公开(公告)号：KR1020010042034A

公开(公告)日：2001-05-25

申请号：KR1020007010372

申请日：1999-03-19

Applicant: 알스트롬 글래스파이버 오와이

Inventor： 록맨,카이 ,  사벨,하칸

IPC: D04H1/4334 ,  D04H1/58

CPC classification number: B29C70/12 ,  B29K2105/128 ,  B29L2031/3425 ,  D21H13/26 ,  D21H17/36 ,  D21H17/52 ,  H05K1/0366 ,  H05K3/022 ,  H05K2201/0278 ,  H05K2201/0293

Abstract: 적어도 10중량%의아라미드섬유와잔량의비도전성의섬유, 필러및 바인더로구성되는적어도한 층의부직시이트나웨브층으로인쇄회로기판을제조한다. 이시이트나웨브는바람직하게는발포처리에의해만들어지며, 사용되는아라미드섬유의적어도약 10%(예를들어, 약 60%)는종래의직선형아라미드섬유와비교하여많은이점을갖는아라미드펄프섬유이다. 이웨브나시이트는바람직하게는약 0.1∼0.2g/cm의밀도를갖도록압축되며, 이웨브나시이트는약 20∼120g/m의칭량을갖는다. 이웨브는또한 PVA 또는에폭시수지등의비도전성의바인더를가질수 있다. 이부직웨브나시이트를사용하여만든인쇄회로기판은프리프레그, 도전성회로요소및 전자부품처럼다른점에서는종래와같다.

公开(公告)号：KR1020010032871A

公开(公告)日：2001-04-25

申请号：KR1020007006201

申请日：1998-12-01

Applicant: 니토 보세키 가부시기가이샤

Inventor： 곤노미찌오 ,  미우라야스시 ,  사이또쇼이찌 ,  가사이신

IPC: D04H1/4218 ,  D04H1/58 ,  C03B37/01 ,  C03B37/08

CPC classification number: H05K1/0366 ,  C03B37/083 ,  D04H1/4218 ,  D04H1/4226 ,  D04H1/4382 ,  D04H1/4391 ,  D04H3/00 ,  H05K2201/0293 ,  H05K2201/0296 ,  Y02P40/57

Abstract: 부직포는단면이평탄한유리섬유이고 2.0 내지 10 의평탄율을가지며패킹율이적어도 85% 바람직하게는적어도 90% 인단면을가지는고 평탄유리섬유로이루어진다. 이부직포에서, 유리섬유단면은직사각형에가까운형상을가지며, 따라서, 유리섬유는고 부피밀도를가진얇은부직포를형성하기위하여매우조밀하게배치되며, 적층판재료로서사용되는경우, 유리섬유용량은증가될수 있고, 동시에표면평탄율은높아지고인쇄배선기판용강화수지로서충분히사용될수 있다. 또한, 상기유리섬유는, 예를들면, 평탄노즐홀을가지는노즐칩의장축벽을한 측면이부분적으로노치된형상을가진노즐을사용하여제조될수 있다.

公开(公告)号：KR1020010015861A

公开(公告)日：2001-02-26

申请号：KR1020007005978

申请日：1998-11-27

Applicant: 폴리에이탄 콤포지트스 리미티드

Inventor： 코헨,야친 ,  레인,디미트리 ,  바이크한스키,레브

IPC: B32B27/00 ,  B32B27/32

CPC classification number: H05K1/0366 ,  B32B27/02 ,  C08J5/04 ,  H05K1/028 ,  H05K1/032 ,  H05K1/0393 ,  H05K2201/0129 ,  H05K2201/0158 ,  H05K2201/0278 ,  H05K2201/0287 ,  H05K2201/0293 ,  H05K2203/1105 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/249941 ,  Y10T428/249942 ,  Y10T428/31681 ,  Y10T442/3415 ,  Y10T442/656

Abstract: 본발명은인쇄회로판또는안테나기재에서사용하기위한초고분자량폴리에틸렌(UHMWPE) 복합체(12)에관한것이다. 기재는초고분자량폴리에틸렌복합체(12)로구성되는하나이상의유전층및 전기전도성물질로구성되는하나이상의전기전도층(16)을포함하며; 상기유전층과전기전도층은서로친밀하게결합된다.

