公开(公告)号：EP1044082A1

公开(公告)日：2000-10-18

申请号：EP98956935.5

申请日：1998-11-19

Applicant: Leica Geosystems AG ,  MTA Automation AG

Inventor： REMY DE GRAFFENRIED, Christian

IPC: B23K1/005

CPC classification number: B23K1/0056 ,  B23K2201/40 ,  G02B6/4238 ,  G02B7/00 ,  H05K3/341 ,  H05K3/3494 ,  H05K2201/0373 ,  H05K2201/10772 ,  H05K2201/10969 ,  H05K2203/101 ,  Y02P70/613 ,  Y10T29/4913

Abstract: The invention relates to a method for fixing an especially modularly mounted, miniaturised component (2) onto a base plate (1) by means of a soldered joint. One side (4) of the component (2) is coated with a layer (5) of soldering material and the base plate (1) is coated at least partially with a layer of metal (6, 6', 6''). The component (2) is positioned above the base plate (1) with the metal layer and the layer of soldering material (5) facing each other without touching, at a vertical distance from each other. Heat energy is then supplied from the side of the base plate (1) in order to melt the soldering material of the soldering material layer (5) on the side (4) of the component (2) until a drop is formed. The component (2) and the base plate (1) are mutually fixed to each other when the drop of soldering material (5') fills the gap between them.

公开(公告)号：EP0749674B1

公开(公告)日：1999-01-20

申请号：EP95913541.9

申请日：1995-03-09

Applicant: THE PANDA PROJECT

Inventor： CRANE, Stanford, W., Jr. ,  PORTUONDO, Maria, M.

IPC: H05K3/34 ,  H05K3/40

CPC classification number: H01L23/49861 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/181 ,  H05K1/112 ,  H05K3/308 ,  H05K3/321 ,  H05K3/3421 ,  H05K3/4623 ,  H05K2201/09472 ,  H05K2201/09536 ,  H05K2201/09645 ,  H05K2201/10189 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10704 ,  H05K2201/10772 ,  H05K2201/10893 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An apparatus comprising a multi-layer substrate (10) including a plurality of layers of insulative material (12), at least one well (15) formed in at least one of the layers, the well (15) extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and an electrically conductive component (13) formed within the well (15) on the inner surface of the multi-layer substrate; and a device having at least one electrically conductive lead or wire (11) extending into the well (15) and being in direct physical contact with the electrically conductive component (13) formed on the inner surface of the multi-layer substrate. Also, a method of manufacturing an apparatus comprising the steps of forming a multi-layer substrate (10) including a plurality of layers of insulative material (12), at least one well (15) formed in at least one of the layers, the well (15) extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and an electrically conductive component (13) formed within the well (15) on the inner surface of the multi-layer substrate; and extending at least one electrically conductive lead or wire (11) from a device into the well (15) such that the lead or wire is in direct physical contact with the electrically conductive component (13) formed on the inner surface of the multi-layer substrate.

Abstract translation: 半导体管芯封装（30）包括多个导电引线（11）和用于承载电信号的多层结构（10），所述多层结构（10）包括多层绝缘材料（12a-12d） ），每个层包括在该层的相对侧上的第一表面和第二表面。 每个引线（11）延伸到完全延伸通过至少一个层的对应的阱（15），并且在一个层的一个表面上底部，阱（15）不通过该表面延伸并且电耦合 涉及形成在其对应的井（15）内的导电接合结构（13）。

公开(公告)号：EP0783775A1

公开(公告)日：1997-07-16

申请号：EP95937430.0

申请日：1995-09-28

Applicant: NORTH AMERICAN SPECIALITIES CORPORATION

Inventor： SEIDLER, Jack ,  POLLOCK, Leonard, J.

IPC: H01R12 ,  H01R43 ,  H05K3 ,  H01R4

CPC classification number: H01R12/57 ,  H01R4/02 ,  H01R43/0256 ,  H05K3/3405 ,  H05K3/3426 ,  H05K3/3478 ,  H05K2201/10386 ,  H05K2201/10772 ,  H05K2201/10984 ,  Y02P70/613

Abstract: A solder-bearing metallic (114), and methods of fabricating and using it, where the lead is formed with a solder-retaining portion (125) having a cross-sectional profile with undercuts, which may be in a V-shape or flat, where solder (133) surrounds said solder-retaining portion and undercuts, and extends outwardly from the lead while leaving a portion of the lead uncovered by solder to permit the lead metal to form direct contact with a susbstrate or other conductive pad.

