Abstract:
본 발명은 기판(1)과, 박막 영역(10a)을 포함하고 기판(1) 상부에 제공되는 단결정층(10)과, 박막 영역(10a)의 하부에 제공된 중공실(50)과, 둘러싸인 층(10)에 비해 상승된 도핑(n + , p + )을 포함하는 단결정층(10) 내에 제공된 하나 이상의 다공 영역(150, 150')을 포함하는 마이크로 기계식 구성 요소를 제공한다.
Abstract in simplified Chinese:在电容性机电转换器之制造方法中,在基底(4)上形成第一电极(8)、在第一电极(8)上形成具有通至第一电极的开口(6)之绝缘层(9)、以及在绝缘层上形成牺牲层。在牺牲层上形成具有第二电极(1)的隔膜(3),以及,在隔膜中设置孔洞以作为蚀刻剂入口。蚀刻牺牲层以形成穴(10),然后,密封作为蚀刻剂入口的孔洞。以电解蚀刻运行蚀刻,其中,使流电经由开口(6)及隔膜的孔洞而于第一电极(8)与外部配置的对立电极之间流动。
Abstract:
An anodic oxide film structure cutting method is provided. The method includes: an etching step of forming an etched groove by etching one surface of an anodic oxide film having a plurality of anodizing pores along a predetermined cutting line and forming increased-diameter pores by enlarging entrances of the anodizing pores positioned on an inner bottom surface of the etched groove; and a cutting step of cutting the anodic oxide film along the etched groove. Also provided is a unit anodic oxide film structure produced by the cutting method.
Abstract:
Procédé de fabrication d'une structure micromécanique et/ou nanomécanique comportant les étapes à partir d'un élément comportant un substrat support et une couche sacrificielle : a) formation d'une première couche dont au moins une partie est poreuse, b) formation, sur la première couche, d'une couche en un (ou plusieurs) matériau(x) assurant les propriétés mécanique de la structure, dite couche intercalaire, c) formation, sur la couche intercalaire, d'une deuxième couche dont au moins une partie est poreuse, d) formation de ladite structure dans l'empilement de la première couche, de la couche intercalaire et de la deuxième couche, e) libération de ladite structure par retrait au moins partielle de la couche sacrificielle.
Abstract:
A process for forming a porous metal oxide or metalloid oxide material, the process including: - providing an anodic substrate including a metal or metalloid substrate;- providing a cathodic substrate; - contacting the anodic substrate and the cathodic substrate with an acid electrolyte to form an electrochemical cell; - applying an electrical signal to the electrochemical cell;- forming shaped pores in the metal or metalloid substrate by: (c) time varying the applied voltage of the electrical signal to provide a voltage cycle having a minimum voltage period during which a minimum voltage is applied, a maximum voltage period during which a maximum voltage is applied, and a transition period between the minimum voltage period and the maximum voltage period, wherein the voltage is progressively increased from the minimum voltage to the maximum voltage during the transition period, or (d) time varying the current of the electrical signal to provide a current cycle having a minimum current period during which a minimum current is applied, a maximum current period during which a maximum current is applied, and a transition period between the minimum current period and the maximum current period, wherein the voltage is progressively increased from the minimum current to the maximum current during the transition period.
Abstract:
The invention relates to a micromechanical component comprising: a substrate (1); a monocrystalline layer (10), which is provided above the substrate (1) and which has a membrane region (10a); a cavity (50) that is provided underneath the membrane region (10a), and; one or more porous regions (150; 150'), which are provided inside the monocrystalline layer (10) and which have a doping (n ; p ) that is higher than that of the surrounding layer (10).
Abstract translation:本发明涉及一种微机械部件,该微机械部件包括:衬底(1); 设置在所述衬底(1)上方并且具有膜区域(10a)的单晶层(10); 设置在膜区域(10a)下方的空腔(50),以及; 设置在单晶层(10)内并且具有比周围层(10)高的掺杂(n +; p +)的一个或多个多孔区域(150; 150'), 。
Abstract:
The invention relates to the production of a micromechanical component, comprising a substrate (10), made from a substrate material with a first doping type (p), a micromechanical functional structure arranged in the substrate (10) and a cover layer for the at least partial covering of the micromechanical functional structure. The micromechanical functional structure comprises regions (15; 15a; 15b; 15c; 730; 740; 830) made from the substrate material with a second doping type (n), at least partially surrounded by a cavity (50; 50a-f) and the cover layer comprises a porous layer (30) made from the substrate material.
Abstract:
A microelectromechanical structure is formed by depositing sacrificial and structural material over a substrate to form a structural layer on a component electrically attached with the substrate (step 102). The galvanic potential of the structural layer is greater than the galvanic potential of the component. At least a portion of the structural material is covered with a protective material that has a galvanic potential less than or equal to the galvanic potential of the component (step 104 or 106). The sacrificial material is removed with a release solution (step 108 or 110). At least one of the protective material and release solution is surfactanated, the surfactant functionalizing a surface of the component.