公开(公告)号：WO1990011629A1

公开(公告)日：1990-10-04

申请号：PCT/US1989001401

申请日：1989-04-03

Applicant: CRAY RESEARCH, INC.

Inventor： CRAY RESEARCH, INC. ,  KRAJEWSKI, Nicholas, J. ,  JOHNSON, David, J. ,  KUNSTMANN, Arthur, O.

IPC: H01R04/18

CPC classification number: H01L24/16 ,  C22F1/006 ,  H01L21/4853 ,  H01L24/11 ,  H01L24/45 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4943 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85201 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2225/06593 ,  H01L2225/06596 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01204 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/3011 ,  H01R4/01 ,  H01R12/523 ,  H05K3/308 ,  H05K3/328 ,  H05K3/36 ,  H05K3/368 ,  H05K2201/096 ,  H05K2201/1059 ,  H05K2201/10825 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K2203/0495 ,  Y10T29/49126 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/01004 ,  H01L2924/013

Abstract: A method and apparatus for interconnecting circuit board assemblies using memory metal wires mechanically inserted into through-plated holes. The invention has its application in the interconnection of stacked circuit board assemblies where kinked memory metal wires are stretched so the wires are substantially straight; inserted into axially aligned through-plated holes of circuit boards; and released so that the memory metal wires reform their original kinked shaped within the through-plated holes, forming an electrical connection between the circuit boards. Memory metal alloys are used in the construction of the kinked memory metal wires to take advantage of the pseudoelastic behavior of the alloys in the austenitic phase below the forming temperature range.

Abstract translation: 一种使用机械地插入通孔的存储金属线互连电路板组件的方法和装置。 本发明适用于堆叠电路板组件的互连，其中扭曲的存储金属线被拉伸，使得电线基本上是直的; 插入到电路板的轴向对齐的通孔中; 并释放，使得记忆金属线在穿透孔内改造其原来的扭结形状，在电路板之间形成电连接。 记忆金属合金用于扭结记忆金属丝的构造，以利用低于成形温度范围的奥氏体相中合金的假弹性行为。

公开(公告)号：WO1988009599A2

公开(公告)日：1988-12-01

申请号：PCT/US1988001668

申请日：1988-05-16

Applicant: CRAY RESEARCH, INC.

Inventor： CRAY RESEARCH, INC. ,  CRAY, Seymour, R. ,  KRAJEWSKY, Nicholas, J.

IPC: H05K03/32

CPC classification number: H01L24/11 ,  H01L21/4853 ,  H01L2224/05644 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/45144 ,  H01L2224/4943 ,  H01L2224/78301 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2225/06593 ,  H01L2225/06596 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12033 ,  H01L2924/14 ,  H01R12/523 ,  H05K3/308 ,  H05K3/328 ,  H05K3/368 ,  H05K2201/096 ,  H05K2201/1059 ,  H05K2201/10825 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K2203/0495 ,  Y10T29/49135 ,  Y10T29/4914 ,  Y10T29/49153 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/48

Abstract: A method and apparatus for interconnecting electronic circuits (104) using nearly pure soft annealed gold mechanically compressed within through-plated holes (111). The invention has its application in attaching integrated circuit dice (104) directly to circuit boards (110) by ball bonding gold wires (101) to the bonding pads (105) of the integrated circuit dice (104) in a substantially perpendicular relationship to the surfaces of the dice (104) and inserting the gold leads (101) into through-plated holes (111) of circuit boards (110) which provide an electrical and a mechanical connection once the leads (101) are compressed within the through-plated holes (111). The present invention also finds its application in the interconnection of sandwiched circuit board assemblies (200) where soft gold lead wires are inserted into axially aligned through-plated holes of the circuit boards (212, 214, 216, 217, 219, 221) and compressed so that the gold lead wires compress and buckle within the through-plated holes, forming an electrical connection between the circuit boards (212, 214, 216, 217, 219, 221).

公开(公告)号：TWI492352B

公开(公告)日：2015-07-11

申请号：TW097123934

申请日：2008-06-26

Applicant: 精工電子有限公司 ,  SEIKO INSTRUMENTS INC.

Inventor： 吉野朋之 ,  YOSHINO, TOMOYUKI

IPC: H01L23/495 ,  H01L21/60

CPC classification number: H05K3/3426 ,  H01L23/49582 ,  H01L2924/0002 ,  H05K2201/10689 ,  H05K2201/10795 ,  H05K2201/10909 ,  Y02P70/613 ,  H01L2924/00

公开(公告)号：TW249303B

公开(公告)日：1995-06-11

申请号：TW083111076

申请日：1994-11-29

Applicant: 連接器系統科技公司

Inventor： 亞可夫.貝羅波斯凱

IPC: H01R

CPC classification number: H05K3/3426 ,  H01R4/028 ,  H05K2201/10325 ,  H05K2201/1084 ,  H05K2201/10909 ,  H05K2201/2081 ,  Y02P70/613

Abstract: 供電子模件或相似物用之改良式連接器，此連接器含一外殼，其有一管座開口其大小及形狀適於接納一電子模組，及許多端點裝在外殼上。每一端點有一底部具有一層非焊接材料塗層在底部之一側以防焊錫將該側黏住。當端點安裝在一導體墊上俾焊劑可由細管巢在毛細作用力影響下自具有非焊接材料層之端點之一側流向另一側以形成在另一側上之焊接點時，在底部份之下面管道表面形成一細管巢。在端點之中部四周塗層一非焊接材料環以防止焊劑流向位於環上面之電接觸表面。結果，連接器端點可利用簡單而經濟方式焊接在印刷電路板上而不會形成焊接缺點。

