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公开(公告)号：KR1020170108023A
公开(公告)日：2017-09-26
申请号：KR1020177021011
申请日：2016-01-26
Applicant: 콘티넨탈 테베스 아게 운트 코. 오하게
CPC classification number: G01D11/245 , B81B2201/02 , G01P1/026 , H01R13/6658 , H01R13/6683 , H01R43/16 , H01R43/24 , G01R29/02
Abstract: 본발명은센서소자 (35) 로부터출력인터페이스 (67) 로물리적변수 (20) 에종속하는전기신호를출력하는상기출력인터페이스 (67) 및상기센서소자 (35) 를갖는센서 (28) 용컴포넌트 (65) 에관한것으로서, 이는센서소자 (35) 로부터전기신호 (42) 를수신하고출력인터페이스 (67) 에전기신호 (42) 를전도하는적어도하나의제 1 신호경로 (70), 및제 1 신호경로 (70) 와는상이하고, 전기신호 (42) 를출력인터페이스 (67) 에전도하는제 2 신호경로 (70) 를갖는회로를포함하고, 제 1 신호경로 (70) 또는제 2 신호경로 (70) 의액티비티는센서 (28) 에서의컴포넌트 (65) 의포지션에의존한다.
Abstract translation: 本发明可应用于诸如输出接口67的组件，用于将取决于物理变量20的电信号从传感器元件35输出到输出接口67以及具有传感器元件35的传感器28的组件 其包括至少一个第一信号路径70，用于接收来自传感器元件35的电信号42并将电信号42传导至输出接口67， （70）与第一信号路径（70）不同并且具有用于将电信号（42）传导到输出接口（67）的第二信号路径（70） 部件28的活动取决于部件65在传感器28中的位置。
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公开(公告)号：KR1020170053550A
公开(公告)日：2017-05-16
申请号：KR1020160019731
申请日：2016-02-19
Applicant: 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드
IPC: B81B7/00 , H01L21/768 , H01L21/56 , H01L21/02
CPC classification number: B81B7/008 , B81B3/0005 , B81B7/0041 , B81B2201/02 , B81B2207/012 , B81C1/00277 , B81C1/00293 , B81C2203/0145 , B81C2203/0172 , B81C2203/019 , B81C2203/0792 , H01L2224/11
Abstract: 반도체구조물이제1 장치, 제2 장치, 제1 홀, 제2 홀, 및밀봉체를포함한다. 제2 장치가제1 장치에접촉되고, 체임버가제1 장치와제2 장치사이에형성된다. 제1 홀이제2 장치내에배치되고제1 원주를가지는제1 단부와제2 원주를가지는제2 단부사이에규정된다. 제2 홀이제2 장치내에배치되고제1 홀에대해서정렬된다. 밀봉체가제2 홀을밀봉한다. 제1 단부가체임버에연결되고, 제1 원주가제2 원주와상이하다.
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公开(公告)号：KR1020160124698A
公开(公告)日：2016-10-28
申请号：KR1020160047752
申请日：2016-04-19
Applicant: 인피니언 테크놀로지스 아게
Inventor： 이브너크리스티안 , 젱크너크리스티안 , 메치니그스테판 , 로마니에르네스토 , 스트라우스니그다이트마르 , 바이스바우어안드레아스
CPC classification number: B81B7/008 , B81B2201/02 , B81B2201/0221 , B81C1/00015 , G01K7/02 , G01L9/12 , G01R27/2605 , H03M3/328 , H03M3/458
Abstract: 일실시예에따르면, 센서회로는시그마-델타아날로그/디지털컨버터(ADC), 시그마-델타 ADC에결합되는디더링클럭, 및시그마-델타 ADC에결합되는전원전압회로를포함한다. 시그마-델타 ADC는저주파트랜스듀서에결합되도록구성되며, 디더링클럭은디더링클럭신호에기초하여시그마-델타 ADC를제어하도록구성된다.
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公开(公告)号：KR1020180029654A
公开(公告)日：2018-03-21
申请号：KR1020160118019
申请日：2016-09-13
Applicant: (주)포인트엔지니어링
CPC classification number: G01N33/0027 , G01N27/04 , G01N27/12 , B81B7/0032 , B81B2201/02
Abstract: 본발명은마이크로센서패키지에관한것으로써, 특히, 센서전극이형성된기판에는다수개의포어가상하방향으로관통되게형성되며, 상기기판의하면에는본딩부가형성되고, 상기센서전극패드아래에있는상기포어의내부에는상기센서전극패드와상기본딩부를전기적으로연결하는연결부가형성되어, 경박단소마이크로센서패키지를제공할수 있고, 내외부에서와이어본딩없이프린트기판(PCB)에실장시킬수 있는마이크로센서패키지에관한것이다.
