Inventor： Robert F. Wallace ,  Robert D. Norman ,  Eliyahou Harari

IPC: G06F3/06 ,  G06F12/00 ,  G06F13/00 ,  G06F13/38 ,  G06K7/00 ,  G11C5/00 ,  G11C5/02 ,  G11C7/00 ,  G11C16/04 ,  G11C16/06 ,  H05K1/14

CPC classification number: G06F3/0601 ,  G06F13/385 ,  G06K19/07732 ,  G06K19/07741 ,  G06K19/07743 ,  G06K7/0047 ,  G11C5/04 ,  H05K1/141 ,  H05K7/1431 ,  G06F2003/0694 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83385 ,  H05K2201/10159 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2203/1572 ,  H05K3/3421

Abstract: A very small computer memory card is densely packed with a large number of flash EEPROM integrated circuit chips. A computer memory system provides for the ability to removably connect one or more of such cards with a common controller circuit that interfaces between the memory cards and a standard computer system bus. Alternately, each card can be provided with the necessary controller circuitry and thus is connectable directly to the computer system bus. An electronic system is described for a memory system and its controller within a single memory card. In a preferred physical arrangement, the cards utilize a main circuit board with a plurality of sub-boards attached thereto on both sides, each sub-board carrying several integrated circuit chips.

Abstract translation: 一个非常小的电脑记忆卡密集地装有大量的闪存EEPROM集成电路芯片。 计算机存储器系统提供了将一个或多个这样的卡可拆卸地连接到存储卡与标准计算机系统总线之间接口的公共控制器电路的能力。 或者，每个卡可以提供必要的控制器电路，并且因此可以直接连接到计算机系统总线。 描述了一种用于存储系统及其控制器在单个存储卡内的电子系统。 在优选的物理布置中，卡片利用其两侧附着有多个子板的主电路板，每个子板承载多个集成电路芯片。

公开(公告)号：US5119240A

公开(公告)日：1992-06-02

申请号：US564732

申请日：1990-08-08

Applicant: Francois Marion ,  Michel Ravetto ,  Jean-Luc Tissot

Inventor： Francois Marion ,  Michel Ravetto ,  Jean-Luc Tissot

IPC: F16B5/08 ,  B23P21/00 ,  F16B11/00 ,  G02B7/00 ,  G02B7/182 ,  H01L21/60 ,  H05K3/34

CPC classification number: H01L24/81 ,  G02B7/00 ,  G02B7/182 ,  H05K3/3436 ,  H01L2224/81801 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K2201/094 ,  H05K2201/10484 ,  H05K2203/0465 ,  H05K3/3484 ,  Y02P70/613 ,  Y10T403/479

Abstract: An assembly of parts forming an angle between facing surfaces of the parts and a process for producing an assembly is described. The parts (2, 4) are provided with contact elements or pads (6, 8, 10, 12) for connection to one another by means of a relatively low melting point metallic soldering material. The surface of each of the pads is wettable by the low melting point metallic material in the molten state, while areas surrounding the pads are not wettable. The contact pads of one of the parts are covered with flat coils or wafers (10, 12) of the low melting point metallic material. The wafers have the same thickness, but different volumes. The contact pads of the other part are placed on the corresponding wafers. The wafers' thickness, volumes, and spacing are chosen so that when the wafers are heated to the molten state and form truncated spherical drops due to surface tension, the parts form between them a predetermined angle. The invention has particular application to the manufacture of mirrors.

Abstract translation: 描述了在部件的相对表面之间形成角度的部件的组件和用于制造组件的工艺。 部分（2,4）设置有用于通过相对低熔点的金属焊接材料彼此连接的接触元件或焊盘（6,8,10,12）。 每个焊盘的表面在熔融状态下被低熔点金属材料润湿，而焊盘周围的区域不能被润湿。 其中一个部分的接触垫被低熔点金属材料的扁平线圈或晶片（10,12）覆盖。 晶片具有相同的厚度，但是具有不同的体积。 另一部分的接触垫放置在相应的晶片上。 选择晶片的厚度，体积和间距，使得当晶片被加热到熔融状态并由于表面张力而形成截头球形液滴时，它们之间形成预定角度。 本发明特别适用于制造镜子。

公开(公告)号：US4387413A

公开(公告)日：1983-06-07

申请号：US220127

申请日：1980-12-24

Applicant: Patrick D. Griffis

Inventor： Patrick D. Griffis

IPC: H01L23/31 ,  H01L23/36 ,  H01L23/40 ,  H05K1/02 ,  H05K3/30 ,  H05K7/20

CPC classification number: H05K1/0203 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/4006 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2924/0002 ,  H05K2201/066 ,  H05K2201/10166 ,  H05K2201/10454 ,  H05K2201/10484 ,  H05K3/301