公开(公告)号：EP0749674A1

公开(公告)日：1996-12-27

申请号：EP95913541.0

申请日：1995-03-09

Applicant: THE PANDA PROJECT

Inventor： CRANE, Stanford, W., Jr. ,  PORTUONDO, Maria, M.

IPC: H05K1 ,  H01L23 ,  H05K3

CPC classification number: H01L23/49861 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/181 ,  H05K1/112 ,  H05K3/308 ,  H05K3/321 ,  H05K3/3421 ,  H05K3/4623 ,  H05K2201/09472 ,  H05K2201/09536 ,  H05K2201/09645 ,  H05K2201/10189 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10704 ,  H05K2201/10772 ,  H05K2201/10893 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An apparatus comprising a multi-layer substrate (10) including a plurality of layers of insulative material (12), at least one well (15) formed in at least one of the layers, the well (15) extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and an electrically conductive component (13) formed within the well (15) on the inner surface of the multi-layer substrate; and a device having at least one electrically conductive lead or wire (11) extending into the well (15) and being in direct physical contact with the electrically conductive component (13) formed on the inner surface of the multi-layer substrate. Also, a method of manufacturing an apparatus comprising the steps of forming a multi-layer substrate (10) including a plurality of layers of insulative material (12), at least one well (15) formed in at least one of the layers, the well (15) extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and an electrically conductive component (13) formed within the well (15) on the inner surface of the multi-layer substrate; and extending at least one electrically conductive lead or wire (11) from a device into the well (15) such that the lead or wire is in direct physical contact with the electrically conductive component (13) formed on the inner surface of the multi-layer substrate.

公开(公告)号：TWI258852B

公开(公告)日：2006-07-21

申请号：TW093117884

申请日：2004-06-21

Applicant: 三洋電機股份有限公司 SANYO ELECTRIC CO., LTD. ,  關東三洋半導體股份有限公司 KANTO SANYO SEMICONDUCTORS CO., LTD.

Inventor： 龜山工次郎 KAMEYAMA, KOUJIRO ,  三田清志 MITA, KIYOSHI

IPC: H01L

CPC classification number: H01L21/6835 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2221/68331 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/181 ,  H05K3/3426 ,  H05K3/3442 ,  H05K2201/09154 ,  H05K2201/10772 ,  H05K2201/10931 ,  Y02P70/613 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

Abstract: 本發明提供一種半導體裝置及其製造方法，其目的在於使熔接於外部端子之接合材的辨識性得以提升。該半導體裝置中，半導體元件和電性連接於上述半導體元件的電極，係藉由具有絕緣性的封裝材封裝，且令上述電極露出於藉著外部安裝基板和接合材接合的安裝面周圍，其中，上述電極所形成之形狀，在上述安裝面藉著上述接合材而接合於上述安裝基板的狀態下，可從包圍上述安裝面的側面側辨識上述接合材。

Abstract in simplified Chinese: 本发明提供一种半导体设备及其制造方法，其目的在于使熔接于外部端子之接合材的辨识性得以提升。该半导体设备中，半导体组件和电性连接于上述半导体组件的电极，系借由具有绝缘性的封装材封装，且令上述电极露出于借着外部安装基板和接合材接合的安装面周围，其中，上述电极所形成之形状，在上述安装面借着上述接合材而接合于上述安装基板的状态下，可从包围上述安装面的侧面侧辨识上述接合材。

公开(公告)号：KR101630065B1

公开(公告)日：2016-06-13

申请号：KR1020140127168

申请日：2014-09-23

Applicant: 삼성전기주식회사

Inventor： 박흥길 ,  전경진 ,  윤대형 ,  이순주

IPC: H01G4/232 ,  H01G4/30 ,  H01G2/06

CPC classification number: H01G4/30 ,  H01G2/06 ,  H01G4/012 ,  H01G4/232 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10772 ,  H05K2201/10818 ,  H05K2201/10946 ,  H05K2201/2045 ,  Y02P70/611 ,  Y02P70/613

Abstract: 본발명은, 전면부와상기전면부로부터연장된밴드부를포함하는외부전극을포함하는적층세라믹커패시터; 상기외부전극의전면부와밴드부의하면중 일부를둘러싸며, 하부에 'ㄷ'자형상의홈부를가지는단자전극; 및상기외부전극과상기단자전극을연결하는도전성접착층; 을포함하는적층세라믹전자부품및 그실장기판을제공한다.

