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公开(公告)号:CN1636797A
公开(公告)日:2005-07-13
申请号:CN200410104612.1
申请日:2004-12-22
Applicant: 株式会社TANT
IPC: B60Q3/02
CPC classification number: H05K3/202 , B60Q3/74 , B60Q3/80 , H01R9/226 , H05K3/107 , H05K3/4084 , H05K2201/09036 , H05K2201/09045 , H05K2203/1572
Abstract: 用于车内灯的母线基底,包括绝缘基板和多根母线。在绝缘基板的前、后表面中形成有沟槽。多根母线装配到该绝缘基板的沟槽上。
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公开(公告)号:CN1549317A
公开(公告)日:2004-11-24
申请号:CN200410047635.3
申请日:1996-11-08
Applicant: 富士通株式会社
CPC classification number: H01L21/4832 , H01L21/561 , H01L21/565 , H01L21/568 , H01L21/67138 , H01L21/6833 , H01L23/3107 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L24/97 , H01L25/105 , H01L29/0657 , H01L2224/05554 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2224/45015 , H01L2224/45144 , H01L2224/45565 , H01L2224/4569 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48247 , H01L2224/48464 , H01L2224/48465 , H01L2224/48471 , H01L2224/4848 , H01L2224/48599 , H01L2224/49171 , H01L2224/73265 , H01L2224/78301 , H01L2224/7865 , H01L2224/85001 , H01L2224/85051 , H01L2224/85181 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85455 , H01L2224/85664 , H01L2224/85986 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2225/1035 , H01L2225/107 , H01L2225/1094 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10158 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/18165 , H01L2924/3011 , H05K1/181 , H05K3/303 , H05K3/305 , H05K3/3436 , H05K3/3442 , H05K2201/09045 , H05K2201/10727 , H05K2201/10977 , Y02P70/613 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: 一种元件,它包含以下部分:芯片(111);封装芯片的树脂封壳(112,151,314),该树脂封壳的安装面上设有树脂凸部(117,154,318),树脂凸部上设有相应的金属膜(113,155,315)。芯片的电极焊盘与金属膜由连接部分(118,101,163,245,313,343,342)电连接,每个所述树脂凸部都被所述金属膜整体地覆盖。
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公开(公告)号:CN1173614C
公开(公告)日:2004-10-27
申请号:CN98803237.6
申请日:1998-03-03
Applicant: 比利时西门子公司
CPC classification number: H01L21/4846 , H01L21/4853 , H01L2924/15159 , H05K3/0032 , H05K3/0052 , H05K3/027 , H05K3/242 , H05K3/243 , H05K3/28 , H05K2201/09045 , H05K2201/09118 , H05K2203/0571 , H05K2203/107 , H05K2203/135 , H05K2203/175
Abstract: 为了在绝缘的底座(U1)上形成金属的、具有可焊的和/或可键合的连接范围(CA1、LA1)的线路图,首先,金属化覆层被覆到底座上并至少在与所需的线路图交界的范围内重新被去除。然后,把可焊的和/或可键合的终端表面(E)电镀淀积到连接范围(CA1、LA1)上。净化室条件是不需要的。
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公开(公告)号:CN1161010C
公开(公告)日:2004-08-04
申请号:CN99808495.6
申请日:1999-07-01
Applicant: 比利时西门子公司
CPC classification number: H01L21/4846 , B29L2031/3493 , H01L23/13 , H01L23/49811 , H01L24/48 , H01L2224/05599 , H01L2224/29007 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01057 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H01L2924/15159 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H05K1/0284 , H05K3/027 , H05K3/3442 , H05K3/403 , H05K2201/09045 , H05K2201/09118 , H05K2201/09154 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
Abstract: 基片(S1)在至少一个前侧的区域内和/或在空隙的至少一个内壁区域内保持一种倾斜、V形或凸形的轮廓(K1)。在基片(S1)上淀积金属层之后,可以在基片(S1)的上侧(O)及下侧(U)同时对印刷线路(L)进行激光构造,以便在所述的轮廓(K1)区域内形成印刷线路形的互连接(Q)。