Abstract: A semiconductor package is provided in which the semiconductor element is bonded to a slab of metal and is encapsulated in a body of insulating epoxy. Lead terminals are connected to the semiconductor element within the body and extend out from one end of the body. The metal slab extends out from the body from the same end as the lead terminals and in a plane which is parallel to that of the terminals, thereby forming a heat sink tab for the device. The package may be rigidly mounted on a printed circuit board by inserting the lead terminals and the heat sink tab into respective holes in a printed circuit board and soldering the terminals and tab to copper foil on the board. The solder connection of the heat sink tab to the copper foil provides an excellent thermal contact between the tab and the foil, in addition to providing a rigid support for the device.

Abstract translation: 提供一种半导体封装，其中半导体元件被结合到金属板上，并被封装在绝缘环氧树脂体中。 引线端子连接到体内的半导体元件并从主体的一端延伸出来。 金属板从主体从与引线端子相同的端部延伸出并且在与端子的平面平行的平面中延伸，从而形成用于该装置的散热片。 通过将引线端子和散热片插入印刷电路板的相应孔中并将端子和突片焊接到电路板上的铜箔上，将封装刚性地安装在印刷电路板上。 除了为器件提供刚性支撑之外，散热片与铜箔的焊接连接提供了突片和箔之间的极好的热接触。

公开(公告)号：JP5011303B2

公开(公告)日：2012-08-29

申请号：JP2008536180

申请日：2006-10-13

Applicant: コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ

Inventor： マウリシ エイ エイチ ドネルス

IPC: H01R31/06 ,  H01L33/64 ,  H05K1/18

CPC classification number: H05K3/301 ,  H05K3/3442 ,  H05K2201/10106 ,  H05K2201/10325 ,  H05K2201/10484 ,  H05K2201/10636 ,  H05K2201/10651 ,  Y02P70/611 ,  Y10T29/4913

公开(公告)号：JP2010219241A

公开(公告)日：2010-09-30

申请号：JP2009063352

申请日：2009-03-16

Applicant: Fujitsu Ltd ,  富士通株式会社

Inventor： KITAGAWA TAKAHIRO

IPC: H05K3/34

CPC classification number: H05K3/341 ,  H05K3/3442 ,  H05K3/3463 ,  H05K3/3478 ,  H05K3/3484 ,  H05K2201/10469 ,  H05K2201/10484 ,  H05K2201/10969 ,  H05K2203/0415 ,  H05K2203/1178 ,  Y02P70/613

Abstract: PROBLEM TO BE SOLVED: To provide a method of soldering an electronic component improving the wettability of solder while suppressing the residual quantity of voids, and to provide the electronic component. SOLUTION: In the method for soldering the electronic component, the upper parts of board electrodes 36a to 36c for a printed-circuit board 30 are supplied with solder 56a to 56c. In the method for soldering the electronic component, the electronic component 10 is loaded on the printed-circuit board 30 under the state supporting one side by a solder chip 70 having a melting property by a heat and directly supporting an opposed one side to the one side to the printed-circuit board 30 in the electronic component 10 between the board electrodes 36a to 36c and component electrodes 16a to 16c of the electronic component 10 mounted on the board electrodes 36a to 36c, and solder 56a to 56c and the solder chip 70 are heated. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种焊接电子部件的方法，其中提高焊料的润湿性同时抑制空隙的剩余量，并提供电子部件。 解决方案：在用于焊接电子部件的方法中，用于印刷电路板30的板电极36a至36c的上部被供给焊料56a至56c。 在电子部件的焊接方法中，电子部件10在由热熔融性的焊料芯片70支撑一侧的状态下被载置在印刷电路板30上，并且将相对的一侧直接支撑在一侧 一侧安装在电路板电极36a至36c之间的电子部件10中的印刷电路板30和安装在基板电极36a至36c上的电子部件10的部件电极16a至16c，以及焊料56a至56c和焊料芯片70 被加热。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2009226923A

公开(公告)日：2009-10-08

申请号：JP2008272808

申请日：2008-10-23

Applicant: Seiko Epson Corp ,  セイコーエプソン株式会社

Inventor： OKUBO KATSUHIRO

IPC: B41J2/045 ,  B05C5/00 ,  B41J2/055

CPC classification number: B41J2/14233 ,  B41J2002/14491 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/09063 ,  H05K2201/09781 ,  H05K2201/10484