Abstract translation: 本发明涉及用于印刷电路板或天线基底的超高分子量聚乙烯（UHMWPE）复合材料（12）。 该基材包括至少一个由超高分子量聚乙烯复合材料（12）组成的介电层和至少一个由导电材料组成的导电层（16） 介电层和导电层彼此紧密结合。

公开(公告)号：KR100228946B1

公开(公告)日：1999-11-01

申请号：KR1019960030350

申请日：1996-07-25

Applicant: 인터내셔널 비지네스 머신즈 코포레이션

Inventor： 알리아프잘리-아다카니 ,  겔롬제프레이디 ,  코스바로라엘

IPC: C08L97/00 ,  C08L101/00

CPC classification number: C08H6/00 ,  C08L97/005 ,  H05K1/0313 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/178

Abstract: 본 발명은 가교결합된 생물계 조성물, 이 조성물의 제조방법 및 이 조성물을 사용한 구조물, 특히 생물계 인쇄 배선판 및 이 구조물의 제작방법에 관한 것이다. 리그닌, 곡유, 목질 수지, 탄닌 및 다당류 및 그의 결합물과 같은 생물계 물질은 바람직하게는 열, 가교제 및 개시제에 의해 가교결합된다. 제조된 물질은 섬유 유리 또는 생물계 직물에 생물계 물질, 가교제 및 개시제의 혼합물을 침투시킨 후 통상적인 방법으로 가공처리하여 인쇄 배선판을 제작함으로써 인쇄 배선판에 적당한 특성을 갖는다.

公开(公告)号：US20240341032A1

公开(公告)日：2024-10-10

申请号：US18130768

申请日：2023-04-04

Applicant: AVISHTECH, INC.

Inventor： Tarun Amla ,  Keshav Amla ,  Jyoti Amla

IPC: H05K1/03

CPC classification number: H05K1/0366 ,  H05K2201/0293 ,  H05K2201/068

Abstract: Dielectric materials including non-woven inorganic fabrics impregnated with a low-density resin are disclosed. The dielectric materials may have a thickness in a range of about 5 to about 125 microns for use in printed circuit boards.

公开(公告)号：US20180255636A1

公开(公告)日：2018-09-06

申请号：US15758527

申请日：2016-09-23

Applicant: AMOGREENTECH CO., LTD.

Inventor： In Yong SEO

IPC: H05K1/03 ,  H05K3/12 ,  D04H1/728

CPC classification number: H05K1/038 ,  A41D1/002 ,  D04H1/728 ,  D10B2401/18 ,  D10B2403/02431 ,  G02B27/017 ,  G06F1/163 ,  H05K1/0212 ,  H05K3/12 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/05 ,  H05K2201/10151

Abstract: Provided is a wearable device and a method of manufacturing the same. The wearable device includes: a wearable flexible printed circuit board having a circuit pattern formed on a base substrate having flexibility, air-permeability, and waterproofness; and a functional module mounted on the wearable flexible printed circuit board.

公开(公告)号：US09596765B2

公开(公告)日：2017-03-14

申请号：US14426364

申请日：2012-09-11

Applicant: Akira Yamaki ,  Tatsuya Kikuchi ,  Mitsuaki Toda

Inventor： Akira Yamaki ,  Tatsuya Kikuchi ,  Mitsuaki Toda

IPC: H05K3/30 ,  H05K3/00 ,  H05K1/18 ,  H05K3/46 ,  H01L23/00 ,  C25D7/06 ,  H05K1/09 ,  H05K3/40 ,  H01L23/544 ,  H01L21/683 ,  H05K1/02 ,  H01L21/56