Abstract in simplified Chinese: 供电子模件或相似物用之改良式连接器，此连接器含一外壳，其有一管座开口其大小及形状适于接纳一电子模块，及许多端点装在外壳上。每一端点有一底部具有一层非焊接材料涂层在底部之一侧以防焊锡将该侧黏住。当端点安装在一导体垫上俾焊剂可由细管巢在毛细作用力影响下自具有非焊接材料层之端点之一侧流向另一侧以形成在另一侧上之焊接点时，在底部份之下面管道表面形成一细管巢。在端点之中部四周涂层一非焊接材料环以防止焊剂流向位于环上面之电接触表面。结果，连接器端点可利用简单而经济方式焊接在印刷电路板上而不会形成焊接缺点。

公开(公告)号：EP3207774B1

公开(公告)日：2018-07-04

申请号：EP15756896.5

申请日：2015-08-27

Applicant: Robert Bosch GmbH

Inventor： PEUSER, Thomas

IPC: H05K3/34 ,  H05K1/02 ,  H01G4/232 ,  H01G4/30 ,  H01L23/495

CPC classification number: H01G4/228 ,  H01G4/12 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/258 ,  H01G4/30 ,  H01L23/3735 ,  H01L23/49555 ,  H01L23/49582 ,  H01L23/49811 ,  H01L24/06 ,  H01L29/861 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/0516 ,  H01L2224/06181 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10174 ,  H05K2201/10757 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/613 ,  H01L2924/00

公开(公告)号：EP3262666A1

公开(公告)日：2018-01-03

申请号：EP15816184.4

申请日：2015-12-21

Applicant: Epcos AG

Inventor： KOINI, Markus ,  KONRAD, Jürgen ,  RINNER, Franz ,  PUFF, Markus ,  STADLOBER, Monika ,  KÜGERL, Georg ,  WIPPEL, Thomas

IPC: H01G4/232 ,  H01G4/38 ,  H01G2/06 ,  H05K1/18

CPC classification number: H01G4/38 ,  H01G2/06 ,  H01G4/228 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/248 ,  H01G4/30 ,  H01R43/26 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10757 ,  H05K2201/10818 ,  H05K2201/10909 ,  Y02P70/613

Abstract: The invention relates to an electrical component (1) which comprises a plurality of partial members (2), a base (3) on which said partial members (2) are arranged, and at least one connection contact (4, 5), for electrically connecting the partial members (2), on a carrier (13). The invention also relates to a method for producing an electrical component (1) comprising one or more partial members (2).

公开(公告)号：EP2845456B1

公开(公告)日：2017-11-15

申请号：EP13720315.4

申请日：2013-04-24

Applicant: Robert Bosch GmbH

Inventor： GUYENOT, Michael ,  RATCHEV, Roumen ,  FIX, Andreas

IPC: H05K3/32 ,  H05K3/34

CPC classification number: H05K3/308 ,  H05K3/321 ,  H05K3/3447 ,  H05K2201/10909

公开(公告)号：EP1919031B1

公开(公告)日：2014-10-08

申请号：EP06797002.0

申请日：2006-08-23

Applicant: DDK Ltd.

Inventor： MORIUCHI, Hiroyuki ,  OMORI, Hideo ,  SHIMIZU, Haruki

IPC: H01R4/02 ,  H01R43/16 ,  H05K3/34 ,  H01R13/03

CPC classification number: H05K3/3447 ,  H01R4/028 ,  H01R13/03 ,  H01R43/16 ,  H05K2201/10909 ,  H05K2201/2081 ,  H05K2203/0315 ,  H05K2203/107

公开(公告)号：EP2140963B1

公开(公告)日：2013-12-04

申请号：EP09013006.3

申请日：1998-12-09

Applicant: Renesas Electronics Corporation

Inventor： Shimokawa, Hanae ,  Soga, Tasao ,  Okudaira, Hiroaki ,  Ishida, Toshiharu ,  Nakatsuka, Tetsuya ,  Inaba, Yoshiharu ,  Nishimura, Asao

IPC: B23K1/20 ,  B23K35/26 ,  H05K3/34 ,  H01L23/50 ,  C22C13/02

CPC classification number: H05K1/181 ,  B23K1/0016 ,  B23K35/004 ,  B23K35/007 ,  B23K35/262 ,  B23K2201/40 ,  H01L23/488 ,  H01L23/49811 ,  H01L23/532 ,  H01L24/29 ,  H01L2224/83101 ,  H01L2924/01322 ,  H01L2924/15747 ,  H05K3/3426 ,  H05K3/3463 ,  H05K2201/10909 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T428/12708 ,  Y10T428/12715 ,  H01L2924/00

公开(公告)号：EP1919031A4

公开(公告)日：2012-01-25

申请号：EP06797002

申请日：2006-08-23

Applicant: DDK LTD

Inventor： MORIUCHI HIROYUKI ,  OMORI HIDEO ,  SHIMIZU HARUKI

IPC: H01R4/02 ,  H01R13/03 ,  H01R43/16 ,  H05K3/34

CPC classification number: H05K3/3447 ,  H01R4/028 ,  H01R13/03 ,  H01R43/16 ,  H05K2201/10909 ,  H05K2201/2081 ,  H05K2203/0315 ,  H05K2203/107