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公开(公告)号:CN1096691C
公开(公告)日:2002-12-18
申请号:CN97102912.1
申请日:1997-01-23
Applicant: 船井电机株式会社
Inventor: 前多治
IPC: H01F17/02
CPC classification number: H01F41/10 , H01F27/29 , H05K3/3447 , H05K2201/09045 , H05K2201/10287 , H05K2201/10568 , Y10T29/49142 , Y10T29/49144 , Y10T29/53183
Abstract: 一种要安装到印刷电路板上的线绕元件。在线绕元件体上绕线,并将线的两端绕到引出端上,用模制耐热树脂材料将引出端和线绕元件体构成为一个整体。线的两端绕到模制引出端上,并将引出端插入印刷电路板,然后焊接,使其连接到印刷电路板的电路图形上。
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公开(公告)号:CN1310494A
公开(公告)日:2001-08-29
申请号:CN00137553.9
申请日:2000-12-28
Applicant: ITT制造企业公司
Inventor: 维肯·罗宾·萨吉希安
IPC: H01R12/20
CPC classification number: H05K1/119 , H01R12/716 , H01R13/035 , H01R13/62933 , H05K1/0284 , H05K3/326 , H05K3/368 , H05K3/42 , H05K2201/09045 , H05K2201/1059 , Y10S439/931
Abstract: 一种直角电气连接器(10,66,70),该连接器使用直触片(22,82,98),而不使用弯曲成直角的触片。平绝缘板(30,115)从一连接器体装置(12,77,91)高的部份向后延伸,该连接器体安装在印刷电路板(14,110,110’)。在板底部制出的腿(40,120)安装在印刷电路板(38,124,126)上或印刷电路板的孔中。导电迹线(44,46,43,50,128,134)从连接器体中的触片通道延伸至平板和腿,以保证在设置在通道中的触片和印刷电路板间的电气连接。
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公开(公告)号:CN1152797A
公开(公告)日:1997-06-25
申请号:CN96114520.X
申请日:1996-11-08
Applicant: 富士通株式会社
CPC classification number: H01L21/4832 , H01L21/561 , H01L21/565 , H01L21/568 , H01L21/67138 , H01L21/6833 , H01L23/3107 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L24/97 , H01L25/105 , H01L29/0657 , H01L2224/05554 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2224/45015 , H01L2224/45144 , H01L2224/45565 , H01L2224/4569 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48247 , H01L2224/48464 , H01L2224/48465 , H01L2224/48471 , H01L2224/4848 , H01L2224/48599 , H01L2224/49171 , H01L2224/73265 , H01L2224/78301 , H01L2224/7865 , H01L2224/85001 , H01L2224/85051 , H01L2224/85181 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85455 , H01L2224/85664 , H01L2224/85986 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2225/1035 , H01L2225/107 , H01L2225/1094 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10158 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/18165 , H01L2924/3011 , H05K1/181 , H05K3/303 , H05K3/305 , H05K3/3436 , H05K3/3442 , H05K2201/09045 , H05K2201/10727 , H05K2201/10977 , Y02P70/613 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: 一种元件,它包含以下部分:芯片(111);封装芯片的树脂封壳(112,151,314),该树脂封壳的安装面上设有树脂凸部(117,154,318)。树脂凸部上设有相应的金属膜(113,155,315)。芯片电极焊盘与金属膜由连接部分(118,101,163,245,313,343,342)接通。
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公开(公告)号:CN1026043C
公开(公告)日:1994-09-28
申请号:CN89104446.9
申请日:1989-06-26
Applicant: 克罗内有限公司
CPC classification number: H01R4/2425 , H01R13/03 , H05K1/119 , H05K3/326 , H05K3/403 , H05K2201/09045 , H05K2201/09081 , H05K2201/09118 , H05K2201/09181 , H05K2201/09827 , H05K2201/10287 , H05K2201/1059 , Y10S439/931
Abstract: 导线(2)用的特别是电信系统中电缆导线用的一种接触件,该接触件包括两个具有接触槽(3、23、38)的导电接触部分(4、14、24)。为简化包括各接触件的部件的制造和组装并降低其成本,用缘绝材料制成各接触部分(4、14、24)且将其表面(6、16、32、47、52)加以金属化。
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公开(公告)号:WO2017185119A3
公开(公告)日:2018-01-18
申请号:PCT/AT2017060110
申请日:2017-04-27
Applicant: PROFACTOR GMBH