Abstract translation: 公开了一种微传感器组件。 具体而言，公开了一种微传感器封装，其被配置为使得具有传感器电极的基板形成有多个垂直贯穿其中的孔，基板的下表面形成有接合部分，并且传感器电极焊盘下方的孔设置 其中具有各自的连接部分，所述连接部分电连接传感器电极焊盘和结合部分，由此可以提供轻便，小巧且紧凑的微传感器封装，并且可以将微传感器封装安装到印刷电路板 引线键合。
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公开(公告)号：KR1020090102494A
公开(公告)日：2009-09-30
申请号：KR1020080027970
申请日：2008-03-26
Applicant: (주)켄트
CPC classification number: B81B7/02 , B81B2201/02 , B81B2201/037 , G08C19/00
Abstract: PURPOSE: A prognosis system using MEMS sensors driven by an energy harvester is provided to use vibration energy generated in machine equipment as the driving energy of a sensor or a sensor module. CONSTITUTION: A prognosis system using MEMS sensors driven by an energy harvester comprises a MEMS sensor, a wireless sensor unit(409), an energy harvest and a base station(411). The MEMS sensor unites with objects. The wireless sensor unit receives the sensor signal of the analog type from one or more MEMS sensors and signal-processes the sensor signal and converts the sensor signal into the digital signals. The sensor signal converted into the digital signal is produced as packet data. The produced packet data are wirelessly transmitted to the base station. The energy harvest converts the vibration energy of the objects and supplies driving energy to operate one or more among the MEMS sensors and the wireless sensor unit. The base station receives and synthesizes the packet data. The base station analyzes the synthesized packet data and drives prognosis diagnosis based on the analyzed data and produces the prognosis diagnosis result.
Abstract translation: 目的：提供使用由能量收集器驱动的MEMS传感器的预测系统，以将机器设备中产生的振动能量作为传感器或传感器模块的驱动能量。 构成：使用由能量收集器驱动的MEMS传感器的预测系统包括MEMS传感器，无线传感器单元（409），能量采集和基站（411）。 MEMS传感器与物体相结合。 无线传感器单元从一个或多个MEMS传感器接收模拟类型的传感器信号，并对传感器信号进行信号处理，并将传感器信号转换为数字信号。 转换成数字信号的传感器信号作为分组数据产生。 所生成的分组数据被无线发送到基站。 能量收集转换物体的振动能量并提供驱动能量以在MEMS传感器和无线传感器单元中操作一个或多个。 基站接收并合成分组数据。 基站分析合成分组数据，根据分析数据进行预后诊断，产生预后诊断结果。
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Patent Agency Ranking
公开(公告)号：KR1020030013130A
公开(公告)日：2003-02-14
申请号：KR1020010047464
申请日：2001-08-07
Applicant: 한국과학기술연구원
IPC: B81B7/02
CPC classification number: B81B7/02 , B81B3/0021 , B81B2201/014 , B81B2201/02 , B81B2203/0118 , B81C1/00134 , H01L41/22
Abstract: PURPOSE: A high sensitivity micro cantilever sensor and a method for manufacturing the same are provided to reduce the size of a system by sensing an electric signal and obtain prompt response to sensing. CONSTITUTION: A high sensitivity micro cantilever sensor includes a cantilever, an upper substrate formed of one piezoelectric cell at the upper surface of the cantilever and the other piezoelectric cell at the lower surface of the cantilever, wherein the piezoelectric cells include a piezoelectric film(62) and electrodes(61,63) formed at the upper and lower surfaces of the piezoelectric film, a lower substrate(32) having a cavity(34) in regular depth, wherein the piezoelectric cell lower surface of the upper substrate is adhered to the surface of the lower substrate in which the cavity is formed.
Abstract translation: 目的：提供高灵敏度微悬臂传感器及其制造方法，以通过感测电信号并获得对感测的迅速响应来减小系统的尺寸。 构成：高灵敏度微悬臂传感器包括悬臂，在悬臂的上表面由一个压电单元形成的上基板和在悬臂的下表面处的另一个压电单元，其中压电单元包括压电薄膜（62 ）和形成在压电膜的上表面和下表面的电极（61,63），具有规则深度的空腔（34）的下基板（32），其中上基板的压电单元下表面粘附到 形成空腔的下基板的表面。
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公开(公告)号：KR1020030013129A
公开(公告)日：2003-02-14
申请号：KR1020010047463
申请日：2001-08-07
Applicant: 한국과학기술연구원
IPC: B81B7/02
CPC classification number: B81B7/02 , B81B3/0021 , B81B2201/014 , B81B2201/02 , B81B2203/0118 , B81C1/00134 , H01L41/22
Abstract: PURPOSE: A high sensitivity micro cantilever sensor and a method for manufacturing the same are provided to reduce the size of a system by sensing an electric signal, speed up response rate by executing driving and sensing at the same time, and improve sensing property. CONSTITUTION: A high sensitivity micro cantilever sensor includes a cantilever, an upper substrate formed of one or two piezoelectric cells including a piezoelectric film(36) at the lower surface of the cantilever and electrodes(35,37) formed at the upper and lower surfaces of the piezoelectric film, a lower substrate(32) having a cavity(34) in regular depth, wherein the piezoelectric cell lower surface of the upper substrate is adhered to the surface of the lower substrate in which the cavity is formed.