CPC classification number: H05K3/0008 ,  C25D7/0607 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/544 ,  H01L24/19 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L2221/68359 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/04105 ,  H01L2224/2741 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32245 ,  H01L2224/82039 ,  H01L2224/82132 ,  H01L2224/83005 ,  H01L2224/83132 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/0269 ,  H05K1/09 ,  H05K1/185 ,  H05K1/188 ,  H05K3/305 ,  H05K3/4007 ,  H05K3/403 ,  H05K3/4038 ,  H05K3/4602 ,  H05K3/4655 ,  H05K3/4658 ,  H05K3/4661 ,  H05K3/4682 ,  H05K2201/0209 ,  H05K2201/0293 ,  H05K2201/09063 ,  H05K2201/09472 ,  H05K2201/09918 ,  H05K2203/0353 ,  H05K2203/0361 ,  H05K2203/063 ,  H01L2924/00

Abstract: A manufacturing method for a component incorporated substrate according to the present invention includes positioning an electronic component with reference to a mark formed on a copper layer, the mark consisting of a material less easily etched than copper by a copper etching agent used for etching of copper, after mounting the electronic component on the copper layer with an adhesive layer interposed therebetween, embedding the electronic component and the mark in an insulating substrate, thereafter, etching and removing a part of the copper layer to form a window for exposing the mark, forming an LVH reaching a terminal of the electronic component with reference to the exposed mark, electrically connecting the terminal and the copper layer via a conduction via formed by applying copper plating to the LVH, and, thereafter, forming the copper layer into a wiring pattern.

Abstract translation: 根据本发明的用于组件的基片的制造方法包括：根据形成在铜层上的标记来定位电子部件，该标记由铜蚀刻剂（铜蚀刻剂）蚀刻铜不易蚀刻的材料构成 在将电子部件粘附在铜层上之后，将电子部件和标记嵌入绝缘基板后，将铜层的一部分进行蚀刻除去，形成露出标记的窗口，形成 参照曝光标记的LVH到达电子部件的端子，经由通过将电镀施加到LVH而形成的导通孔将端子和铜层电连接，然后将铜层形成布线图案。

公开(公告)号：US09365693B2

公开(公告)日：2016-06-14

申请号：US14129183

申请日：2013-03-15

Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION

Inventor： Takahiro Takano ,  Takahiko Sumino ,  Kentarou Ishihara

IPC: C08K3/00 ,  C08K7/14 ,  C08K3/40 ,  C08L77/06 ,  C23C18/38 ,  C23C18/42 ,  C23C18/32 ,  H05K1/03 ,  C08K3/22 ,  C08K9/02 ,  H05K3/10 ,  F21V7/22 ,  C23C18/16 ,  C23C18/20 ,  C08L101/12

CPC classification number: C08K3/00 ,  C08K3/22 ,  C08K3/2279 ,  C08K3/40 ,  C08K7/14 ,  C08K9/02 ,  C08K2003/2231 ,  C08K2003/2241 ,  C08L23/06 ,  C08L77/06 ,  C08L91/06 ,  C08L101/12 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/32 ,  C23C18/38 ,  C23C18/42 ,  F21V7/22 ,  H05K1/0373 ,  H05K3/105 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0221 ,  H05K2201/0245 ,  H05K2201/0254 ,  H05K2201/0293 ,  H05K2201/0347 ,  H05K2201/09118 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2203/0723 ,  H05K2203/107

Abstract: Provided is a thermoplastic resin composition which is excellent in platability (appearance of plating), and keeps high reflectance even after thermal aging. A thermoplastic resin composition comprising: per (A) 100 parts by weight of a crystalline thermoplastic resin having a melting point, measured by differential scanning calorimetry (DSC) at a heating rate of 10° C./min, of 250° C. or above; (B) 10 to 80 parts by weight of a glass filler; (C) 1 to 30 parts by weight of a laser direct structuring additive having a reflectance at 450 nm of 25% or above; and (D) 20 to 150 parts by weight of titanium oxide.