Abstract: PROBLEM TO BE SOLVED: To provide a liquid jet head improving electrical and mechanical adhesion force between a wiring board and an electrode and reducing cost, and a liquid jet apparatus and an actuator device.
SOLUTION: The liquid jet head includes a passage-forming member 22 provided with a pressure generating chamber communicating with a nozzle opening for jetting liquid; a piezoelectric element provided on one face side of the passage-forming member 22 to cause pressure change in the pressure generating chamber; a terminal part 46 provided on the one face side of the passage forming member and conductive to the piezoelectric element; the wiring board 50 provided with a wiring layer 51 supplying a driving signal for driving the piezoelectric element; and an adhesive layer 55 formed of an anisotropic conductive material to make the wiring layer 51 and the terminal part 46 conductive to each other and to join the passage-forming member 22 to the wiring board 50. At least one of the faces of the passage-forming member 22 and wiring board 50 in an area provided with the adhesive layer 55 includes a gap layer 56 that is electrically discontinuous with the terminal part 46 and the wiring layer 51.
COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种提高布线板和电极之间的电气和机械粘附力并降低成本的液体喷射头，以及液体喷射装置和致动器装置。 解决方案：液体喷射头包括通道形成构件22，该通道形成构件22设置有与用于喷射液体的喷嘴开口连通的压力发生室; 设置在通道形成构件22的一个表面侧上以在压力发生室中引起压力变化的压电元件; 设置在通路形成部件的一个面侧并与压电元件导通的端子部46; 布线板50设置有提供用于驱动压电元件的驱动信号的布线层51; 以及由各向异性导电材料形成的粘合剂层55，以使布线层51和端子部分46彼此导电并将通道形成构件22接合到布线板50上。通道的至少一个面 在设置有粘合剂层55的区域中的成形构件22和布线板50包括与端子部46和布线层51电连接的间隙层56.版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2009512979A

公开(公告)日：2009-03-26

申请号：JP2008536180

申请日：2006-10-13

Applicant: コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ

Inventor： マウリシ エイ エイチ ドネルス

IPC: H01R31/06 ,  H01L33/00 ,  H05K1/18

CPC classification number: H05K3/301 ,  H05K3/3442 ,  H05K2201/10106 ,  H05K2201/10325 ,  H05K2201/10484 ,  H05K2201/10636 ,  H05K2201/10651 ,  Y02P70/611 ,  Y10T29/4913

Abstract: 基板１１に取り付けられ、表面実装デバイス１５のための支持体としての役割を果たすのに適している支持コンポーネント１は、前記基板１１に取り付けられるのに適している第１面３と、前記表面実装デバイス１５を支持するのに適している第２面とを持つボディ２を有する。 前記第２面４は、前記第１面３に対して傾けられている。 前記支持コンポーネント１は、前記基板１１の第１基板導体１２と、前記表面実装デバイス１５の第１電極１６との間の電気的接触を形成するのに適している第１支持コンポーネント導体６を更に有する。 表面実装デバイス１５を傾けられたようにして基板１１に取り付ける方法においては、前記支持コンポーネント１の上に前記表面実装デバイス１５を備える前記支持コンポーネント１が、前記基板１１に取り付けられる。

公开(公告)号：JP2006147931A

公开(公告)日：2006-06-08

申请号：JP2004337597

申请日：2004-11-22

Applicant: Fujitsu Ltd ,  富士通株式会社

Inventor： KURODA YASUHIDE

IPC: H01G4/38

CPC classification number: H01G4/38 ,  H01L27/016 ,  H05K1/0231 ,  H05K1/0237 ,  H05K2201/0382 ,  H05K2201/1028 ,  H05K2201/10484 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2203/0195 ,  H05K2203/041 ,  Y02P70/611

Abstract: PROBLEM TO BE SOLVED: To provide an electronic circuit including a capacitor for cutting a DC component capable of cutting the DC component while suppressing deterioration of frequency characteristics over a wide band, and to provide its manufacturing method. SOLUTION: The electronic circuit includes a first capacitor 60 for cutting the DC component of a low frequency band when a frequency band is two-divided into the low frequency band and a high frequency band, and a plurality of second capacitors 20 and 30 provided for each of narrow bands for cutting the DC component of each narrow band when the high frequency band is further divided into the narrow bands. The first capacitor 60 and the plurality of second capacitors 20 and 30 are connected respectively in parallel. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 解决的问题：提供一种电子电路，包括用于切断能够切断直流成分的直流分量的电容器，同时抑制宽带上的频率特性的劣化，并提供其制造方法。 解决方案：电子电路包括：第一电容器60，用于当频带被分成低频带和高频带时将用于切割低频带的直流分量;以及多个第二电容器20和 30，当高频带进一步被划分成窄带时，为每个窄带切割每个窄带的DC分量。 第一电容器60和多个第二电容器20和30分别并联连接。 版权所有（C）2006，JPO＆NCIPI