Abstract translation: 目的：提供高灵敏度微悬臂传感器及其制造方法，以通过感测电信号来减小系统的尺寸，同时通过执行驱动和感测来加快响应速度，并提高感测特性。 构成：高灵敏度微悬臂传感器包括悬臂，由一个或两个压电单元形成的上基板，包括在悬臂的下表面处的压电膜（36）和形成在上表面和下表面的电极（35,37） ，具有规则深度的空腔（34）的下基板（32），其中上基板的压电单元下表面粘附到形成有空腔的下基板的表面。
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158.发明公开
公开(公告)号：KR1020030010980A
公开(公告)日：2003-02-06
申请号：KR1020010045688
申请日：2001-07-28
Applicant: 삼성전자주식회사
IPC: B81C1/00
CPC classification number: B81B7/0083 , B81B2201/02 , B81B2201/031 , B81B2201/05 , B81C1/00047 , B81C1/00063 , B81C1/00071
Abstract: PURPOSE: A structure having a micro channel, and a sensor and heaters directly contacting with fluid inside the micro channel, and a method for manufacturing the same are provided to reliably measure physical characteristics of the fluid flowing in the micro channel in real time. CONSTITUTION: A structure having a micro channel(50) includes a semiconductor substrate(48) having a predetermined length of groove for forming a micro channel, and a glass substrate(40) of which one side is joined with the groove-formed surface of the semiconductor substrate, a sensor(44) directly measuring physical characteristics of fluid flowing in the micro channel, a plurality of local heaters(46) directly heating the fluid at a random position in the micro channel, and a main heater(42) installed at a circumference of the micro channel.
Abstract translation: 目的：提供具有微通道的结构，以及与微通道内的流体直接接触的传感器和加热器及其制造方法，以可靠地测量在微通道中流动的流体的物理特性。 构成：具有微通道（50）的结构包括具有用于形成微通道的预定长度的槽的半导体衬底（48），以及玻璃衬底（40），其一侧与沟槽形成表面 所述半导体衬底，直接测量在所述微通道中流动的流体的物理特性的传感器（44），在所述微通道中的随机位置直接加热所述流体的多个局部加热器（46）以及安装在所述微通道中的主加热器 在微通道的圆周处。
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公开(公告)号：KR1020170129402A
公开(公告)日：2017-11-27
申请号：KR1020160060050
申请日：2016-05-17
Applicant: 한국과학기술원
IPC: B81C1/00
CPC classification number: B81C1/00 , B81C1/00015 , B81B2201/02 , B81C1/00349 , B81C1/00388 , B81C1/00436 , B81C2201/01
Abstract: 본발명은멤스디바이스제조방법및 이에의해제조되는멤스디바이스에관한것으로, 보다상세하게는구조물절연막을이용한보이드패턴의형성후, 희생층을증착함으로써, CMOS 호환성있는공정에의해종래와같은하부전극의박리현상이전혀발생되지않으며, 스핀온 절연막(SOD) 또는스핀온 글래스(SOG)를통한스핀증착에따라하부패턴에영향을받지않으면서평탄화가가능하며, 비아홀의형성시, 클리닝(cleaning) 공정을더 수행하여후속증착공정에서의오염을원천적으로방지할수 있는멤스디바이스제조방법및 이에의해제조되는멤스디바이스에관한것이다.
Abstract translation: 本发明涉及一种制造MEMS器件的方法和由此制造的MEMS器件，并且更具体地涉及一种通过使用结构绝缘膜在形成空隙图案之后沉积牺牲层来制造MEMS器件的方法， 根据通过旋涂绝缘膜（SOD）或旋涂玻璃（SOG）的旋转沉积，可以在不受下层图案影响的情况下进行平坦碳化，在形成通孔时， 本发明涉及一种制造MEMS器件的方法和由此制造的MEMS器件。
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公开(公告)号：KR1020160124697A
公开(公告)日：2016-10-28
申请号：KR1020160047734
申请日：2016-04-19
Applicant: 인피니언 테크놀로지스 아게
CPC classification number: G01L9/125 , G01L9/0072 , B81B7/008 , B81B2201/02 , B81B2201/0221 , B81B2201/0264 , G01K7/02 , G01L9/12 , G01R27/2605 , H03M1/128
Abstract: 측정방법은센서에의해여기신호에응답하여응답신호를생성하는단계를포함한다. 방법은의사무작위지터에따라샘플링클럭신호를생성하는단계와샘플링클럭신호에따라응답신호를샘플링하여복수의디지털샘플을결정하는단계도포함한다. 방법은복수의디지털샘플을결합하여측정샘플을형성하는단계도포함한다.
Abstract translation: 测量方法包括响应于激励信号由传感器产生响应信号。 该方法还包括根据伪随机抖动产生采样时钟信号，并根据采样时钟信号采样响应信号以确定多个数字样本。 该方法还包括组合多个数字样本以形成测量样本。
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