Abstract translation: 提供一种热塑性树脂组合物，其电镀性（电镀外观）优异，即使在热老化后也保持高反射率。 一种热塑性树脂组合物，其包含：（A）100重量份具有熔点的结晶热塑性树脂，其通过差示扫描量热法（DSC）以10℃/ min的加热速率测定为250℃，或 以上; （B）10〜80重量份玻璃填料; （C）1〜30重量份在450nm以上的反射率为25％以上的激光直接结构化添加剂; 和（D）20〜150重量份的氧化钛。

公开(公告)号：US09352351B2

公开(公告)日：2016-05-31

申请号：US14375680

申请日：2013-01-30

Applicant: STORA ENSO OYJ

Inventor： Petri Sirviö ,  Juha Maijala

IPC: B05D5/12 ,  B05C1/00 ,  B05D3/12 ,  H05K3/10 ,  B05C19/00 ,  B05D1/00 ,  B05D1/28 ,  B05D3/02 ,  B05D3/06 ,  C23C26/02 ,  H05K1/03 ,  H05K3/12

CPC classification number: B05C1/003 ,  B05C19/008 ,  B05D1/007 ,  B05D1/28 ,  B05D3/0263 ,  B05D3/029 ,  B05D3/06 ,  B05D3/12 ,  C23C26/02 ,  H05K1/038 ,  H05K1/0386 ,  H05K3/102 ,  H05K3/1241 ,  H05K3/1266 ,  H05K3/1283 ,  H05K2201/0293 ,  H05K2203/0126 ,  H05K2203/0517 ,  H05K2203/0522 ,  H05K2203/102 ,  H05K2203/1105 ,  H05K2203/1476 ,  H05K2203/1545 ,  H05K2203/1581

Abstract: A method and an arrangement are disclosed for producing an electrically conductive pattern on a surface. Electrically conductive solid particles are transferred onto an area of predetermined form on a surface of a substrate. The electrically conductive solid particles are heated to a temperature that is higher than a characteristic melting point of the electrically conductive solid particles, thus creating a melt. The melt is pressed against the substrate in a nip, wherein a surface temperature of a portion of the nip that comes against the melt is lower than said characteristic melting point.

Abstract translation: 公开了用于在表面上产生导电图案的方法和装置。 将导电固体颗粒转移到基板表面上的预定形式的区域上。 将导电固体颗粒加热到高于导电固体颗粒的特征熔点的温度，从而产生熔体。 熔融物在辊隙中被压靠在基底上，其中一部分辊隙对熔体的表面温度低于所述特征熔点。

公开(公告)号：US20150257263A1

公开(公告)日：2015-09-10

申请号：US14638272

申请日：2015-03-04

Applicant: Rogers Corporation

Inventor： Murali Sethumadhavan ,  Ani Shere ,  Mike White

IPC: H05K1/03 ,  H05K1/02 ,  H01L33/60 ,  H01L25/075 ,  H01L33/48

CPC classification number: H05K1/0366 ,  D21H13/00 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/60 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/0284 ,  H05K1/0373 ,  H05K1/038 ,  H05K2201/0141 ,  H05K2201/0162 ,  H05K2201/0191 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/068 ,  Y10T428/2495 ,  H01L2924/00

Abstract: A dielectric substrate comprises a resin composition impregnated with non-woven fibrous mat material having a thickness of 5 mils (127 micrometers), wherein the fibrous mat material comprises fibers, having a diameter of 1 nm to 10 μm, that have been extruded through one or more openings to produce fibers that have been collected in the form of a fibrous non-woven mat, and wherein the fibers exhibit a multi-directional orientation in the non-woven mat material. The dielectric substrate is useful in circuit materials, circuits, and multi-layer circuits, economical to make, and has excellent electrical and mechanical properties.

Abstract translation: 电介质基材包括浸渍有5密耳（127微米）厚度的无纺纤维垫材料的树脂组合物，其中纤维垫材料包括直径为1nm至10μm的纤维，其已经通过一个挤出 或更多的开口以产生以纤维无纺毡的形式收集的纤维，并且其中所述纤维在所述无纺毡材料中呈现多方向取向。 电介质基片在电路材料，电路和多层电路中是有用的，经济地制造，并具有优良的电气和机械性能。