公开(公告)号：KR101003684B1

公开(公告)日：2010-12-23

申请号：KR1020080064245

申请日：2008-07-03

Applicant: 삼성전기주식회사

Inventor： 오흥재 ,  최진원

IPC: H01L23/48

CPC classification number: H05K3/3426 ,  H01L23/49811 ,  H01L2924/0002 ,  H05K2201/10318 ,  H05K2201/10772 ,  Y02P70/613 ,  H01L2924/00

Abstract: 본 발명은 패키지 기판용 리드핀에 관한 것으로, 중앙부로 갈수록 직경이 커지며, 육각형의 수직단면 형상을 가지는 원반형 헤드; 또는 원통형으로 구성되어, 상부 및 하부면에 다수개의 홈이 형성된 헤드; 및 상기 헤드의 상부 앙부에 돌출된 접속핀;을 포함하는 패키지 기판용 리드핀에 관한 것이다.
패키지 기판, 리드핀, 헤드, 솔더 페이스트

公开(公告)号：KR1020050009183A

公开(公告)日：2005-01-24

申请号：KR1020040054597

申请日：2004-07-14

Applicant: 산요덴키가부시키가이샤 ,  간또 산요 세미컨덕터즈 가부시끼가이샤

Inventor： 가메야마고우지로 ,  미따기요시

IPC: H01L23/48

CPC classification number: H01L21/6835 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2221/68331 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/181 ,  H05K3/3426 ,  H05K3/3442 ,  H05K2201/09154 ,  H05K2201/10772 ,  H05K2201/10931 ,  Y02P70/613 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

Abstract: PURPOSE: A semiconductor device and a fabricating method thereof are provided to determine a joining condition of external terminals and lands by enhancing visual identifiability of a joining agent deposited on the external terminals. CONSTITUTION: A semiconductor device includes a semiconductor element and a plurality of electrodes(104) electrically connected to the semiconductor element. The semiconductor element and the electrodes are sealed by a sealing agent(107) having an insulating property. The electrodes are exposed around a mounting surface that is joined via a joining agent(300) to an external mounting circuit board. The electrodes are shaped so that the joining agent is visually identifiable from side surfaces surrounding the mounting surface when the mounting surface is joined via the joining agent to the mounting circuit board.

Abstract translation: 目的：提供一种半导体器件及其制造方法，用于通过增加沉积在外部端子上的接合剂的视觉可识别性来确定外部端子和焊盘的接合状态。 构成：半导体器件包括半导体元件和与半导体元件电连接的多个电极（104）。 半导体元件和电极由具有绝缘性的密封剂（107）密封。 电极围绕通过接合剂（300）连接到外部安装电路板的安装表面露出。 电极被成形为使得当安装表面经由接合剂连接到安装电路板时，接合剂可以从围绕安装表面的侧表面可视地识别。

公开(公告)号：KR1019920000076B1

公开(公告)日：1992-01-06

申请号：KR1019880010081

申请日：1988-08-08

Applicant: 가부시끼가이샤 도시바 ,  도시바 마이크로일렉트로닉스 가부시키가이샤

Inventor： 후지츠다카오

IPC: H01L23/50

CPC classification number: H05K3/363 ,  H01L23/142 ,  H01L23/49534 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L24/72 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01082 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K1/056 ,  H05K1/141 ,  H05K3/0061 ,  H05K2201/091 ,  H05K2201/10424 ,  H05K2201/10681 ,  H05K2201/10772 ,  H05K2203/302 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: 내용 없음.

公开(公告)号：KR1020160035494A

公开(公告)日：2016-03-31

申请号：KR1020140127168

申请日：2014-09-23

Applicant: 삼성전기주식회사

Inventor： 박흥길 ,  전경진 ,  윤대형 ,  이순주

IPC: H01G4/232 ,  H01G4/30 ,  H01G2/06

CPC classification number: H01G4/30 ,  H01G2/06 ,  H01G4/012 ,  H01G4/232 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10772 ,  H05K2201/10818 ,  H05K2201/10946 ,  H05K2201/2045 ,  Y02P70/611 ,  Y02P70/613

Abstract: 본발명은, 전면부와상기전면부로부터연장된밴드부를포함하는외부전극을포함하는적층세라믹커패시터; 상기외부전극의전면부와밴드부의하면중 일부를둘러싸며, 하부에 'ㄷ'자형상의홈부를가지는단자전극; 및상기외부전극과상기단자전극을연결하는도전성접착층; 을포함하는적층세라믹전자부품및 그실장기판을제공한다.

Abstract translation: 提供了多层陶瓷电子部件和具有该多层陶瓷电子部件的基板。 多层陶瓷电子部件包括：多层陶瓷电容器，其包括外部电极，所述外部电极包括前部和从所述前部延伸的带部分; 围绕外部电极的带部分的前部的一部分和下表面的一部分并且在其下部形成有“”形槽部分的端子电极; 以及将外部电极和端子电极彼此连接的导电性粘合剂层。