Inventor: FISCHINGER THOMAS , LEDERER THOMAS , FUCHSBAUER ANITA
IPC: H05K3/38 , C23C4/01 , C23C4/08 , C23C14/04 , H01L21/033 , H05K1/02 , H05K3/00 , H05K3/02 , H05K3/06 , H05K3/14 , H05K3/16
CPC classification number: H05K3/386 , C23C4/01 , C23C4/08 , C23C4/134 , H01L21/0331 , H05K1/0284 , H05K3/0014 , H05K3/0085 , H05K3/0091 , H05K3/022 , H05K3/06 , H05K3/143 , H05K3/146 , H05K3/16 , H05K2201/0385 , H05K2201/09045 , H05K2201/09845 , H05K2203/013 , H05K2203/054 , H05K2203/0551 , H05K2203/0571 , H05K2203/0769
Abstract: The invention relates to a method and device for applying a cover material (13) to a selected target area of a support surface (6), wherein the support surface (6) comprises the target area which is to be covered and areas which remain free of the cover material. According to the invention, the device comprises a print unit (3) for a flowable and hardenable support material for producing a support (6) and/or a support structure (16) on the support (6), in addition to a masking unit (4) for producing a covering (12), layer by layer, consisting of a plurality of layers (S) of an auxiliary material (9) on the remaining areas, a cover unit (5) for forming a flow of particles (10) containing the cover material (13) and oriented counter to the support surface (6), a removal unit (15) for removing the auxiliary material (9) whilst leaving the support material and the cover material (13) and a transport unit (8) for transporting the support (6) from the print unit (3) to the masking unit (4), the coating unit (5) and the removal unit (15).
Abstract translation: 用于在支承件(6)的表面的选定目标区域施加涂层材料(13),其特征在于,包含所述对象区域的载体(6)的表面被涂布和涂层材料的剩余自由空间方法和装置。 在这种情况下,掩蔽单元(4),本发明提出用于支持体(6)和/或支撑结构(16)上的支撑件的制造的可流动和可硬化芯部材料的打印机单元(3)(6)被提供,对于一个层状结构 盖(12)包括一个辅助物质的几个层(S)的设置在其余的区域(9),和(5),用于抵靠支撑的表面上形成(6)定向的涂层单元,以及含有该颗粒流的涂覆材料(13)(10) 和移除单元(15)用于除去(9),同时留下所述载体材料和涂层材料(13)的辅助物质,其中用于从所述打印单元(3)输送用于掩蔽单元的支承件(6)的输送单元(8)(4) 设置涂层单元(5)和去除单元(15)。
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160.SHEET-SHAPED STRETCHABLE STRUCTURE, AND RESIN COMPOSITION FOR STRETCHABLE RESIN SHEET AND STRETCHABLE RESIN SHEET USED FOR THE STRUCTURE 审中-公开
Title translation: 用于结构的可拉伸树脂片和可拉伸树脂片的树脂组合物的形状可拉伸结构和树脂组合物公开(公告)号:WO2016084345A1
公开(公告)日:2016-06-02
申请号:PCT/JP2015/005759
申请日:2015-11-18
Inventor: ABE, Takatoshi , SAWADA, Tomoaki , YOSHIOKA, Shingo
IPC: H05K1/02
CPC classification number: H05K1/0393 , C09J171/00 , H05K1/028 , H05K1/0283 , H05K1/0373 , H05K1/189 , H05K3/0014 , H05K2201/0108 , H05K2201/0195 , H05K2201/0215 , H05K2201/0245 , H05K2201/0272 , H05K2201/0278 , H05K2201/0281 , H05K2201/09036 , H05K2201/09045 , H05K2201/10106 , H05K2201/10128
Abstract: A sheet-shaped stretchable structure used as an electronics element has a stretch of not less than 10% and includes a plurality of laminated stretchable resin sheet, and at least one hollow is provided between at least one of pairs of two adjacent ones of the laminated stretchable resin sheets.
Abstract translation: 用作电子元件的片状可拉伸结构具有不小于10%的拉伸度,并且包括多个层叠的可拉伸树脂片,并且至少一个中空部分设置在层叠的两个相邻层中的至少一对之间 可拉伸树脂片。
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