Abstract:
The invention provides processes for the manufacture of conductive transparent films and electronic or optoelectronic devices comprising same.
Abstract:
Large-area display device, in particular multimedia façade comprising at least one transparent element, in which the transparent element comprises at least one transparent substrate on which one or more lighting elements is/are arranged.
Abstract:
The invention discloses a PCB (100, 400) with first and second main surfaces (110, 130), the PCB also having a first height, h, said two surfaces and height together defining the volume of the PCB. The PCB comprises layers (430, 434, 438) of a first supporting laminate material, layers (440, 431, 433, 435, 437, 439) of a first conducting material and layers (432, 436) of a first prepreg, said first materials and prepreg having respective dielectrical constants and dissipation factors. In the PCB, a sub-volume of the PCB defined by a sub-area (120) within the first main surface and a sub-height (h’) within said first height together comprise a sub-PCB (320) which comprises at least one layer (330, 334) of a second supporting laminate material, said second laminate material differing from the first laminate material with regard to at least one of the factors dielectrical constant and dissipation factor.
Abstract:
Transparent electrical conductors comprising regions of high transparency and regions of lower transparency, but higher conductivity. This allows electrical connection through the conductor, while retaining its transparency for such applications as hand-held device display screens or transparent antennas, for example.
Abstract:
A measuring probe (30) has an analysis substrate support (A) with a woven fabric (1) consisting of metal warp threads (1a) and insulating plastic weft threads (1b) in the woof direction. Some of the mesh apertures are doped with analysis substrates (32-34) which change their electrical resistance on contact with, for example, a liquid to be measured. The metal threads (1a) passing the doped meshes constitute the electrical connection to the outside or to an evaluation circuit (B) which is preferably an integrated circuit.
Abstract:
The invention provides processes for the manufacture of conductive transparent films and electronic or optoelectronic devices comprising same.
Abstract:
An electronic assembly comprises a semiconductor device that has conductive pads on a semiconductor first side and a metallic region on a semiconductor second side opposite the first side. A lead frame provides respective separate terminals that are electrically and mechanically connected to corresponding conductive pads. A first heat sink comprises a first component having a mating side. A portion of the mating side is directly bonded with the metallic region of the semiconductor device. A circuit board has an opening for receiving the semiconductor device. The lead frame extends outward toward the circuit board or a board first side of the circuit board.